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GB/T 17473.4-2008: Test methods of precious metals pastes used for microelectronics -- Determination of adhesion
Status: Valid GB/T 17473.4: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 17473.4-2008 | English | 139 |
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Test methods of precious metals pastes used for microelectronics -- Determination of adhesion
| Valid |
GB/T 17473.4-2008
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| GB/T 17473.4-1998 | English | 239 |
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Test methods of precious metal pastes used for thick film microelectronics--Determination of adhesion
| Obsolete |
GB/T 17473.4-1998
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PDF similar to GB/T 17473.4-2008
Basic data | Standard ID | GB/T 17473.4-2008 (GB/T17473.4-2008) | | Description (Translated English) | Test methods of precious metals pastes used for microelectronics -- Determination of adhesion | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H68 | | Classification of International Standard | 77.120.99 | | Word Count Estimation | 6,688 | | Date of Issue | 2008-03-31 | | Date of Implementation | 2008-09-01 | | Older Standard (superseded by this standard) | GB/T 17473.4-1998 | | Quoted Standard | GB/T 8170 | | Regulation (derived from) | National Standard Approval Announcement 2008 No.5 (Total No.118) | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This standard specifies the method for the determination of precious metal microelectronics slurry adhesion. This section applies to microelectronics-Determination of adhesion of precious metal pastes. | GB/T 17473.4-2008: Test methods of precious metals pastes used for microelectronics -- Determination of adhesion
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Test methods of precious metals pastes used for microelectronics. Determination of adhesion
ICS 77.120.99
H68
National Standards of People's Republic of China
Replacing GB/T 17473.4-1998
Microelectronics precious metal pastes used test method
Determination of adhesion
Posted 2008-03-31
2008-09-01 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
Foreword
This standard is GB/T 17473-1998 "precious metal pastes used for thick film microelectronics test methods" (all parts) Integration repair
Book is divided into seven sections.
--- GB/T 17473.1-2008 microelectronics test method for measuring precious metal slurry solids content;
--- GB/T 17473.2-2008 microelectronics test method for measuring the fineness of precious metal pastes;
--- GB/T 17473.3-2008 microelectronics precious metal pastes used test method for measuring the resistance parties;
--- GB/T 17473.4-2008 microelectronics adhesion testing precious metal pastes used test methods;
--- GB/T 17473.5-2008 microelectronics precious metal slurry viscosity measurement test methods;
--- GB/T 17473.6-2008 microelectronics resolution measurement test methods of precious metal pastes;
--- GB/T 17473.7-2008 microelectronics precious metal pastes used test methods weldability, resistance to soldering determination.
This section GB/T of Part 417473-2008.
This Part replaces GB/T 17473.4-1998 "precious metal pastes used for thick film microelectronics Test Method for Determination of adhesion."
This portion of the GB/T 17473.4-1998 compared to the main changes are as follows.
--- The original standard name is amended as. microelectronics precious metal pastes used test methods - Determination of adhesion;
--- Removing the original standard content "non-noble metals electronic pastes adhesion assay can also be performed with reference to this standard";
--- Increased SnAg3.0Cu0.5 for lead-free solder welding conductor;
--- Replace the original standard belt tunnel furnace sintering furnace;
--- Increasing the temperature control of lead-free solder.
This part is proposed by the China Nonferrous Metals Industry Association.
The non-ferrous metal part by the National Standardization Technical Committee.
This section is your research Platinum Ltd. is responsible for drafting.
The main drafters of this section. Liu Jisong Chen Qiao, Zhao Ling, Chen Fusheng, Liu Cheng, Zhuwu Xun, Li Jin.
This part of the standard replaces the previous editions are.
--- GB/T 17473.4-1998.
Microelectronics precious metal pastes used test method
Determination of adhesion
1 Scope
This section provides test methods microelectronics precious metal pastes adhesion.
This section applies to microelectronics precious metal pastes adhesion assay.
2 Normative references
The following documents contain provisions which, through reference in this text, constitute provisions of this part. For dated references, subsequent
Amendments (not including errata content) or revisions do not apply to this section, however, encourage the parties to this part of the research agreement
Whether the latest versions of these documents. For undated reference documents, the latest versions apply to this section.
GB/T 8170 numerical rounding rules
3 PRINCIPLE OF THE METHOD
After the copper wire soldered to the ceramic substrate layer printed graphics cooked noble metal slurry on the copper surface perpendicular to the substrate is bent 90 °, placed
The average of the tensile testing machine at a constant speed from the substrate evenly pull off the lead, with the lead when the pull-off force to represent the attached slurry
Focus.
4 Materials
4.1 Al2O3 purity of not less than 95% of the ceramic substrate, the surface roughness in the range of 0.5μm ~ 1.5μm (measured at a distance of 10mm
Under the conditions of measurement).
4.2 HLSn63PbA or HLSn63PbB Xiqianhanliao; HLSn63PbAgA HLSn63PbAgB or tin-lead-silver solder; SnAg3.0Cu0.5
Lead-free solder.
4.3 tinned copper wire having a diameter of 0.8mm ± 0.02mm.
4.4 capacity not less than 150mL solder bath.
4.5 Flux. rosin alcohol solution, the concentration of 0.15g/mL ~ 20g/mL.
5 instruments and equipment
5.1 tensile testing machine. range is 0N ~ 100N, accurate measurement and recording of the pulling force should reach ± \u200b\u200b5%.
5.2 screen printing machine, the screen pore size of 74μm.
5.3 tunnel sintering furnace, the maximum temperature of 1000 ℃, temperature control accuracy of ± 10 ℃.
5.4 Thickness. accuracy of 1μm.
6 measuring step
At a temperature of 15 ℃ ~ 35 ℃, relative humidity of 45% to 75%, measured at atmospheric pressure 86kPa ~ 106kPa conditions.
6.1 Preparation of slurry film
6.1.1 The submission slurry Stir in central ceramic substrate printed 2mm × 2mm graphics, graphics should look uniform. each
The total number of copies printed sample of not less than 10.
6.1.2 The printed pattern is a ceramic substrate at 150 ℃ ~ 200 ℃ drying, depending on the sintering temperature firing slurry deposition.
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