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GB/T 17473.3-2008: Test methods of precious metals pastes used for microelectronics -- Determination of sheet resistance
Status: Valid GB/T 17473.3: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 17473.3-2008 | English | 169 |
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Test methods of precious metals pastes used for microelectronics -- Determination of sheet resistance
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GB/T 17473.3-2008
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| GB/T 17473.3-1998 | English | 279 |
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Test methods of precious metal pastes used for thick film microelectronics--Determination of sheet resistance
| Obsolete |
GB/T 17473.3-1998
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Basic data | Standard ID | GB/T 17473.3-2008 (GB/T17473.3-2008) | | Description (Translated English) | Test methods of precious metals pastes used for microelectronics -- Determination of sheet resistance | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H68 | | Classification of International Standard | 77.120.99 | | Word Count Estimation | 7,788 | | Date of Issue | 2008-03-31 | | Date of Implementation | 2008-09-01 | | Older Standard (superseded by this standard) | GB/T 17473.3-1998 | | Quoted Standard | GB/T 8170 | | Regulation (derived from) | National Standard Approval Announcement 2008 No.5 (Total No.118) | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This standard specifies the determination of microelectronics precious metal pastes Chinese resistance. This section applies to microelectronics precious metal slurry sheet resistance measurement. | GB/T 17473.3-2008: Test methods of precious metals pastes used for microelectronics -- Determination of sheet resistance
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Test methods of precious metals pastes used for microelectronics. Determination of sheet resistance
ICS 77.120.99
H68
National Standards of People's Republic of China
Replacing GB/T 17473.3-1998
Microelectronics precious metal pastes used test method
Square resistance measurement
Posted 2008-03-31
2008-09-01 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
Foreword
This standard is GB/T 17473-1998 "precious metal pastes used for thick film microelectronics test methods" (all parts) Integration repair
Book is divided into seven sections.
--- GB/T 17473.1-2008 microelectronics test method for measuring precious metal slurry solids content;
--- GB/T 17473.2-2008 microelectronics test method for measuring the fineness of precious metal pastes;
--- GB/T 17473.3-2008 microelectronics precious metal pastes used test method for measuring the resistance parties;
--- GB/T 17473.4-2008 microelectronics adhesion testing precious metal pastes used test methods;
--- GB/T 17473.5-2008 microelectronics precious metal slurry viscosity measurement test methods;
--- GB/T 17473.6-2008 microelectronics resolution measurement test methods of precious metal pastes;
--- GB/T 17473.7-2008 microelectronics precious metal pastes used test methods weldability, resistance to soldering determination.
This section GB/T 17473-2008 Part 3.
This Part replaces GB/T 17473.3-1998 "precious metal pastes used for thick film microelectronics test method for measuring the resistance side."
This portion of the GB/T 17473.3-1998 compared to the main changes are as follows.
--- Modify the original standard name for the microelectronics precious metal pastes used test method for measuring the resistance parties;
--- Increase the determination of low temperature curing type paste square resistance;
--- The original principle of the standard, "the paste by screen printing on the ceramic substrate after sintering at a certain temperature and film thickness, width
Degree under the same circumstances "was changed to." The slurry was screen-printed on a ceramic substrate or an organic resin substrate, or sintered
After curing, the thickness of the film at a certain temperature and, in the case of constant width ";
--- Thickness amended as follows. light microscopic thickness for cutting sintered paste. range 0mm ~ 5mm, accuracy of 0.001mm.
Micrometer for curing paste. range 0mm ~ 5mm, accuracy of 0.001mm.
This section of Appendix A normative appendix.
This part is proposed by the China Nonferrous Metals Industry Association.
The non-ferrous metal part by the National Standardization Technical Committee.
This section is your research Platinum Ltd. is responsible for drafting.
The main drafters of this section. Do not destroy gold, Liu Jisong, Li Wenlin, Chen Fusheng, Zhuwu Xun, Li Jin.
This part of the standard replaces the previous editions are.
--- GB/T 17473.3-1998.
Microelectronics precious metal pastes used test method
Square resistance measurement
1 Scope
This section provides test methods microelectronics precious metal pastes square resistance.
This section applies to microelectronics precious metal pastes square resistance measurement.
2 Normative references
The following documents contain provisions which, through reference in this text, constitute provisions of this part. For dated references, subsequent
Amendments (not including errata content) or revisions do not apply to this section, however, encourage the parties to this part of the research agreement
Whether the latest versions of these documents. For undated reference documents, the latest versions apply to this section.
GB/T 8170 numerical rounding rules
3 PRINCIPLE OF THE METHOD
Paste by screen printing on a ceramic substrate or an organic resin substrate, sintered or cured, and the film thickness at a certain temperature, a width
Under the same circumstances, the resistance is proportional to the length of the film and the film strip. By measuring the resistance of a predetermined length of the film is calculated sheet resistance.
4 Materials
Substrate. not less than 95% purity alumina substrate or an organic resin, a surface roughness of 0.5μm ~ 1.5μm (measured at a distance of
Measured under conditions of 10mm).
5 instruments and equipment
5.1 Digital resistance \\ Voltage Meter
Range 100μΩ ~ 100MΩ, with a resolution of six significant figures, the four-wire measurements.
5.2 ultra-high-resistance insulation resistance meter
In the range of 1 × 105Ω ~ 1 × 1017Ω, an accuracy of ± 2%.
5.3 Thickness
5.3.1 light microscopy thickness cut
Range 0mm ~ 5mm, accuracy of 0.001mm.
5.3.2 micrometer
Range 0mm ~ 5mm, accuracy of 0.001mm.
5.4 Screen Printing Machine
5.5 infrared oven
Maximum use temperature of 300 ℃, temperature control accuracy of ± 5 ℃.
5.6 tunnel sintering furnace
Maximum use temperature of 1000 ℃, temperature control accuracy of ± 10 ℃.
6 Test Procedure
Experimental Environmental requirements. Ambient temperature of 15 ℃ ~ 35 ℃, relative humidity of 45% to 75%, atmospheric pressure is 86kPa ~ 106kPa.
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