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GB/T 37963-2019 English PDF

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GB/T 37963-2019: Handbook of reliability prediction model and data for electronic equipment
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Basic data

Standard ID GB/T 37963-2019 (GB/T37963-2019)
Description (Translated English) Handbook of reliability prediction model and data for electronic equipment
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L05
Classification of International Standard 03.120.01; 03.120.30; 31.020
Word Count Estimation 90,971
Date of Issue 2019-08-30
Date of Implementation 2019-12-01
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 37963-2019: Handbook of reliability prediction model and data for electronic equipment

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Handbook of reliability prediction model and data for electronic equipment ICS 03.120.01; 03.120.30; 31.020 L05 National Standards of People's Republic of China Electronic equipment reliability prediction model and data sheet (IEC TR62380.2004, Reliabilitydatahandbook-Universalmodelfor Published on.2019-08-30 2019-12-01 implementation State market supervision and administration China National Standardization Administration issued

Content

Foreword III Introduction IV 1 Scope 1 2 Normative references 1 3 terms and definitions, symbol 1 3.1 Terms and Definitions 1 3.2 Symbol 2 4 Instructions for use 3 4.1 Prerequisites 3 4.2 Impact factor 4 4.3 Data usage 4 4.4 Purpose and purpose of reliability prediction 5 5 Environmental Impact 5 5.1 Overview 5 5.2 Environment Type Definition 5 5.3 Electrical stress conditions 9 5.4 Task Profile 9 5.5 Task Profile Case 9 6 Printed circuit boards and hybrid integrated circuits 11 6.1 Printed Circuit Board 11 6.2 Hybrid Integrated Circuit 12 7 integrated circuit 14 7.1 Effective range 14 7.2 Estimation of junction temperature of integrated circuits 14 7.3 Failure rate model 17 8 Diodes, Thyristors, Transistors and Optocouplers 22 8.1 Calculating the junction temperature of diodes and transistors 22 8.2 Low Power Diode 24 8.3 Power Diode 26 8.4 Low Power Transistor 28 8.5 Power Transistor 30 8.6 Photocoupler 33 9 Optoelectronic devices 35 9.1 Overview 35 9.2 LED Module 35 9.3 Laser Diode Module 37 9.4 Photodiode and Receiver Module for Communication 39 9.5 Passive Optical Components 40 9.6 Other optical components 41 10 Capacitors and Thermistors (NTC) 41 10.1 Fixing plastic, paper, dielectric capacitors 41 10.2 Fixed Ceramic Capacitor---Class I 42 10.3 Fixed Ceramic Capacitor---Class II 43 10.4 Solid tantalum electrolytic capacitor 44 10.5 Non-solid aluminum electrolytic capacitor 45 10.6 Aluminum Electrolytic Capacitor---Solid Electrolyte 47 10.7 Aluminum Electrolytic Capacitor---Polymer Electrolyte 47 10.8 Variable Ceramic Capacitor 48 10.9 Thermistor 49 with negative temperature influence coefficient (NTC) 11 resistors and potentiometers 50 11.1 Fixed, Low Power Film Resistors 50 11.2 Hot Molded Carbon Fixed Resistor 51 11.3 Fixed, High Power Film Resistors 52 11.4 Low Power Wirewound Resistors 53 11.5 High Power Wirewound Resistors 54 11.6 Fixed, Low Power Surface Mount Resistors and Resistor Arrays 55 11.7 Non-wire wound cermet potentiometer 56 12 Inductors and Transformers 58 13 Microwave passive components, piezoelectric components and surface acoustic wave filters 59 14 relay 60 14.1 Wet Spring Relay 60 14.2 Reed Relay 62 14.3 Electromechanical Relays, Thermal Relays 64 14.4 Industrial Relays, High Voltage Vacuum Relays and Power Mercury Wet Spring Relays 66 15 switch and keyboard 68 16 connector 69 17 lights 71 18 protection device 71 19 battery 72 20 motors and fans 73 Appendix A (informative) Correction of component failure rate level based on quality assurance measures 74 Appendix B (informative) Component Counting Estimation Method and General Failure Rate 75 References 83

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard uses the redrafting method to refer to IEC TR62380.2004 "Reliability Data Book for electronic components, boards and equipment. The general model of reliability prediction is compiled, and the degree of consistency with IEC TR62380.2004 is non-equivalent. This standard was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard is under the jurisdiction of the National Technical Committee for Reliability and Maintainability of Electrical and Electronic Products (SAC/TC24). This standard was drafted. The Fifth Institute of Electronics, Ministry of Industry and Information Technology. The main drafters of this standard. Yu Di, Zhou Junlian, Mo Yuwei, Pan Yong, Nie Guojian, Ren Yan, Yang Yun, Yan Fang.

Introduction

As China's industrial sector pays more and more attention to the reliability of electronic equipment (products), it is an important ring for reliability design. One of the festivals, the implementation of reliability prediction has become more popular, but the lack of relevant standards has enabled enterprises to calculate the failure rate of domestic electronic components. In the absence of technical guidance, the foreign reliability prediction manual is difficult to accurately reflect the reliability level of domestic electronic components. Therefore, it is necessary to end In line with the fact that our national electronic equipment is used to carry out the preparation of national standards for reliability prediction. Electronic equipment reliability prediction model and data sheet

1 Scope

This standard specifies the prediction model, impact factor characterization and related data of common component types, and provides reference for the calculation of reliability indicators. Based on the test, the auxiliary equipment reliability optimization work is carried out. This standard applies to domestic electronic components.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article. Pieces. For undated references, the latest edition (including all amendments) applies to this document. GB/T 2900.13-2008 Electrotechnical terminology credibility and service quality GB/T 4798 (all parts) Environmental conditions for the application of electrical and electronic products 3 terms and definitions, symbols 3.1 Terms and definitions The following terms and definitions as defined in GB/T 2900.13-2008 apply to this document. 3.1.1 Basic failure rate referencefailurerate Failure rate under given baseline conditions. 3.1.2 Reference condition The stress conditions are selected to match the use of components in most applications and equipment. Note. including temperature, electrical stress, mechanical stress, etc. 3.1.3 Failure mode failuremode The way the failure occurs. 3.1.4 Task profile missionprofile A time-series description of the events and environments experienced by the product during the time it takes to complete the specified task. 3.1.5 General failure rate genericfailurerate The failure rate of components in the general working environment and common working stress. Note. This failure rate is used when component count reliability is expected. 3.1.6 Component A component of a device that cannot be physically subdivided without losing its specific function.