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YS/T 812-2012: Oxygen free copper bar and wire for vacuum electron devices
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| YS/T 812-2012 | English | 319 |
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Oxygen free copper bar and wire for vacuum electron devices
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YS/T 812-2012
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Basic data | Standard ID | YS/T 812-2012 (YS/T812-2012) | | Description (Translated English) | Oxygen free copper bar and wire for vacuum electron devices | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H62 | | Classification of International Standard | 77.150.30 | | Word Count Estimation | 12,170 | | Quoted Standard | GB/T 228.1-2010; GB/T 231.1; GB/T 351; GB/T 4909.4; GB/T 5121.10; GB/T 5121.11; GB/T 5121.1; GB/T 5121.12; GB/T 5121.13; GB/T 5121.14; GB/T 5121.15; GB/T 5121.16; GB/T 5121.17; GB/T 5121.18; GB/T 5121.19; GB/T 5121.20; GB/T 5121.21; GB/T 5121.2; GB/T 5121 | | Adopted Standard | JIS H3510-2006, MOD | | Regulation (derived from) | Ministry of Industry and Information Technology Bulletin No. 55 of 2012; industry standard filing Notice 2013 No. 1 (No. 157 overall) | | Issuing agency(ies) | Ministry of Industry and Information Technology | | Summary | This standard specifies the vacuum device with oxygen-free copper rod and wire requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality certificates and contracts (or orders) content. This standard applies to the | YS/T 812-2012: Oxygen free copper bar and wire for vacuum electron devices---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Oxygen free copper bar and wire for vacuum electron devices
ICS 77.150.30
H62
People's Republic of China Nonferrous Metals Industry Standard
Vacuum devices with oxygen-free copper rod and wire
Issued on. 2012-11-07
2013-03-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
The revised standard Japanese JISH3510-2006 "electron tubes oxygen-free copper plate, strip, seamless pipe, rod and line" technique rod line portion
Requirements, referring to the United States ASTMF68-2010 "electronic device with oxygen-free copper processing materials" were developed, in part stricter than JISH3510-2006.
Compared with JISH3510-2006 major differences are.
--- The standard varieties of oxygen-free copper rod and wire, JISH3510-2006 varieties of oxygen-free copper plate, strip, seamless tube, rod and wire;
--- The standard TU00 for the domestic brands, identical JISH3510-2006 the C1011 component;
--- The standard adds TU0, TU1 grade;
--- The standard adds TU0, TU1 rod or wire performance requirements;
--- The standard size in the range of extruded rod 6mm ~ 120mm, JISH3510-2006 of 6mm ~ 75mm;
--- The standard size range of drawn rods 5mm ~ 80mm, JISH3510-2006 of 6mm ~ 75mm;
--- The standard wire size range 0.05mm ~ 6mm; JISH3510-2006 is 0.25mm ~ 6mm;
--- The standard bar and wire diameter tolerance grade, and adds more stringent than JISH3510-2006 higher level in diameter to allow partial
Poor requirements;
--- The standard adds roundness round bar requirements;
--- The standard adds hexagonal, square and rectangular bars rounded, twisting degree requirements;
--- The standard extruded rod end face of increased cut slope requirements;
--- The standard Brinell hardness increases bars;
--- The standard test requirements increase the torsional wire.
This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) centralized.
This standard was drafted. Chinalco Luoyang Copper Co., Jiangxi Copper Tube Co., Ltd. with sincerity.
The main drafters of this standard. Zhao Wanhua, thunderstorm, Wang Sheng, Yang Haili, Zheng Xiaofei, Lu Yan, Wen positive Zhangzhen Bin.
Vacuum devices with oxygen-free copper rod and wire
1 Scope
This standard specifies the power vacuum devices with oxygen-free copper wire rod requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality
The amount of the certificate and contract (or purchase order) content.
This standard applies to the industrial sector for electronic vacuum devices with oxygen-free copper rod and wire.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
RT Test Method. Test Part 1 GB/T 228.1-2010 metal material tensile
GB/T 231.1 metallic materials Brinell hardness test - Part 1. Test methods
GB/T 351 metal material resistivity measurement method
GB/T 4909.4 Test methods for bare wires - Part 4. torsion test
GB/T 5121 (all parts) of copper and copper alloys -
GB/T 5231 Wrought copper and copper alloy chemical composition and shape of the product
GB/T 8888 heavy non-ferrous metal processing products, packaging, labeling, transportation and storage
GB/T 23606 copper embrittlement test methods
GB/T 26303.2 copper and copper alloy processing material Dimensions detection methods - Part 2. rods, wire, profiles
YS/T 335 oxygen free copper metallurgical test methods
YS/T 336 copper, nickel and alloy pipe and bar fracture test
YS/T 478 copper and copper alloy conductivity eddy current testing method
YS/T 482 copper and copper alloy analysis photoemission spectroscopy
3 Requirements
3.1 Categories
3.1.1 grade, status and specifications
Wire rod grades, status and specifications shall comply with the requirements of Table 1.
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