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GB/T 34177-2017 English PDF

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GB/T 34177-2017: Quartz glass wafer for lithography
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Basic data

Standard ID GB/T 34177-2017 (GB/T34177-2017)
Description (Translated English) Quartz glass wafer for lithography
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard Q35
Classification of International Standard 81.040.30
Word Count Estimation 14,140
Date of Issue 2017-09-07
Date of Implementation 2018-08-01
Issuing agency(ies) General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 34177-2017: Quartz glass wafer for lithography

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Quartz glass wafer for lithography ICS 81.040.30 Q35 National Standards of People's Republic of China Lithography quartz glass wafer 2017-09-07 Posted 2018-08-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard proposed by the China Building Materials Federation. This standard by the National Industrial Glass and Special Glass Standardization Technical Committee (SAC/TC447) centralized. This standard drafting unit. China Building Materials Inspection and Certification Group Co., Ltd., China Building Materials Quzhou Jin Gelan Quartz Co., Ltd. Changsha Shao Chromium Plate Co., Ltd., China Building Materials Research Institute, the National Safety Glass and Quartz Glass Quality Supervision and Inspection Center. The main drafters of this standard. Wu Jie, Wang Jingxia, Wang Youjun, Li Yi Zhou, Hua Ning, Liu Huanmin, Xiao Songhua, Nilan Ship, Zhang Hao Yun, Yang Xiaohui, Yang Xuedong, Kong Min, Zhang Ying. Lithography quartz glass wafer

1 Scope

This standard specifies the lithography quartz glass wafer (hereinafter referred to as quartz glass wafer) terms and definitions, classification, requirements, test methods, Inspection rules and signs, packaging, transportation and storage. This standard applies to semiconductor integrated circuits, optical communications, micro-electromechanical systems (MEMS), optoelectronic devices and light-emitting diode (LED) light Engraved in the process used as a substrate of quartz glass wafer.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this article Pieces. For undated references, the latest edition (including all amendments) applies to this document. Methods of chemical composition analysis of quartz glass GB/T 3284-2015 GB/T 5949 transparent quartz glass bubble, gas line test methods Surface roughness of gallium nitride single crystal substrate by atomic force microscopy JC/T 185 optical quartz glass Internal stress testing methods for JC/T 655 quartz glass products JC/T 2205 quartz glass terms

3 Terms and definitions

JC/T 2205 and defined by the following terms and definitions apply to this document. 3.1 Total thickness change totalthicknessvariation; TTV The difference between the maximum and minimum thickness of quartz glass wafers. 3.2 Flatness flatness For example, a surface of a quartz glass wafer is sucked by a vacuum chuck in an ideal, On a flat suction cup, the deviation of the other surface from the specified reference surface is indicated by the total readings in the measurement range (TIR). 3.3 Curvature bow Deviation from the center plane of the median plane of the free, non-gripped quartz glass wafer to the plane of the median plane. The median plane reference plane is a plane defined by three equidistant points on a given circumference that is less than the nominal diameter of the quartz glass wafer. 3.4 Warp warp The difference between the maximum and minimum distance of the free, uncladished quartz glass wafer median plane relative to the reference plane.

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