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GB/T 4722-2017: Test methods for rigid copper clad laminates for printed circuits board
Status: Valid GB/T 4722: Evolution and historical versions
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| GB/T 4722-2017 | English | 1879 |
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Test methods for rigid copper clad laminates for printed circuits board
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GB/T 4722-2017
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| GB/T 4722-1992 | English | RFQ |
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Test methods for copper-clad laminatedsheets for printed circuits
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GB/T 4722-1992
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PDF similar to GB/T 4722-2017
Standard similar to GB/T 4722-2017 GB/T 12631 GB/T 4725 GB/T 4721 Basic data | Standard ID | GB/T 4722-2017 (GB/T4722-2017) | | Description (Translated English) | Test methods for rigid copper clad laminates for printed circuits board | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L30 | | Classification of International Standard | 31.180 | | Word Count Estimation | 94,923 | | Date of Issue | 2017-05-31 | | Date of Implementation | 2017-12-01 | | Older Standard (superseded by this standard) | GB/T 4722-1992 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | GB/T 4722-2017: Test methods for rigid copper clad laminates for printed circuits board---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Test methods for rigid copper clad laminates for printed circuit board
ICS 31.180
L30
National Standards of People's Republic of China
Replace GB/T 4722-1992
Test method for rigid copper - clad laminates for printed circuits
2017-05-31 released
2017-12-01 implementation
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
China National Standardization Management Committee released
Directory
Preface Ⅶ
1 Scope 1
2 normative reference document 1
General requirements
3.1 Test conditions 1
3.1.1 Standard atmospheric conditions for normal testing
3.1.2 Criteria for Arbitration Testing Atmospheric conditions 1
3.1.3 Test treatment conditions Representation 1
3.2 Temperature change of environmental test chamber 2
3.2.1 Changes in temperature over time in the work area 2
3.2.2 changes in temperature within the work area with space 2
3.3 Preparation of the sample 2
3.3.1 Sampling method 2
3.3.2 Etching method of sample 2
3.4 Test Report 2
4 Appearance 2
4.1 copper foil surface and not covered with foil surface appearance 2
4.1.1 Purpose 2
4.1.2 Instruments and materials 3
4.1.3 Sample 3
4.1.4 Procedure 3
4.1.5 Test report 4
4.2 Insulation substrate after etching 4
4.2.1 Purpose 4
4.2.2 Instruments and Materials 4
4.2.3 Sample 4
4.2.4 Procedure 4
4.2.5 Test Report 5
5 size 5
5.1 Length and width 5
5.1.1 Purpose 5
5.1.2 Instruments and Materials 5
5.1.3 Sample 5
5.1.4 Procedure 5
5.1.5 Report 5
5.2 Vertical 5
5.2.1 Purpose 5
5.2.2 Instruments and Materials 6
5.2.3 Sample 6
5.2.4 Procedure 6
5.2.5 Report 8
5.3 thickness 8
5.3.1 Purpose 8
5.3.2 Instruments and Materials 8
5.3.3 Sample 8
5.3.4 Procedure 8
5.3.5 Report 9
5.4 bow and twist 9
5.4.1 Purpose 9
5.4.2 Instruments and Materials 9
5.4.3 Specimen 9
5.4.4 Procedure 9
5.4.5 Report 11
6 Physical and chemical properties 11
6.1 Cleanability of metal surfaces 11
6.1.1 Purpose 11
6.1.2 Instruments and Materials 11
6.1.3 Chemical reagents 11
6.1.4 Sample 12
6.1.5 Procedure 12
6.1.6 Report 12
6.2 Chemical resistance 12
6.2.1 Purpose 12
6.2.2 Instruments and Materials 12
Chemical reagents
6.2.4 Sample 13
6.2.5 Procedure 13
6.2.6 Report 14
6.3 Halogen content 14
6.3.1 Purpose 14
6.3.2 Instruments and Materials 14
6.3.3 Chemical reagents 14
6.3.4 Sample 14
6.3.5 Procedure 15
6.3.6 Report 18
6.4 Flammability 18
6.4.1 Vertical combustion 18
6.4.2 Horizontal combustion 20
6.5 Thermal stress 22
6.5.1 Purpose 22
Instruments and Materials
6.5.3 Sample 22
6.5.4 Procedure 22
6.5.5 Report 23
