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YS/T 1025-2015 English PDF

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YS/T 1025-2015: High-purity tungsten and tungsten alloy sputtering target used in electronic film
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PDF similar to YS/T 1025-2015


Standard similar to YS/T 1025-2015

YS/T 896   GB/T 4325.5   GB/T 3458   YS/T 1018   YS/T 1022   YS/T 1017   

Basic data

Standard ID YS/T 1025-2015 (YS/T1025-2015)
Description (Translated English) High-purity tungsten and tungsten alloy sputtering target used in electronic film
Sector / Industry Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard H63
Classification of International Standard 77.150.99
Word Count Estimation 10,172
Date of Issue 2015-04-30
Date of Implementation 2015-10-01
Quoted Standard GB/T 1031; GB/T 1804; GB/T 3850; GB/T 4324.23; GB/T 4324.25; GB/T 4324.26; GB/T 4324.27; GB/T 6394; GB/T 8651; YS/T 837; YS/T 900; YS/T 901
Regulation (derived from) Ministry of Industry and Information Technology Announcement (2015 No. 28)
Issuing agency(ies) Ministry of Industry and Information Technology
Summary This standard specifies the requirements, test methods, inspection rules and marks, packaging, transportation, storage, order form (contract), etc. of high purity tungsten and tungsten alloy sputtering targets for electronic thin films. This standard applies to electronic thin film with high purity tungsten and tungsten alloy shot target, hereinafter referred to as high-purity tungsten and tungsten alloy target.

YS/T 1025-2015: High-purity tungsten and tungsten alloy sputtering target used in electronic film


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High-purity tungsten and tungsten alloy sputtering target used in electronic film ICS 77.150.99 H63 People's Republic of China Nonferrous Metals Industry Standard Electronic film with high purity tungsten and tungsten alloy sputtering targets Issued on. 2015-04-30 2015-10-01 implementation Ministry of Industry and Information Technology of the People's Republic of China released

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) and focal points. This standard was drafted. Ningbo Jiang Feng Electronic Materials Co., Ltd., there is research billion of new materials Co., Ltd., Beijing Tianlong Tungsten & Molybdenum Technology Co., Ltd., Zhuzhou Kate Industrial Co., Ltd., Xi'an Branch Fang New Material Technology Co., Ltd. The main drafters of this standard. Yao Lijun, Wang Xueze, according to Ding Chong, Zhang Tao, supporting the early Yuan Dynasty, Flaw, Zheng Wenxiang, Sonja, Su Guoping, money Hongbing, Yuan Jie, Wang right, Zhang Yu, Wang Yue, Du railways. Electronic film with high purity tungsten and tungsten alloy sputtering targets

1 Scope

This standard specifies the electronic film with high purity tungsten and tungsten alloy sputtering targets requirements, test methods, inspection rules and signs, packaging, transportation Transport, storage, purchase orders (or contract) and so on. This standard applies to electronic film with high purity tungsten and tungsten alloy sputtering targets, hereinafter referred to as high-purity tungsten and tungsten alloy target.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 1031 Geometrical product specifications (GPS) Surface texture Profile method Surface roughness parameters and their values GB/T 1804 General tolerances Tolerances for linear and angular dimensions without individual tolerance GB/T 3850 compact sintered metal materials and hardmetals - Determination of density GB/T 4324.23 chemical analysis of tungsten - Part 23. Determination of sulfur content of combustion conductance method and frequency combustion infrared absorption method GB/T 4324.25 chemical analysis of tungsten - Part 25. Determination of oxygen pulse heating inert gas fusion - infrared absorption method GB/T 4324.26 chemical analysis of tungsten - Part 26. Determination of nitrogen pulse heating inert gas fusion - thermal conductivity method and Nessler test Agent spectrophotometry GB/T 4324.27 chemical analysis of tungsten - Part 27. Determination of carbon content in the high-frequency combustion infrared absorption method GB/T 6394 Determination of average grain size of metal GB/T 8651 sheet metal plate ultrasonic flaw detection method YS/T 837 sputtering targets - back binding quality ultrasonic inspection Inductively coupled plasma mass spectrometry YS/T 900 high-purity tungsten chemical analysis of trace elements Determination glow YS/T 901 high-purity tungsten chemical analysis of trace impurities in the discharge mass spectrometry

3 Requirements

3.1 Categories 3.1.1 According to shape into round, rectangular and shaped (such as triangles, etc.). 3.1.2 target backplane copper and copper alloy or aluminum and aluminum alloys. 3.1.3 Depending on the alloy material, divided into pure tungsten target, target tungsten alloy, tungsten-silicon alloy target three kinds of targets. 3.1.4 Products according to chemical composition divided into W-99.999, WTi-99.9, WTi-99.95, WTi-99.99, WTi-99.995, WTi-99.999, WSi-99.99, WSi-99.999 eight grades. Representation and marking examples are as follows. Product ingredients Purity Example. 99.999% high purity tungsten target, expressed as W-99.999.

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