YS/T 28: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| YS/T 28-2024 | English | RFQ |
ASK
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3 days [Need to translate]
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(Wafer packaging and marking)
| Valid |
YS/T 28-2024
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| YS/T 28-2015 | English | 319 |
Add to Cart
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3 days [Need to translate]
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Package of silicon wafers
| Obsolete |
YS/T 28-2015
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| YS/T 28-1992 | English | 199 |
Add to Cart
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2 days [Need to translate]
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Silicon wafer packaging
| Obsolete |
YS/T 28-1992
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Basic data | Standard ID | YS/T 28-2024 (YS/T28-2024) | | Description (Translated English) | (Wafer packaging and marking) | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H80 | | Classification of International Standard | 29.045 | | Date of Issue | 2024-10-24 | | Date of Implementation | 2025-05-01 | | Older Standard (superseded by this standard) | YS/T 28-2015 | | Issuing agency(ies) | Ministry of Industry and Information Technology | | Summary | This standard specifies the packaging, marking, transportation and storage of silicon wafers. This standard applies to silicon single crystal polished wafers, silicon epitaxial wafers, SOI silicon wafers, silicon single crystal etching wafers, silicon single crystal grinding wafers, and silicon wafers for solar cells. Other wafers can be used as a reference. | YS/T 28-2015: Package of silicon wafers---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Package of silicon wafers
ICS 29.045
H80
People's Republic of China Nonferrous Metals Industry Standard
Replacing YS/T 28-1992
Wafer packaging
2015-04-30 released
2015-10-01 implementation
Issued by the Ministry of Industry and Information Technology of the People's Republic of China
Foreword
This standard is drafted in accordance with the rules given in GB/T 1.1-2009.
This standard replaces YS/T 28-1992 "wafer packaging".
The main changes in this standard compared with YS/T 28-1992 are as follows.
--- to expand the scope of the standard, an increase of silicon polishing film packaging and solar cell packaging with silicon;
- Added normative references to documents, terms and definitions;
--- increase the packaging of interference factors.
This standard is proposed by the National Committee for Standardization of Nonferrous Metals (SAC/TC243).
The drafting of this standard unit. Hangzhou Heiner Semiconductor Co., Ltd., a new research materials Co., Ltd., Nanjing Guosheng Electronics Co., Ltd., Jiang
Su Xixin Silicon Materials Technology Development Co., Ltd., Zhejiang Province, silicon material quality inspection center, Dongguan City Huayuan Optoelectronics Technology Co., Ltd.
The main drafters of this standard. Wang Feiyao, Sun Yan, Ma Linbao, Xia Genping, Lin Qingxiang, Lou Chunlan, Wang Zhitong.
This standard replaced the previous version of the standard release.
YS/T 28-1992.
Wafer packaging
1 Scope
This standard specifies the packaging of wafers.
This standard applies to silicon single crystal polishing film, epitaxial wafers, SOI and other silicon wafer clean packaging, silicon single crystal grinding film (referred to as silicon grinding film) packaging
And solar cells with silicon packaging, so that in the transport, storage process to avoid contamination and broken again.
2 normative reference documents
The following documents are indispensable for the application of this document. For dated references, only the dated edition applies to this article
Pieces. For undated references, the latest edition (including all modifications) applies to this document.
GB/T 12964 silicon single crystal polishing sheet
GB/T 12965 silicon single crystal cutting disc and grinding plate
GB/T 14139 silicon epitaxial wafers
GB/T 14264 terminology for semiconductor materials
GB/T 26071 silicon single crystal cutting sheet for solar cells
GB/T 29055 Polycrystalline silicon wafers for solar cells
GB/T 29506 300mm silicon single crystal polishing sheet
Code for design of clean building of GB 50073
3 terms and definitions
GB/T 14264 The definitions and definitions of the following terms and definitions apply to this document.
3.1
Clean packaging
With a special transport cassette on the polishing film, epitaxial wafers, SOI and other wafers to be packaged in the transport, storage process to avoid particles, gold
And organic matter on the wafer in the chip stains.
3.2
Combination tape seamtape
Adhesive tape for sealing the interface between the seat and the cover of the wafer cassette.
3.3
Filmbox waferbox
A closed container consisting of a cartridge holder and a lid, with a chip basket loaded with wafers to form a set of wafer cassettes. Used for
Storage and transport of wafers.
3.4
Inner bag innerwrap
The inner bag of the package is specially packed with a clean plastic bag.
3.5
Outer bag outerwrap
The outer bag of the package for the package which has been enclosed in the package is usually coated with a moisture-proof and anti-static aluminum foil bag.
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