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SJ/T 11551-2015 English PDF

Standard IDContents [version]USDSTEP2[PDF] delivered inStandard Title (Description)StatusPDF
SJ/T 11551-2015EnglishRFQ ASK 3 days [Need to translate] (High density interconnect resin coated copper foil for printed circuits) Valid SJ/T 11551-2015

Standard similar to SJ/T 11551-2015

SJ/T 11277   SJ/T 11891   SJ/T 11890   

Basic data

Standard ID SJ/T 11551-2015 (SJ/T11551-2015)
Description (Translated English) (High density interconnect resin coated copper foil for printed circuits)
Sector / Industry Electronics Industry Standard (Recommended)
Date of Issue 2015-10-10
Date of Implementation 2016-04-01
Regulation (derived from) PRC MIIT Announcement 2015 No.63
Issuing agency(ies) Ministry of Industry and Information Technology