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SJ/T 11514-2015 English PDF

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SJ/T 11514-2015: Thermosetting Conductive Paste for Printed Circuit Board (PCB)
Status: Valid
Standard IDContents [version]USDSTEP2[PDF] delivered inStandard Title (Description)StatusPDF
SJ/T 11514-2015English369 Add to Cart 3 days [Need to translate] Thermosetting Conductive Paste for Printed Circuit Board (PCB) Valid SJ/T 11514-2015

PDF similar to SJ/T 11514-2015


Standard similar to SJ/T 11514-2015

SJ/T 11634   GB/T 11446.8   GB/T 11446.9   SJ/T 11507   SJ/T 11508   SJ/T 11506   

Basic data

Standard ID SJ/T 11514-2015 (SJ/T11514-2015)
Description (Translated English) Thermosetting Conductive Paste for Printed Circuit Board (PCB)
Sector / Industry Electronics Industry Standard (Recommended)
Classification of Chinese Standard L90
Classification of International Standard 31.03
Word Count Estimation 16,148
Date of Issue 2015-04-30
Date of Implementation 2015-10-01
Quoted Standard GB/T 191-2008; GB/T 2036; GB/T 2421.1-2008; GB/T 2423.3-2006; GB/T 2423.16-2008; GB/T 2423.22-2002; GB/T 4677-2002; GB/T 2828.1-2003; GB/T 4588.2-1996; GB/T 5547-2007; GB/T 6739-2006; GB/T 6753.1-2007; GB/T 9286-1998; GB/T 17473.3-2008; GB/T 13557-1992; SJ/T 11171-1998
Regulation (derived from) Ministry of Industry and Information Technology Announcement (2015 No. 28)
Issuing agency(ies) Ministry of Industry and Information Technology
Summary This Standard specifies the terms and definitions for printed circuits thermosetting conductive paste, requirements, test methods, inspection rules and packaging, labeling, transportation and so on. This Standard applies to the printed circuit board conductive pattern, contacts, contacts, jumpers, hole fill, and membrane switch, buried resistors, RFID and other manufacturing conductive paste by heat curing, including silver conductor, copper conductor paste, silver and carbon conductive carbon paste mixed slurry.

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