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GB/T 28162.3-2011 English PDF

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GB/T 28162.3-2011: Packaging of components for automatic handing -- Part 3: Packaging of surface mount components on continuous tapes
Status: Valid
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GB/T 28162.3-2011English454 Add to Cart 4 days [Need to translate] Packaging of components for automatic handing -- Part 3: Packaging of surface mount components on continuous tapes Valid GB/T 28162.3-2011

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Basic data

Standard ID GB/T 28162.3-2011 (GB/T28162.3-2011)
Description (Translated English) Packaging of components for automatic handing -- Part 3: Packaging of surface mount components on continuous tapes
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L08
Classification of International Standard 31.020
Word Count Estimation 23,290
Date of Issue 2011-12-30
Date of Implementation 2012-07-01
Quoted Standard IEC 60191-2-1966; IEC 61340-5-1-1998; IEC 61340-5-2-1999; IEC 62258-3-2005; ISO/IEC 16388-1999; ISO 11469-2000
Adopted Standard IEC 60286-3-2007, IDT
Regulation (derived from) National Standard Approval Announcement 2011 No.23
Issuing agency(ies) General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary This standard applies to electrical connections and leadless or leaded column Tape packaging of electronic components. This section contains only the essential components with packaging tape size. This section also includes a single-chip products (including bare chip and with a bump chip (flip chip)) with the relevant requirements of the package.

GB/T 28162.3-2011: Packaging of components for automatic handing -- Part 3: Packaging of surface mount components on continuous tapes


---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Packaging of components for automatic handing.Part 3. Packaging of surface mount components on continuous tapes ICS 31.020 L08 National Standards of People's Republic of China Automatic operation of the packaging components Part 3. surface mount components In a continuous belt on the packaging Packagingofcomponentsforautomatichanding-Part 3. Packagingofsurface (IEC 60286-3..2007, IDT) 2011-12-30 release 2012-07-01 Implementation General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China China National Standardization Management Committee released Directory Preface I 1 General 1 1.1 Scope 1 1.2 Normative references 1

2 terms and definitions

3 standard structure 1 3.1 Type Ⅰ --- Punch-type carrier tape with upper and lower cover (8mm and 12mm) 3.2 Type II - Bubble carrier tape with unilateral locating holes (8mm, 12mm, 16mm and 24mm) 3.3 Type Ⅲ --- Bubble carrier tape with double positioning hole (bandwidth is 32mm ~.200mm) 6 3.4 Type IV - Punch-type plastic carrier tape for back-to-back bonding of single bare chip and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) The polarity and orientation of the components in the carrier tape 4.1 All types 12 4.2 with shaft 13 5 parts of the fixed and additional requirements on the carrier tape 13 All types of 13 5.2 Requirements for type I, type II and type III covers 5.3 Special requirements for type IV carrier tape 14 5.4 Stripping force of cover tape (Type I, Type II and Type III only) 14 5.5 Minimum bending radius (for all types of carrier tape) 14 5.6 Pulling force of cover tape (type I, type II and type III only) 15 5.7 Material of the carrier tape 15 5.8 Curvature 15 6 Special requirements for carrier tape carrying chip products 16 6.1 Design of carrier tape with chip product 16 6.2 Cleaning 16 6.3 Transverse of components (type I and type II) 16 7 Packaging 16 7.1 Guide belt and tail belt 16 7.2 Reel 17 7.3 missing components 19 8 logo 19

Foreword

Automatic operation of the components of the packaging standards from the following components. - Part 1. Packaging of components with axial leads on continuous tapes (IEC 60286-1..1997); - Part 2. Packaging with unidirectional lead elements on continuous tapes (IEC 60286-2..1997); - Part 3. Packaging of surface mount components on continuous tapes (IEC 60286-3..2007); - Part 4. Adhesive hoppers for electronic components encapsulated in E and G packages (IEC 60286-4..1997); - Part 5. Matrix tray (IEC 60286-5..2003); Part 6. Packaging of bulk packaging for surface mount components (IEC 60286-6..2004). This part is the third part of the packaging standard for automatic operation components. This part is drafted in accordance with the rules given in GB/T 1.1-2009. This part uses the translation method equivalent to IEC 60286-3..2007 "Packaging of automatic operation components Part 3. Surface mounting elements Device in continuous tape "(English version). For ease of use, the following editorial changes have been made to IEC 60286-3..2007 in this part. --- remove IEC preface; --- increase the number in Note 2; --- the number "," to "." This part is made by the Ministry of Industry and Information Technology of the People's Republic of China. This part is headed by the National Standardization Technical Committee for Electronic Components and Capacitors (SAC/TC165). This part of the drafting unit. China Electronic Technology Standardization Institute (CESI). This part of the main drafters. Peng Wei, Zhang Qiu. Automatic operation of the packaging components Part 3. surface mount components In a continuous belt on the packaging

1 General

1.1 Scope This part of GB/T 28162 is suitable for beltless packaging of leadless or leaded electronic components connected to the circuit. This part Including only the size of the tape that is critical for component packaging. This part also covers the requirements for packaging of single-chip products, including bare chips and bumped chips (flip chip). 1.2 Normative references The following documents are indispensable for the application of this document. For dated references, only the dated edition applies to this article Pieces. For undated references, the latest edition (including all modifications) applies to this document. IEC 60191-2. 1966 Mechanical standards for semiconductor devices - Part 2. Dimensions (Mechanicalstandardizationofsemi- conductordevices-Part 2. Dimensions) Electrostatics - Part 5-1. Antistatic requirements for electronic components - Electrostatics - Part 5-1. Protectionofelectronicdevicesfromelectrostaticphenomena-Generalrequirements Electrostatics - Part 5-2. Guidelines for the use of antistatic agents for electronic components (IEC 61340-5-2..1999) Part 5-2. Protectionofelectronicdevicesfromelectrostaticphenomena-Userguide) IEC 62258-3..2005 Semiconductor chip products - Part 3. Recommended methods for automatic handling, packaging and storage (Semicon- ductordieproducts-Part 3. Recommendationsforgoodpracticeinhanding, packingandstorage) ISO /IEC 16388..1999 Information technology - Automatic identification and data acquisition techniques Bar code Symbol specification code 39 (Infor- mationtechnology-Automaticidentificationanddatacapturetechniques-Barcodesymbologyspeci- fications-code39) ISO 11469..2000 Identification and marking of plastic and plastic products (Plastics-Genericidentification and Markingof plasticsproducts

2 terms and definitions

Using the following terms and definitions. 2.1 Packaging In the automatic assembly, operation and transmission process used to fill, protect the product arrangement of the packaging material should be any natural materials.

3 standard structure

The various packaging types are classified as follows. Type Ⅰ --- Punch-type carrier tape with upper and lower cover (8mm and 12mm)

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