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GB/T 31988-2015: Aluminium base copper clad laminate for printed circuits
Status: Valid
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 31988-2015 | English | 509 |
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Aluminium base copper clad laminate for printed circuits
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GB/T 31988-2015
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PDF similar to GB/T 31988-2015
Standard similar to GB/T 31988-2015 GB/T 12631 GB/T 45638 GB/T 19405.3 Basic data | Standard ID | GB/T 31988-2015 (GB/T31988-2015) | | Description (Translated English) | Aluminium base copper clad laminate for printed circuits | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L30 | | Classification of International Standard | 31.180 | | Word Count Estimation | 24,220 | | Date of Issue | 2015-09-11 | | Date of Implementation | 2016-05-01 | | Quoted Standard | GB/T 2036; GB/T 3198; GB/T 3880.1; GB/T 3880.2; GB/T 3880.3; GB/T 4722; GB/T 5230 | | Regulation (derived from) | National Standard Announcement 2015 No.25 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This Standard specifies the aluminum printed circuits copper clad laminates product classification, identification, structure and materials, appearance, size and performance requirements, test methods, inspection rules, packaging, labeling, transportation and storage. This Standard applies to aluminum printed circuits copper clad laminates (hereinafter referred to as aluminum clad). | GB/T 31988-2015: Aluminium base copper clad laminate for printed circuits---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
(Printed circuits aluminum copper clad laminates)
ICS 31.180
L30
National Standards of People's Republic of China
Aluminum printed circuits copper clad laminates
Issued on. 2015-09-11
2016-05-01 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
Table of Contents
Introduction Ⅲ
1 Scope 1
2 Normative references 1
3 Terms and definitions
4 Categories, Types and Identification 2
4.1 Categories 2
4.2 Type 2
4.3 Product Identification 2
5 structures and materials 3
3 5.1 Structure
5.2 material 4
6 Requirement 4
6.1 Appearance 4
6.2 Size 5
6.3 Performance Requirements 7
7 Test methods 8
8 7.1 Appearance
7.2 Size 8
7.3 Thermal conductivity (insulating bonding layer) 8
7.4 Thermal Resistance 9
7.5 The peel strength 9
7.6 9 Flammability
7.7 Thermal Stress 9
9 7.8 Glass transition temperature
9 7.9 Chemical resistance
Electric strength 9 7.10
Volume resistivity and surface resistivity of 7.11 9
7.12 dielectric constant and dielectric loss tangent 9
7.13 comparative tracking index 9
7.14 Withstanding Voltage (Hi-pot) test 9
Water absorption 9 7.15
10 8 Inspection Rules
8.1 Identification Test 10
8.2 Quality conformance inspection 11
8.3 clearances 12
8.4 Material Safety Data Sheet 12
9 packaging, labeling, transportation and storage 12
9.1 Packaging 12
9.2 mark 12
9.3 Transportation and storage 12
Appendix A (normative) thermal resistance and thermal conductivity test methods 13
A.1 Scope 13
A.2 Terms and definitions 13
A.3 Principle 13
A.4 Instrument 14
A.5 Sample 15
A.6 program 15
A.7 Calculation 15
A.8 Report 17
Appendix B (normative) Withstanding Voltage (Hi-pot) test 18
B.1 Scope 18
B.2 test device 18
B.3 Sample 18
B.4 program 19
B.5 Report 19
B.6 Note 20
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
The standard equipment by the National Standardization Technical Committee and the semiconductor material (SAC/TC203) and focal points.
This standard was drafted. Guangdong health benefits Technology Co., Ltd., China Electronics Standardization Institute, the national electronic circuit substrate ENGINEERING
Process technology research center, Shaanxi Shengyi Technology Co., Ltd.
The main drafters of this standard. Su sound, Liu Yun, Cai Qiaoer, Caiwen Ren, Zhang, She Naidong, Yang Yan, Wang Jinrui, Liushen Xing, Wang Xiang, Qi tube,
Peikuai Chuan.
Aluminum printed circuits copper clad laminates
1 Scope
This standard specifies the printed circuit with aluminum copper clad laminate product classification, identification, structure and materials, appearance, size and performance to
Requirements, test methods, inspection rules, packaging, labeling, transportation and storage.
This standard applies to aluminum printed circuits copper clad laminates (hereinafter referred to as aluminum clad).
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 2036 Printed Circuit Terminology
GB/T 3198 aluminum and aluminum alloy foil
GB/T 3880.1 General industrial aluminum and aluminum alloy sheet, strip - Part 1. General requirements
GB/T 3880.2 General industrial aluminum and aluminum alloy sheet, strip Part 2. Mechanical Properties
GB/T 3880.3 General industrial aluminum and aluminum alloy sheet, strip Part 3. size deviation
GB/T 4722 printed circuits copper clad laminates Test Method
GB/T 5230 electrolytic copper foil
3 Terms and Definitions
GB/T 2036 defined by the following terms and definitions apply to this document.
3.1
Thermal conductivity thermalconductivity
Under steady state, through the material per unit time per unit area and the temperature gradient perpendicular to the direction of heat flow area.
Note. For non-homogeneous materials, this is the apparent thermal conductivity, in this standard, referred to as thermal conductivity, the unit opened in Watts per meter [W/(m · K)] FIG.
3.2
Homogeneous material homogeneousmaterial
The nature of any position inside are the same material.
3.3
Thermal thermalresistance
Heat resistance in heat flow path encountered reflect the size of the heat transfer capability of the medium or media room, indicating the heat per unit area 1W
The size of the temperature rise caused.
Note. The thermal resistance per watt unit with a square opening [m2 · K/W] FIG.
3.4
Aluminum copper clad laminates aluminiumbasecoppercladlaminate
Sheet aluminum, the insulating adhesive layer and a copper foil three kinds of composite sheet material, referred to as the aluminum clad. It is used to make printed circuits
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