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YS/T 747-2010 English PDF

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YS/T 747-2010: Lead-free tin-based solder
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YS/T 747-2010English319 Add to Cart 3 days [Need to translate] Lead-free tin-based solder   YS/T 747-2010

PDF similar to YS/T 747-2010


Standard similar to YS/T 747-2010

GB/T 469   GB/T 728   YS/T 649   YS/T 673   YS/T 862   YS/T 310   

Basic data

Standard ID YS/T 747-2010 (YS/T747-2010)
Description (Translated English) Lead-free tin-based solder
Sector / Industry Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard H62
Classification of International Standard 77.120.60
Word Count Estimation 9,932
Date of Issue 2010-11-22
Date of Implementation 2011-03-01
Quoted Standard GB/T 728; GB/T 8170; YS/T 746.1-2010; YS/T 746.2-2010; YS/T 746.3-2010; YS/T 746.4-2010; YS/T 746.5-2010; YS/T 746.6- 2010; YS/T 746.7-2010; YS/T 746.8-2010; YS/T 746.9-2010; YS/T 746.10-2010; YS/T 746.11-2010; YS/T 746.12-2010; YS/T 746.13-2010; YS/T 746.14-2010; YS/T 746.15-2010; YS/T 746.16-2010
Adopted Standard ASTM B32-2008; EN 29453-1994; JIS Z3282-2006; ISO 9453-2006
Regulation (derived from) MIIT (2010) No. 126
Issuing agency(ies) Ministry of Industry and Information Technology
Summary This standard specifies the products based solder lead-free solder requirements, test methods, inspection rules, packaging, labeling, storage and transportation, the contract (or orders) requirements and so on. This standard applies to metallic tin as the main ingredients, do not add flux, by adding different components of zinc, copper, antimony, silver, bismuth, nickel, indium and other preparation, made by casting or machining alloy solder.

YS/T 747-2010: Lead-free tin-based solder

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Lead-free tin-based solder ICS 77.120.60 H62 People's Republic of China Nonferrous Metals Industry Standard Lead-free tin-based solders Issued on. 2010-11-22 2011-03-01 implementation Ministry of Industry and Information Technology of the People's Republic of China released

Foreword

This standard is in accordance with GB/T 1.1-2009 given rules drafted. This standard is part of the grade, chemical composition to the American Standard ASTM B32.2008 "metal solder standards," the EU standards EN29453.1994 "soft solder alloy chemical composition, composition", Japanese standard JISZ3282.2006 "solder chemical composition and form", Country International Standard ISO 9453.2006 "solder chemical composition and forms" developed. This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) centralized. This standard is drafted by. Yunnan Tin Group (Holdings) Co., Ltd. The main drafters of this standard. white Jian, Cao Jing, Litian Min, Liu rights, Li Shuxiang, Liuqing Fu, Cyrus East, Zhao Junfeng. Lead-free tin-based solders

1 Scope

This standard specifies the lead-free tin-based solder product requirements, test methods, inspection rules, packaging, labeling, storage and transport, contract (or order Manifest) requirements and so on. This standard applies to metallic tin as a main component, do not add flux, according to the different components are added zinc, copper, antimony, silver, bismuth, nickel, indium and other preparation, Processed by casting or machine made of solder alloy.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the edition used in this article Member. For undated references, the latest edition (including any amendments) applies to this standard. GB/T 728 tin ingots GB/T 8170 repair value expressed about the rules and limit values and judgment YS/T 746 (all parts) lead-free tin-based solders chemical analysis

3 Definitions and Terminology

The following definitions, the term applicable to this standard. 3.1 Alloy aloy Two or more elements of solid material having metallic properties. 3.2 It refers to the main points of tin metal, lead content of not more than 0.05% (by mass) of the solder.

4 Requirements

4.1 Categories Based solder lead-free solder alloy according to the principal component is divided into three series, namely. the binary system products, product ternary, quaternary products. Grades (Alloy composition) in accordance with the composition of the alloy and content division, grade (alloy composition) shown in Table 2, Table 3, Table 4. 4.2 Chemical composition Shall conform to the chemical composition of Table 2, Table 3, Table 4 stipulations, if the special requirements determined by the supply and demand sides negotiated. 4.3 appearance requirements Product shape can be ingots, bars, wire, ball shape, surface should be clean, with a metallic luster, no slag, no oil and foreign inclusions, Section no stratification.

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