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YS/T 335-2009: Metallographic determination methods of oxygen content in oxygen-free copper
Status: Valid YS/T 335: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| YS/T 335-2009 | English | 189 |
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Metallographic determination methods of oxygen content in oxygen-free copper
| Valid |
YS/T 335-2009
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| YS/T 335-1994 | English | 199 |
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(Vacuum devices with oxygen-free copper oxygen level metallurgical test method)
| Obsolete |
YS/T 335-1994
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PDF similar to YS/T 335-2009
Basic data | Standard ID | YS/T 335-2009 (YS/T335-2009) | | Description (Translated English) | Metallographic determination methods of oxygen content in oxygen-free copper | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H13;H24 | | Classification of International Standard | 77.040.99 | | Word Count Estimation | 7,723 | | Date of Issue | 2009-12-04 | | Date of Implementation | 2010-06-01 | | Older Standard (superseded by this standard) | YS/T 335-1994 | | Regulation (derived from) | MIIT [2009] No. 66 | | Issuing agency(ies) | Ministry of Industry and Information Technology | | Summary | This standard specifies: OFC oxygen metallurgical testing principles, equipment, samples and sample preparation, testing procedures and requirements and test reports. This standard applies to OFC oxygen rank test. | YS/T 335-2009: Metallographic determination methods of oxygen content in oxygen-free copper---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Metallographic determination methods of oxygen content in oxygen-free copper
ICS 77.040.99
H13
People's Republic of China Nonferrous Metals Industry Standard
Replacing YS/T 335-1994
Oxygen free copper metallurgical test methods
Posted 2009-12-04
2010-06-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
Instead of the standard YS/T 335-1994 "power vacuum devices with oxygen free copper metallurgical test method."
Compared with this standard YS/T 335-1994, individual provisions of the original standard was appropriate to supplement and improve, while increasing the "Fan
Wai "," terms "," equipment "," test report "and other sections.
Appendix A of this standard is a normative appendix.
This standard by the National Standardization Technical Committee of non-ferrous metals and centralized.
This standard was drafted. aluminum Shenyang Nonferrous Metals Processing Co., Ltd.
The main drafters of this standard. Zhao Jun, Li Yamin, Hao Zhang, Wang Li, Duxiang Wei.
This standard replaces the standards previously issued as follows.
--- YB731-1970;
--- YS/T 335-1994.
Oxygen free copper metallurgical test methods
1 Scope
This standard specifies the metallographic examination of the principle of free copper oxygen, equipment, and preparation of test samples, test procedures and test requirements and
report.
This standard applies to the oxygen content of the oxygen-rank test.
2 principle of the method
The prepared samples in an atmosphere containing hydrogen is heated and cooled under the conditions of the sample is not in contact with the air, based on copper oxide copper
Reductive reaction of hydrogen with the grain boundary cracks or cracking characteristics, observed by optical microscope, depending on the cracks or crack the case to determine its oxygen content
grade.
3 Equipment
3.1 electrolytic polishing equipment and mechanical polishing equipment.
3.2 hydrogen annealing apparatus.
3.3 drying equipment.
3.4 microscope.
4 Sample and sample preparation
4.1 the number of samples specified in the relevant product technical standards.
Size 4.2 test specimen surface is generally 10mm × (10mm ~ 15mm), or flexible sample depending on the circumstances.
4.3 pairs fine wire, oxygen-free copper block can be used to make brackets around it.
Preparation of electrolytic polishing or mechanical polishing may be 4.4 sample. If doubt vary, subject to electrolytic polishing.
Fast electrolytic polishing Recommended.
--- Electrolyte. phosphoric acid (3 + 4).
--- Voltage (no load). 25V.
--- Current density. about 4A/cm2 (a little contact with the sample surface with the electrolyte).
--- Polishing time. 10s ~ 25s.
--- Cathode material. copper plate.
5 Test methods and requirements
5.1 The sample was rough, polished after fine grinding, grinding to bright surface without trace.
After drying the sample water after polishing 5.2 full flush, the drying process of the sample temperature should be below 50 ℃.
After drying the sample 5.3 containing at least 10% hydrogen (by volume) atmosphere heated to 820 ℃ ~ 850 ℃ insulation 20min, samples
Under cooling conditions are not in contact with air.
5.4 samples cooled to room temperature, remove the inspection directly under a microscope at 200X magnification bright field.
5.5 Atlas oxygen in accordance with Appendix A 1 ~ 5 standard, determined oxygen levels. Oxygen permeability of the edge cases, by both parties Association
Suppliers for processing.
6 Test report
The test report shall include the following.
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