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GB/T 19922-2005 English PDF

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GB/T 19922-2005: Standard test methods for measuring site flatness on silicon wafers by noncontact scanning
Status: Valid
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GB/T 19922-2005English259 Add to Cart 3 days [Need to translate] Standard test methods for measuring site flatness on silicon wafers by noncontact scanning Valid GB/T 19922-2005

PDF similar to GB/T 19922-2005


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Basic data

Standard ID GB/T 19922-2005 (GB/T19922-2005)
Description (Translated English) Standard test methods for measuring site flatness on silicon wafers by noncontact scanning
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard H17
Classification of International Standard 77.040.01
Word Count Estimation 10,111
Date of Issue 2005-09-19
Date of Implementation 2006-04-01
Adopted Standard ASTM F1530-1994, MOD
Regulation (derived from) Announcement of Newly Approved National Standards No. 12 of 2005 (No. 86 overall)
Issuing agency(ies) General Administration of Quality Supervision, Inspection and Quarantine of the People Republic of China, China National Standardization Administration Committee
Summary This standard specifies the capacitive displacement sensing method for the determination of local flatness of the wafer surface method. This standard applies to non-contact, non-destructive measurement of dry, clean the surface of the semiconductor wafer local flatness. For more than 100mm in diameter and thickness of 250��m and above corrosion, polished and epitaxial wafers.

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