6.6 Solderability (side leaching method) 23
6.6.1 Purpose 23
6.6.2 Instruments and Materials 23
6.6.3 Chemical Reagent 23
6.6.4 Sample 23
6.6.5 Procedure 23
6.6.6 Report 24
6.7 Glass transition temperature 25
6.7.1 DSC (Differential Scanner) method 25
6.7.2 DMA (dynamic mechanical analyzer) method (bending mode and drawing mode) 27
6.7.3 TMA (thermomechanical analyzer) probe method (Z axis method) 29
6.8 Z-axis thermal expansion coefficient (TMA probe method) 32
6.8.1 Purpose 32
6.8.2 Instruments and Materials 32
6.8.3 Sample 32
6.8.4 Procedure 32
6.8.5 Calculation formula 33
6.8.6 Report 33
6.9 Thermal decomposition temperature (Td) (TGA method) 34
6.9.1 Purpose 34
6.9.2 Instruments and Materials 34
6.9.3 Sample 34
6.9.4 Procedure 34
6.9.5 Report 35
6.10 X/Y axis thermal expansion coefficient (TMA stretching method) 35
6.10.1 Purpose 35
Instruments and Materials
6.10.3 Sample 35
6.10.4 Procedure 36
6.10.5 Calculate Equation 36
6.10.6 Report 37
6.11 Thermal stratification time (TMA probe method) 37
6.11.1 Purpose 37
Instruments and Materials
6.11.3 Sample 37
6.11.4 Procedure 37
6.11.5 Assessment 37
6.11.6 Report 38
6.12 Heat resistance 38
6.12.1 Purpose 38
6.12.2 Instruments and Materials 38
6.12.3 Sample 38
6.12.4 Procedure 38
6.12.5 Report 39
6.13 Ultraviolet light (UV) transmittance 39
6.13.1 Purpose 39
6.13.2 Instruments and Materials 39
6.13.3 Sample 39
6.13.4 Procedure 39
6.13.5 Calculation of results 40
6.13.6 Report 40
7 Mechanical properties 40
7.1 Pulling strength 40
7.1.1 Purpose 40
Instruments and Materials
7.1.3 Sample 41
7.1.4 Procedure 41
7.1.5 Report 42
7.2 Peel strength 42
7.2.1 Peel strength under acceptance
7.2.2 peel strength after thermal stress 45
7.2.3 peel strength at high temperature
7.2.4 Peel strength after exposure to process solution 46
7.3 bending strength 47
7.3.1 Purpose 47
7.3.2 Instruments and Materials 47
7.3.3 Specimen 48
7.3.4 Procedure 48
7.3.5 Calculation of results 49
7.3.6 Report 50
7.4 Dimensional stability 50
7.4.1 Purpose 50
Instruments and Materials
7.4.3 Sample 50
7.4.4 Procedure 51
7.4.5 Result calculation
7.4.6 Report 53
7.5 Punching force 53
7.5.1 Purpose 53
7.5.2 Instruments and Materials 53
7.5.3 Specimens 54
7.5.4 Procedure 54
7.5.5 Assessment 55
7.5.6 Report 56
8 Electrical performance 56
8.1 Breakdown voltage (parallel layer) 56
8.1.1 Purpose 56
8.1.2 Test conditions 56
8.1.3 Instruments and Materials
8.1.4 Sample 56
8.1.5 Procedure 57
8.1.6 Report 58
8.2 Electrical strength 58
8.2.1 Purpose 58
8.2.2 Test conditions 58
8.2.3 Instruments and Materials 58
8.2.4 Sample 59
8.2.5 Procedure 59
8.2.6 Result calculation
8.2.7 Report 60
8.3 Volume resistivity and surface resistivity 60
8.3.1 Purpose 60
8.3.2 Instruments and Materials 60
8.3.3 Sample 60
8.3.4 Procedure 62
8.3.5 Calculation of results 64
8.3.6 Report 64
8.4 Insulation resistance 64
8.4.1 Purpose 64
8.4.2 Instruments and Materials 64
8.4.3 Sample 65
8.4.4 Procedure 65
8.4.5 Report 65
8.5 Dielectric constant and dielectric loss tangent
8.5.1 Two-fluid tank method
8.5.2 Parallel plate method 68
8.5.3 Q table method 70
8.6 Resistance to arc 71
8.6.1 Purpose 71
8.6.2 Test conditions 71
8.6.3 Instruments and Materials 71
8.6.4 Sample 71
8.6.5 Procedure 71
8.6.6 Report 72
8.7 compared to the tracking index 72
8.7.1 Purpose 72
Instruments and Materials
8.7.3 Sample 72
8.7.4 Procedure 72
8.7.5 Report 72
Environmental performance
9.1 Pressure vessel thermal stress 73
9.1.1 Purpose 73
9.1.2 Instruments and Materials 73
9.1.3 Sample 73
9.1.4 Procedure 73
9.1.5 Assessment 73
9.1.6 Report 75
9.2 Water absorption 75
Purpose of Purpose
Instruments and Materials
9.2.3 Specimen 75
9.2.4 Procedure 75
9.2.5 Calculation of results 75
9.2.6 Report 75
Appendix A (Normative Appendix) CCL Etching Method
A.1 Ammonium persulfate etching method
A.2 Ferric chloride etching method
A.3 Acid Copper Chloride Etching Method
A.4 Alkaline chloride etching method
Index 82
Foreword
This standard is drafted in accordance with the rules given in GB/T 1.1-2009.
