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GB/T 31476-2015: Requirements for solders for high-quality interconnections in electronics assembly
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 31476-2015 | English | 379 |
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Requirements for solders for high-quality interconnections in electronics assembly
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GB/T 31476-2015
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Basic data | Standard ID | GB/T 31476-2015 (GB/T31476-2015) | | Description (Translated English) | Requirements for solders for high-quality interconnections in electronics assembly | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H21 | | Classification of International Standard | 29.045 | | Word Count Estimation | 18,124 | | Date of Issue | 2015-05-15 | | Date of Implementation | 2016-01-01 | | Quoted Standard | GB/T 3260.1; GB/T 3260.2; GB/T 3260.3; GB/T 3260.4; GB/T 3260.5; GB/T 3260.6; GB/T 3260.7; GB/T 3260.8; GB/T 3260.9; GB/T 3260.10; GB/T 10574.1; GB/T 10574.2; GB/T 10574.3; GB/T 10574.4; GB/T 10574.5; GB/T 10574.6; GB/T 10574.7; GB/T 10574.8; GB/T 10574.9; GB/T 10574.10; GB/T 10574.11; GB/T 10574.12; GB/T 10574.13; GB/T 31474; GB/T 31475; SJ/T 11390; YS/T 746.1; YS/T 746.2; YS/T 746.3; YS/T 746.4; YS/T 746.5; YS/T 746.6; YS/T 746.7; YS/T 746.8; YS/T 746.9; YS/T 746.10; YS/T 746.11; YS/T 746.12; YS/T 746.13; YS/T 746.14; YS/T 746.15; YS/T 746.16; ISO 9453 | | Regulation (derived from) | National Standard Announcement 2015 No. 15 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This Standard specifies the electronic assembly interconnect solder quality classification, technical requirements, test methods, inspection rules and product labeling, packaging, transportation and storage. This Standard applies to electronic product assembly and brazing solder connection, including leaded solder, lead-free solder and special solder. | GB/T 31476-2015: Requirements for solders for high-quality interconnections in electronics assembly
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Requirements for solders for high-quality interconnections in electronics assembly
ICS 29.045
H21
National Standards of People's Republic of China
Electronics assembly quality interconnect with solder
Issued on. 2015-05-15
2016-01-01 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
Table of Contents
Preface Ⅰ
1 Scope 1
2 Normative references 1
3 Terms and definitions
4 classification and marking 2
5 2 Technical Requirements
6 Test methods 8
7 Inspection rules 9
8 signs, packaging, transportation and storage 10
9 11 Quality Certificate
Appendix A (informative) electronic solder melting temperature of 12
Foreword
This standard and GB/T 31474-2015 "electronic assembly interconnect with high flux" and GB/T 31475-2015 "electronic device
Associated with high quality interconnect solder paste "a complete electronic welding material standard series.
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
Please note that some of the content of this document may involve patents. Release mechanism of the present document does not assume responsibility for the identification of these patents.
The standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This standard by the National Standardization Technical Committee of the printed circuit (SAC/TC47) centralized.
This standard was drafted. Chongqing University of Technology, Ministry of Information Industry materials for Quality Supervision and Inspection Center, China Electronics Standardization Institute
Study hospital, Guangdong Anson tin products Manufacturing Co., Ltd., Yunnan Tin Co., Shenzhen special dual CD-Chemical Development Co., Ltd., sure love France
Metal Co., Ltd., Zhejiang strong solder materials Co., Ltd., Zhejiang, a far Electronic Technology Co., Ltd., Dongguan City Kuril metal tin Commodities Limited
Division, Electronic Guang Xi Tai Welding Material Co., Ltd. Hong Tin Co., Ltd. Hunan Chenzhou.
Drafters of this standard. Du Changhua, He Xiukun, Xian display, right Liu, Zhang Hui, Litian Min, Ruan Jinquan, Tuqiang Zhao, Yuhong Gui, Huang Shouyou,
Wuyong Tian, \u200b\u200bJiang Jinguang.
Electronics assembly quality interconnect with solder
1 Scope
This standard specifies the standard electronic assembly interconnect with solder quality classification, technical requirements, test methods, inspection rules and product
Chi, packaging, transportation, storage.
This standard applies to electronic products assembly soldered with solder, including leaded solder, lead-free solders and special solders.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 3260 (all parts), chemical analysis of tin
GB/T 10574 (all parts), chemical analysis of tin Method
GB/T 31474 electronics assembly quality interconnect Flux
GB/T 31475 quality electronic assembly interconnect with solder paste
SJ/T 11390 Test method for lead-free solder
YS/T 746 (all parts) lead-free tin-based solders chemical analysis
ISO 9453 soft solder alloy chemical composition and morphology (Softsolderaloys-Chemicalcompositionsand
forms)
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1
Alloy aloy
Combination of two or more elements made of a material with metallic properties.
3.2
Solder solder
Melting point used for brazing alloy 450 ℃ lower than the connection, also known soft solder.
3.3
Leaded solder containingPbsolder
Lead content greater than 0.10% (by mass) of the solder.
3.4
Lead-free solder Pb-freesolder
Lead content of not more than 0.10% (by mass) of the solder.
3.5
Flux flux
In the brazing process can help promote solder flow and interfacial reaction of chemicals used.
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