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YS/T 1025-2015

Search Result of Chinese Standard: 'YS/T 1025-2015'
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YS/T 1025-2015English229 Add to Cart Days<=3 High-purity tungsten and tungsten alloy sputtering target used in electronic film Valid YS/T 1025-2015
YS/T 1025-2015Chinese16 Add to Cart <=1-day [PDF from Chinese Authority, or Standard Committee, or Publishing House]

   
Detail Information of YS/T 1025-2015; YS/T1025-2015
Description (Translated English): High-purity tungsten and tungsten alloy sputtering target used in electronic film
Sector / Industry: Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard: H63
Classification of International Standard: 77.150.99
Word Count Estimation: 10,127
Date of Issue: 2015-04-30
Date of Implementation: 2015-10-01
Quoted Standard: GB/T 1031; GB/T 1804; GB/T 3850; GB/T 4324.23; GB/T 4324.25; GB/T 4324.26; GB/T 4324.27; GB/T 6394; GB/T 8651; YS/T 837; YS/T 900; YS/T 901
Drafting Organization: Ningbo Jiangfeng Electronic Material Co., Ltd
Administrative Organization: National Standardization Technical Committee for Nonferrous Metals
Regulation (derived from): Ministry of Industry and Information Technology Announcement (2015 No. 28)
Summary: This standard specifies the requirements, test methods, inspection rules and marks, packaging, transportation, storage, order form (contract), etc. of high purity tungsten and tungsten alloy sputtering targets for electronic thin films. This standard applies to electronic thin film with high purity tungsten and tungsten alloy shot target, hereinafter referred to as high-purity tungsten and tungsten alloy target.

YS/T 1025-2015
High-purity tungsten and tungsten alloy sputtering target used in electronic film
ICS 77.150.99
H63
People's Republic of China Nonferrous Metals Industry Standard
Electronic film with high purity tungsten and tungsten alloy sputtering targets
High-puritytungstenandtungstenaloysputteringtargetused
inelectronicfilm
Issued on: 2015-04-30
2015-10-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) and focal points.
This standard was drafted: Ningbo Jiang Feng Electronic Materials Co., Ltd., there is research billion of new materials Co., Ltd., Beijing Tianlong Tungsten & Molybdenum Technology
Co., Ltd., Zhuzhou Kate Industrial Co., Ltd., Xi'an Branch Fang New Material Technology Co., Ltd.
The main drafters of this standard: Yao Lijun, Wang Xueze, according to Ding Chong, Zhang Tao, supporting the early Yuan Dynasty, Flaw, Zheng Wenxiang, Sonja, Su Guoping, money Hongbing,
Yuan Jie, Wang right, Zhang Yu, Wang Yue, Du railways.
Electronic film with high purity tungsten and tungsten alloy sputtering targets
1 Scope
This standard specifies the electronic film with high purity tungsten and tungsten alloy sputtering targets requirements, test methods, inspection rules and signs, packaging, transportation
Transport, storage, purchase orders (or contract) and so on.
This standard applies to electronic film with high purity tungsten and tungsten alloy sputtering targets, hereinafter referred to as high-purity tungsten and tungsten alloy target.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 1031 Geometrical product specifications (GPS) Surface texture Profile method Surface roughness parameters and their values
GB/T 1804 General tolerances Tolerances for linear and angular dimensions without individual tolerance
GB/T 3850 compact sintered metal materials and hardmetals - Determination of density
GB/T 4324.23 chemical analysis of tungsten - Part 23: Determination of sulfur content of combustion conductance method and frequency combustion infrared absorption method
GB/T 4324.25 chemical analysis of tungsten - Part 25: Determination of oxygen pulse heating inert gas fusion - infrared absorption method
GB/T 4324.26 chemical analysis of tungsten - Part 26: Determination of nitrogen pulse heating inert gas fusion - thermal conductivity method and Nessler test
Agent spectrophotometry
GB/T 4324.27 chemical analysis of tungsten - Part 27: Determination of carbon content in the high-frequency combustion infrared absorption method
GB/T 6394 Determination of average grain size of metal
GB/T 8651 sheet metal plate ultrasonic flaw detection method
YS/T 837 sputtering targets - back binding quality ultrasonic inspection
Inductively coupled plasma mass spectrometry YS/T 900 high-purity tungsten chemical analysis of trace elements
Determination glow YS/T 901 high-purity tungsten chemical analysis of trace impurities in the discharge mass spectrometry
3 Requirements
3.1 Categories
3.1.1 According to shape into round, rectangular and shaped (such as triangles, etc.).
3.1.2 target backplane copper and copper alloy or aluminum and aluminum alloys.
3.1.3 Depending on the alloy material, divided into pure tungsten target, target tungsten alloy, tungsten-silicon alloy target three kinds of targets.
3.1.4 Products according to chemical composition divided into W-99.999, WTi-99.9, WTi-99.95, WTi-99.99, WTi-99.995, WTi-99.999,
WSi-99.99, WSi-99.999 eight grades.
Representation and marking examples are as follows:
Product ingredients
Purity
Example: 99.999% high purity tungsten target, expressed as W-99.999.
Related standard:   YS/T 1017-2015  YS/T 1018-2015
   
 
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