This standard replaces GB/T 4722-1992 "Test method for copper clad laminate for printed circuit".
This standard compared with GB/T 4722-1992, in addition to editorial changes in the main technical changes are as follows.
--- name changed to "printed circuit with rigid copper clad laminate test method";
--- This standard refers to the overall classification of the method from the electrical and non-electrical performance test refined into appearance, size, physical and chemical properties, machine
Mechanical properties, electrical properties and environmental tests;
Applicable to rigid copper clad laminates (see Chapter 1);
--- normative reference documents added GB/T 6462-2005, removed GB/T 2036 and GB/T 2423.3 (see Chapter 2,
Chapter 2 of the.1992 edition);
- increased the temperature requirements of the test conditions and the environmental test chamber (room) (see 3.1);
- Four alternative methods of sample preparation are provided for the selection of ferrous trichloride for arbitration (see 3.3.2 and Appendix A);
- increase the appearance of the insulating substrate after etching (see Chapter 4);
- Removal of the laminated copper foil per unit area mass (etch method) test method, increased the width/length of the test method (see Chapter 5,
Chapter 22 of the.1992 edition);
--- increase the diagonal method to measure the vertical, keep the ruler method for the arbitration method (see 5.2);
- an increase in the thickness of the measurement point diagram (see 5.3);
--- bow/distorted result value expressed as a percentage value (see 5.4);
--- increase the metal surface can be clean, chemical resistance, substrate halogen content, glass transition temperature (Tg, ΔTg), Z-axis thermal expansion
(Td), X/Y-axis thermal expansion coefficient, thermal stratification time (TMA method), heat resistance, and ultraviolet light transmittance (see
Chapter 6);
- increase the vertical combustion method of the test sample pretreatment oven baking conditions, ignition flame height from (19 ± 1) mm to
(20 ± 1) mm, increasing the FV-2 combustion judgment level. Increased the combustion formula of horizontal combustion method and FHB combustion
(See 6.4);
--- The thermal shock bubble was renamed thermal stress, increased dip welding method, for the arbitration and identification test increased pre-baking conditions, thermal stress temperature
The degree and time conditions are subject to the specification of the product (see chapter 6.5, chapter 17 of the.1992 edition);
- Lead-free solders in instruments and materials should be agreed upon by both parties (see 6.6);
--- pull-off rate "to 5 ~ 50N/s force evenly increase the tension" to "select the appropriate pull the file to (50 ± 2) mm/min
The speed of the pull lead "(see 7.1,.1992 edition of 15.5.4);
- After removal of dry heat, exposure to solvent vapor, exposure to simulated peel conditions after stripping strength. Increased stripping under acceptance
From the strength, increased anti-stripping instrument with automatic recording curve recorder to determine the value of the map, modified the exposure to the process solution under the stripping
The width of the strip (see 7.2,.1992, Chapter 16);
--- modified bending strength test test thickness range, the parameter selection to list the form that increased the high temperature of the various resin materials
Temperature selection table (see 7.3,.1992, chapter 25);
--- Increased shear board size stability sampling, increased thermal stability under the conditions of drying, dry heat conditions increased from 125 ℃ to
150 ° C. Modified sampling and positioning diagram. An increase in the value of the numerical processing of the deletion method (see 7.4,.1992 edition
Chapter 21);
--- Remove the copper foil resistance test method, surface corrosion test method, edge corrosion test. Increased breakdown voltage (parallel layer),
Resistant arcs (see Chapter 8, Chapters 6, 8 and 9 of the.1992 edition);
--- The applicable thickness range for electrical strength is changed from 0.8mm or less to 0.5mm or less. By manual step-by-step boost to automatic boost,
Increased electrical strength calculation formula (see 8.2,.1992 edition 13.1);
--- Change the method name surface resistance to surface resistivity. An increase of 96 h after wet heat treatment was retained in a wet box and measured
After 20 wet heat cycles, the samples were retained in a humid chamber to measure two treatment test conditions (see 8.3,.1992, section 7
chapter);
--- modified the insulation resistance of the sample size and number and hole spacing. Increased water boil after the measurement (see 8.4,.1992 edition of the 12th
chapter);
- a two-fluid tank method with a dielectric constant and dielectric loss tangent test, parallel plate method (see 8.5);
--- modified the pressure vessel thermal stress sample size and sample cooking time, an increase of 5 levels of surface quality rating and schematic diagram (see
9. 1, chapter.1992, chapter 28);
--- the sample water absorption to the oven in the (105 ~ 110) ℃ drying 1h. The results are changed from the difference before and after immersion
(See 9.2, chapter 27 of the.1992 edition);
--- Added Appendix A CCL Etching Method.
