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GB/T 41742-2022: Low temperature sealing glass for optoelectric devices
Status: Valid
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 41742-2022 | English | 269 |
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Low temperature sealing glass for optoelectric devices
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GB/T 41742-2022
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Basic data | Standard ID | GB/T 41742-2022 (GB/T41742-2022) | | Description (Translated English) | Low temperature sealing glass for optoelectric devices | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | Q37 | | Classification of International Standard | 81.040.01 | | Word Count Estimation | 14,139 | | Date of Issue | 2022-10-14 | | Date of Implementation | 2023-05-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 41742-2022: Low temperature sealing glass for optoelectric devices---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Low temperature glass sealing for optoelectric devices
ICS 81.040.01
CCSQ37
National Standards of People's Republic of China
Low temperature sealing glass for optoelectronic devices
Published on 2022-10-12
2023-05-01 Implementation
State Administration for Market Regulation
Released by the National Standardization Administration
foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents"
drafted.
Please note that some content of this document may be patented. The issuing agency of the document assumes no responsibility for identifying the patent.
This document is proposed by China Building Materials Federation.
This document is under the jurisdiction of the National Technical Committee for Standardization of Industrial Glass and Special Glass (SAC/TC447).
This document is drafted by. China General Research Institute of Building Materials Co., Ltd., Beijing University of Technology, China National Inspection and Testing Holding Group Co., Ltd.
Co., Ltd., China Ordnance Industry No. 213 Research Institute, China Building Materials Inspection and Certification Group Xiamen Hongye Co., Ltd., Qilu University of Technology,
Beijing Tianyu Technology Co., Ltd., Hebei Xiong'an Kezhu Inspection and Certification Co., Ltd.
The main drafters of this document. Zhu Baojing, Xu Bo, Tian Yingliang, Yin Xianyin, Yan Xu, Gao Xiping, Han Bin, Zu Chengkui, Li Na, Liu Guoying, Hai Yun,
Qiu Hongke, Liu Longxing, Liu Shiquan, Feng Gang, Tao Liushi, Wang Jingjing, Zheng Xuehan, Wang Xiaolu, Li Cong.
Low temperature sealing glass for optoelectronic devices
1 Scope
This document specifies the requirements, test methods, inspection rules, packaging, marking, transportation and storage of low-temperature sealing glass for optoelectronic devices.
This document applies to glass, glass powder and prefabricated parts for low temperature sealing of optoelectronic devices.
2 Normative references
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations
For documents, only the edition corresponding to that date applies to this document; for undated references, the latest edition (including all amendments)
applies to this document.
GB/T 2828.1 Counting Sampling Inspection Procedure Part 1.Lot-by-Lot Inspection Sampling Plan Retrieved by Acceptance Quality Limit (AQL)
GB/T 5432 Glass Density Determination Buoyancy Method
GB/T 6005 Test sieve wire mesh, perforated plate and basic size of electroformed sheet mesh
GB/T 16920 Determination of average linear thermal expansion coefficient of glass
GB/T 21389 Verniers, Band Meters and Digital Calipers
GB/T 31541 Test method for interfacial tensile and shear bond strength of fine ceramics - crisscross method
JJG1036 Electronic balance
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1
sealingglass
A glass material that achieves close connection between devices or materials by heating and welding.
3.2
sealingtemperature
The heating temperature corresponding to the optimal bonding state between the sealing glass and the sealed device or material.
Note. The sealing temperature is generally the temperature corresponding to the glass viscosity of 105dPa·s~106dPa·s.
3.3
Glass that meets the requirements for low temperature sealing of optoelectronic devices.
Note. The sealing temperature is usually lower than 600℃.
3.4
sealingdensity
Glass density after sintering according to the sealing process.
3.5
sealingstrength
The bonding strength between the sealing glass and the sealed device or material after sintering according to the sealing process.
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