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GB/T 33772.2-2025: Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
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| GB/T 33772.2-2025 | English | 379 |
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Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
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GB/T 33772.2-2025
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Basic data | Standard ID | GB/T 33772.2-2025 (GB/T33772.2-2025) | | Description (Translated English) | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L30 | | Classification of International Standard | 31.180 | | Word Count Estimation | 18,116 | | Date of Issue | 2025-05-30 | | Date of Implementation | 2025-12-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 33772.2-2025: Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.180
CCSL30
National Standard of the People's Republic of China
Quality assessment system Part 2.Electronic components and
Selection and use of sampling plans for package inspection
(IEC 61193-2.2007,MOD)
Released on 2025-05-30
2025-12-01 Implementation
State Administration for Market Regulation
The National Standardization Administration issued
Table of contents
Preface III
Introduction IV
1 Scope 1
2 Normative references 1
3 Terms and Definitions 1
4 Sampling system 1
5 Acceptance and rejection 3
6 Statistical Verification Quality Limit (SVQL) 4
Appendix A (Informative) Statistical Verification Quality Limit (SVQL) for Estimating the Defective Rate Per Million (×10-6) at a Confidence Level of 60% 5
Appendix B (Informative) Relationship between this document and GB/T 2828.1-2012 11
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting.
This document is Part 2 of GB/T 33772 "Quality Assessment Systems". GB/T 33772 has been published in the following parts.
--- Part 1.Statistics and analysis of defects on printed board assemblies;
--- Part 2.Selection and use of sampling plans for inspection of electronic components and packages.
This document is modified to adopt IEC 61193-2.2007 "Quality assessment systems - Part 2.Sampling methods for inspection of electronic components and packages"
The selection and use of solutions.
This document has made the following structural adjustments compared to IEC 61193-2.2007.
---Term 3.1 corresponds to 3.6 of IEC 61193-2.2007;
--- Deleted Appendix C of IEC 61193-2.2007.
The technical differences between this document and IEC 61193-2.2007 and their reasons are as follows.
--- The normative reference GB/T 2036 replaces IEC 60194 (see Chapter 3) to adapt to my country's technical conditions and increase operability
Sexuality;
--- Due to the definitions in GB/T 2036 and GB/T 3358.2-2009, some terms in IEC 61193-2.2007 have been deleted
and its definition (see 3.1 to 3.5 of IEC 61193-2.2007).
The following editorial changes were made to this document.
--- Annex C (informative) of IEC 61193-2.2007 has been deleted as it is irrelevant to the description of the main text.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document is proposed and coordinated by the National Printed Circuit Standardization Technical Committee (SAC/TC47).
This document was drafted by. Chengdu Aerospace Communication Equipment Co., Ltd., China Electronics Technology Standardization Institute, Anhui Xiangsheng Technology Co., Ltd.
Co., Ltd., Guangdong Midea Refrigeration Equipment Co., Ltd., Xi'an Xigu Microelectronics Co., Ltd., Zhejiang Qixing Electronics Co., Ltd., Jiangsu
CESI Technology Development Co., Ltd., East China Branch of China Electronics Technology Standardization Institute, and Xi'an Zhengxin Yunshang Electronic Technology Co., Ltd.
The main drafters of this document are. Liu Houwen, Ma Zhongyi, Kong Wei, Huang Jingkang, Zhang Xiaomei, Guan Qi, Sun Biao, Tan Aiguo, Wang Jianming, Zhao Yun,
Yang Honghui, Yang Jun, Zhang Xingxing, Yan Wang, Guo Zhe.
Introduction
GB/T 33772 "Quality Assessment System" is intended to consist of three parts.
--- Part 1.Statistics and analysis of defects on printed board assemblies. The purpose is to specify various processing
The statistical and analytical methods for defects also specify two methods for collecting defect parts per million (ppm) data.
--- Part 2.Selection and use of sampling plans for inspection of electronic components and packages.
Provide sampling systems and plans for the inspection of assembled parts, suitable for products produced under effective process control to prevent the occurrence of unqualified products.
outflow.
--- Part 3.Selection and use of sampling plans for final product inspection and process monitoring of printed boards and laminates.
The selection and use of sampling plans for attribute inspection for final product inspection and process monitoring of printed boards and laminates, including sampling
Application of methods, attribute classification, inspection plans and sampling plans, etc.
This document states that in order to obtain high-quality products, process control (such as 100% testing of key characteristics) and statistical methods are required.
To stabilize, monitor and improve process flows.
Sampling inspection is one of the methods used to verify the following.
a) Whether process control is effective;
b) Customer or third party assessment of supplier product quality levels.
At present, the quality level of products used in electronic and electrical equipment must reach or approach zero defects. However, if only sampling inspection is used to evaluate the near
The quality level of zero defects will lead to an unreasonable increase in inspection costs. Therefore, process control and zero acceptance number sampling are usually combined.
Method used in combination.
Quality assessment system Part 2.Electronic components and
Selection and use of sampling plans for package inspection
1 Scope
This document specifies requirements for the selection and use of sampling plans for the inspection of electronic components and packages.
This document applies to the inspection of electronic components and packages used in electronic and electrical products.
2 Normative references
The contents of the following documents constitute essential clauses of this document through normative references in this document.
For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to
This document.
GB/T 2036 Terminology for printed circuits
GB/T 2828.1-2012 Sampling procedures for inspection by attributes Part 1.Sampling for batch inspection based on acceptance quality limit (AQL)
Plan (ISO 2859-1.1999, IDT)
GB/T 3358.2-2009 Statistical vocabulary and symbols Part 2.Applied statistics (ISO 3534-2.2006, IDT)
3 Terms and definitions
The terms and definitions defined in GB/T 2036, GB/T 2828.1-2012, GB/T 3358.2-2009 and the following apply to this document.
3.1
Products produced by the same manufacturer using the same materials, manufacturing processes and methods.
Note. Products are structurally similar even if there are differences in enclosure size and ratings.
The results can be combined.
4 Sampling system
4.1 Batch formation and identification
Products should be grouped into identifiable lots or sub-lots. Where practicable, each lot should consist of a single type, grade, category, size and
The components are produced at substantially the same time and under the same conditions.
4.2 Sampling
4.2.1 Method of sampling
The samples shall be selected by simple random sampling (see 1.2.24 of GB/T 3358.2-2009).
If the sample size of each sub-batch or stratum is smaller than that of the sub-batch or stratum, a stratified sampling method should be used according to reasonable standards so that the sub-sample size of each sub-batch or stratum is consistent with the size of the sub-batch or stratum.
Small is proportional.
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