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YS/T 1039-2015: Rolled copper foil for flexible printed circuit board
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| YS/T 1039-2015 | English | 389 |
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Rolled copper foil for flexible printed circuit board
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YS/T 1039-2015
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Basic data | Standard ID | YS/T 1039-2015 (YS/T1039-2015) | | Description (Translated English) | Rolled copper foil for flexible printed circuit board | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H62 | | Classification of International Standard | 77.150.30 | | Word Count Estimation | 11,193 | | Date of Issue | 2015-04-30 | | Date of Implementation | 2015-10-01 | | Quoted Standard | GB/T 2036-1994; GB/T 5121.1; GB/T 5121.2; GB/T 5121.3; GB/T 5121.4; GB/T 5121.5; GB/T 5121.6; GB/T 5121.7; GB/T 5121.8; GB/T 5121.9; GB/T 5121.10; GB/T 5121.11; GB/T 5121.12; GB/T 5121.13; GB/T 5121.14; GB/T 5121.15; GB/T 5121.16; GB/T 5121.17; GB/T 5121.18; GB/T 5121.19; GB/T 5121.20; GB/T 5121.21; GB/T 5121.22; GB/T 5121.23; GB/T 5121.24; GB/T 5121.25; GB/T 5121.26; GB/T 5121.27; GB/T 5121.28; GB/T 5121.29; GB/T 5231; GB/T 8888; GB/T 10610; GB/T 26303.3; GB/T 29847-2013 | | Regulation (derived from) | Ministry of Industry and Information Technology Announcement (2015 No. 28) | | Issuing agency(ies) | Ministry of Industry and Information Technology | | Summary | This Standard specifies the rolled copper foil of a flexible printed wiring requirements, test methods, inspection rules, marking, packaging, transportation, storage, quality certificate and purchase order (or contract) content. This Standard applies to the manufacture of flexible printed wiring rolled copper box (hereinafter referred to as copper). | YS/T 1039-2015: Rolled copper foil for flexible printed circuit board---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
(The flexible printed wiring rolled copper)
ICS 77.150.30
H62
People's Republic of China Nonferrous Metals Industry Standard
The flexible printed wiring rolled copper
Issued on. 2015-04-30
2015-10-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) and focal points.
This standard is drafted by. Heze Guangyuan Group Co., Ltd. Shandong days rolled copper foil, non-ferrous metals Technical and Economic Research Institute, aluminum
Shanghai Copper Co., Ltd., Ningbo Xingye Shengtai Group Co., Ltd., the color Obote Cu-Al Industry Co., Ltd.
The main drafters of this standard. in Liansheng, Xuji Ling, Chang Bao-Ping, Zhang Fen, Xue Fangzhong, Raymond Chan, Shao Shengzhong, Zhangmeng Liang, Hu Wenjiang,
Wang Dongxing, C-jun Xu, Gou Wei Juan.
The flexible printed wiring rolled copper
1 Scope
This standard specifies the rolled copper foil flexible printed circuit boards with the requirements, test methods, inspection rules, marking, packaging, transportation, storage, quality
Certificates and the amount of the purchase order (or contract) content.
This standard applies to the manufacture of flexible printed circuit boards with a rolled copper foil (hereinafter referred to as copper).
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 2036-1994 term printed circuits
GB/T 5121 (all parts) of copper and copper alloys -
GB/T 5231 and processing of copper and copper alloy grades and chemical composition
GB/T 8888 heavy non-ferrous metal processing products, packaging, labeling, transportation, storage and quality certificate
GB/T 10610 Geometrical product specifications (GPS) Surface texture Profile method - Rules and procedures for evaluation of the surface structure
GB/T 26303.3 copper and copper alloy processing material Dimensions test methods Part 3. plate and strip
GB/T 29847-2013 Test method for copper foil for printed boards
3 Terms, definitions and symbols
GB/T 2036-1994 and as defined in the following terms, definitions and symbols apply to this document. For ease of use, the following listed repeatedly
The GB/T 2036-1994 some terms and definitions.
3.1
Low temperature annealing rolled copper copperfoilasroled-wrought-lowtemperatureannealable
It can be rolled copper foil in the course of performance reached by the low temperature heat treatment after certain requirements.
3.2
Adhesion enhancement bondenhancingtreatment
Improved adhesion between the metal foil surface is treated with the adjacent layers of material.
[GB/T 2036-1994, the definition 3.2.53]
3.3
Etching etching
Unwanted conductive material by chemical or electrochemical methods to remove the printed pattern formed on a substrate process.
[GB/T 2036-1994, the definition 5.3.19]
3.4
Weldability solderability
Metal surface by molten solder wetting ability.
[GB/T 2036-1994, the definition 6.4.12]
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