Please note that some of the contents of this document may involve patents. The issuer of this document does not assume responsibility for the identification of these patents.
This standard is proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This standard is owned by the National Standard Committee on Printed Circuit (SAC/TC47).
The drafting unit of this standard. Guangdong Shengyi Technology Co., Ltd., National Electronic Circuit Substrate Engineering Technology Research Center, Shaanxi Shengyi Branch
Technology Co., Ltd., Suzhou Health Technology Co., Ltd., CQC Nanjing Certification Center, Shandong Jinbao Electronics Co., Ltd., Guangzhou Hongren Electronics
Industrial Co., Ltd., China Electrical Appliances Research Institute/Guangzhou Wei Kai Detection Technology Research Institute, Maike Luo Teke (Changzhou) Products Service Co., Ltd.,
China Electronic Technology Standardization Research Institute.
The main drafters of this standard. Su Xiaosheng, Yang Yan, Yang Zhongqiang, Liu Qianfa, Cai Qiaoer, Han Yanfeng, Wang Xiaobing, Zhang Hua, Li Yuan, Lu Ji, Ge Ying,
Wang Jinrui, Luo Penghui, Zhang Nahong, Liu Xueping, Xing Huili, Liu Hao, Zhang Panxin, Cao Yi.
This standard replaced the previous version of the standard release.
GB/T 4722-1984, GB/T 4722-1992.
Test method for rigid copper - clad laminates for printed circuits
1 Scope
This standard specifies the appearance, size, physical and chemical properties of rigid copper clad laminates for printed circuit boards (hereinafter referred to as CCLs)
Mechanical properties, electrical properties, environmental performance of the test method.
This standard applies to rigid copper clad laminates for printed circuits.
2 normative reference documents
The following documents are indispensable for the application of this document. For dated references, only the dated edition applies to this article
Pieces. For undated references, the latest edition (including all modifications) applies to this document.
GB/T 1409 measurement of electrical insulation materials in the frequency, audio, high frequency (including the wavelength of meters, etc.), the permittivity and dielectric loss factor
Of the recommended method
GB/T 2423.28-2005 Environmental testing for electric and electronic products - Part 2. Test methods - Test T. Soldering
GB/T 4207-2012 Determination of resistance to traceability and comparison of electrical traces for solid insulation materials
Metallic and oxide coatings - Thickness measurement - Microscopy method GB/T
3 General requirements
3.1 Test conditions
3.1.1 Standard atmospheric conditions for normal testing
Unless otherwise specified, the test shall be carried out under the following conditions.
a) Temperature. 15 ° C to 35 ° C;
b) relative humidity. 20% to 80%;
c) Atmospheric pressure. test site air pressure.
3.1.2 Standard conditions for arbitration tests
If the test parameters are dependent on temperature, humidity and air pressure, the test shall be carried out under standard atmospheric conditions of the following arbitration test.
a) Temperature. (23 ± 2) ° C;
b) relative humidity. 45% to 55%;
c) Atmospheric pressure. 86kPa ~ 106kPa.
3.1.3 Test condition representation
The test conditions can be expressed in English letters and numbers, expressed as follows.
a) English letters indicate the type of processing.
1) A is the original state of acceptance, without treatment;
2) C is treated in constant temperature and humidity air;
3) D is immersed in constant temperature water for treatment;
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