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GB/T 39342-2020: Aerospace electronic products. General specification for printed circuit board
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 39342-2020 | English | 449 |
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Aerospace electronic products. General specification for printed circuit board
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GB/T 39342-2020
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PDF similar to GB/T 39342-2020
Standard similar to GB/T 39342-2020 GB/T 34520.8 GB/T 38342 Basic data | Standard ID | GB/T 39342-2020 (GB/T39342-2020) | | Description (Translated English) | Aerospace electronic products. General specification for printed circuit board | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | V16 | | Classification of International Standard | 31.180 | | Word Count Estimation | 24,260 | | Date of Issue | 2020-11-19 | | Date of Implementation | 2021-06-01 | | Quoted Standard | GB/T 191; GB/T 2036; GB/T 4677-2002; QJ 832B-2011 | | Regulation (derived from) | National Standard Announcement No. 26 of 2020 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | | Summary | This standard specifies the requirements, quality assurance regulations and delivery preparations for printed circuit boards for aerospace electronic products. This standard applies to the design, production and inspection of printed circuit boards for aerospace electronic products (hereinafter referred to as "printed boards"). | GB/T 39342-2020: Aerospace electronic products. General specification for printed circuit board---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Aerospace electronic products - General specification for printed circuit board
ICS 31.180
V16
National Standards of People's Republic of China
General Specification for Printed Circuit Boards of Aerospace Electronic Products
2020-11-19 released
2021-06-01 implementation
State Administration for Market Regulation
Issued by the National Standardization Management Committee
Table of contents
Preface Ⅲ
1 Scope 1
2 Normative references 1
3 Terms and definitions 1
4 Requirements 1
4.1 Design 1
4.2 Material 1
4.3 Plating and coating on printed board surface 2
4.4 General requirements 2
4.5 Appearance and basic dimensions 2
4.6 Microsection 8
4.7 Physical properties 10
4.8 Chemical properties 12
4.9 Characteristics of copper plating 12
4.10 Electrical performance 12
4.11 Environmental adaptability 14
5 Quality Assurance Regulations 14
5.1 Inspection classification 14
5.2 Inspection conditions 14
5.3 Identification inspection 15
5.4 Quality consistency inspection 16
5.5 Inspection method 19
6 Delivery preparation 20
6.1 Sign 20
6.2 Packaging 20
6.3 Transport 20
6.4 Storage 20
Appendix A (Normative Appendix) Solvent Resistance Test 21
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
Please note that certain contents of this document may involve patents. The issuing agency of this document is not responsible for identifying these patents.
This standard was proposed and managed by the National Aerospace Technology and Application Standardization Technical Committee (SAC/TC425).
Drafting organization of this standard. China Aerospace Science and Technology Corporation Ninth Research Institute.200 Plant.
The main drafters of this standard. Baojie, Wang Jinxuan, Wang Yi.
General Specification for Printed Circuit Boards of Aerospace Electronic Products
1 Scope
This standard specifies the requirements, quality assurance regulations and delivery preparations for printed circuit boards for aerospace electronic products.
This standard applies to the design, production and inspection of printed circuit boards for aerospace electronic products (hereinafter referred to as "printed boards").
2 Normative references
The following documents are indispensable for the application of this document. For dated reference documents, only the dated version applies to this document.
For undated references, the latest version (including all amendments) applies to this document.
GB/T 191 Packaging, Storage and Transportation Graphic Mark
GB/T 2036 Terminology for Printed Circuits
GB/T 4677-2002 Printed Board Test Method
QJ832B-2011 Test method for multi-layer printed circuit boards for aerospace
3 Terms and definitions
The terms and definitions defined in GB/T 2036 apply to this document.
4 requirements
4.1 Design
4.1.1 When designing a printed board, the important characteristics of the printed board related to reliability should be considered comprehensively, such as the structure of the printed board, the choice of substrate, and the layout of the printed board.
Bureau, wiring, printed wire width and wire spacing, via (via), land pattern design, dielectric layer thickness, copper foil thickness and printed board manufacturing
And installation process, etc., and should have an appropriate safety factor according to the importance of the printed board in the complete product.
4.1.2 The printed board design should meet the manufacturability requirements. Manufacturability includes the manufacturability of printed board manufacturing and electronic assembly
Performance requirements, while testing and maintainability should be considered. The manufacturing process of the printed board mainly considers the thickness, size, number of conductor layers, and wire precision of the board.
Factors such as the minimum width and spacing of wires, interconnection methods (through holes, buried holes and blind holes), minimum aperture, plate thickness and aperture ratio.
4.1.3 The material and structure of the printed board should be able to adapt to the use environment requirements of aerospace electronic and electrical products, and the maximum use of renewable, recyclable or environmentally friendly materials should be used.
4.2 Materials
4.2.1 Copper clad laminates generally use substrates with high thermal reliability and flame retardancy. When the electronic assembly uses a higher soldering temperature, the substrate glass
The glass transition temperature is generally not less than 170°C.
4.2.2 When selecting a substrate, other properties should be considered on the basis of meeting the key characteristics of the product, and a suitable substrate should be selected according to the following factors.
a) Type of printed board;
b) manufacturing process;
c) Working and storage environment;
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