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GB/T 13555-2017: Copper-clad polyimide film laminates for flexible printed circuits
Status: Valid GB/T 13555: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 13555-2017 | English | 359 |
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Copper-clad polyimide film laminates for flexible printed circuits
| Valid |
GB/T 13555-2017
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| GB/T 13555-1992 | English | 279 |
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3 days [Need to translate]
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Flexible copper clad material for printed circuits
| Obsolete |
GB/T 13555-1992
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PDF similar to GB/T 13555-2017
Standard similar to GB/T 13555-2017 GB/T 12631 GB/T 13557 GB/T 13556 Basic data | Standard ID | GB/T 13555-2017 (GB/T13555-2017) | | Description (Translated English) | Copper-clad polyimide film laminates for flexible printed circuits | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L30 | | Classification of International Standard | 31.180 | | Word Count Estimation | 18,191 | | Date of Issue | 2017-12-29 | | Date of Implementation | 2019-01-01 | | Older Standard (superseded by this standard) | GB/T 13555-1992 | | Regulation (derived from) | National Standards Bulletin 2017 No. 32 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | GB/T 13555-2017: Copper-clad polyimide film laminates for flexible printed circuits---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Copper-clad polyimide film laminates for flexible printed circuits
ICS 31.180
L30
National Standards of People's Republic of China
Replacing GB/T 13555-1992
Polyimide film copper clad laminate for flexible printed circuit
2017-12-29 Posted
2019-01-01 implementation
General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
China National Standardization Administration released
Directory
Foreword Ⅲ
1 Scope 1
2 Normative references 1
3 Terms and definitions 1
4 product classification, identification, structure and classification 1
4.1 Classification 1
4.2 logo 2
4.3 Structure 2
4.4 Rating 2
5 material 2
5.1 polyimide base film 2
5.2 Adhesive 3
5.3 copper foil 3
6 Requirements and test methods 4
6.1 General requirements and test methods 4
6.2 Performance requirements and test methods 5
7 inspection rules 8
7.1 Identification test 8
7.2 Quality consistency test 9
8 Packaging, marking, transportation and storage 11
8.1 Packaging 11
8.2 logo 12
8.3 Transportation 12
8.4 Storage and shelf life 12
Ordering documents 12
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
This standard replaces GB/T 13555-1992 "printed circuit with flexible copper clad polyimide film."
This standard compared with GB/T 13555-1992, the main changes.
--- The standard name changed to "flexible printed circuit with polyimide film CCL";
--- Added Chapter 3 terms and definitions;
--- 4.1 product models increased from 2 models to 5 models;
--- 5.2 increased the thickness of the adhesive layer and tolerance requirements, delete GB/T 13555-1992 in 4.3 copper foil and polyimide
The recommended combination of films;
--- 6.1.1 respectively, the copper foil surface, the basement membrane surface and the secondary surface requirements;
--- 6.1.2 increased product size and tolerance requirements;
--- Increased 6.2 Peel strength, dimensional stability and bending fatigue requirements; Delete GB/T 13555-1992 Table 8
After immersion solvent and simulated plating conditions Peel strength retention rate requirements; increased thermal stress (floating welding), folding resistance, resistance
Pharmaceutical and water absorption requirements; increase the performance requirements of adhesive-free products;
--- Chapter 8 added a roll of product joints and core tube requirements;
--- Added Chapter 9 ordering documents requirements.
Please note that some of this document may be patentable. The issuing agencies of this document do not bear the responsibility of identifying these patents.
This standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This standard by the National Standardization Technical Committee printed circuit board (SAC/TC47) centralized.
This standard is drafted in. Jiujiang Folaikesi Co., Ltd.
Participated in the drafting of this standard. China Electronics Standardization Institute, Michaelicon Tektronix (Changzhou) Products Services Ltd.,
Technology Co., Ltd., Guangdong Sheng Yi Technology Co., Ltd.
The main drafters of this standard. Wang Hua Zhi, Liu Ying, Cao Yi, Gao Yanru, Zhang Panxin, Fan Heping, Yang Bei, Xiong Yun, Yang Yan, Yang Hong.
This standard replaces the standards previously issued as.
--- GB/T 13555-1992.
Polyimide film copper clad laminate for flexible printed circuit
1 Scope
This standard specifies the flexible printed circuit with polyimide film CCL terminology, classification, requirements, inspection rules, packaging, marking, storage
And transportation and so on.
This standard applies to flexible printed circuit with polyimide film CCL (hereinafter referred to as flexible polyimide CCL).
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version applies to this article
Pieces. For undated references, the latest edition (including all amendments) applies to this document.
Printed circuit terminology GB/T 2036
GB/T 5230 electrolytic copper foil
GB/T 13542.6 Films for electrical insulation - Part 6. Polyimide film for electrical insulation
Test method for flexible copper clad laminates for printed circuit boards GB/T
3 Terms and definitions
GB/T 2036 and defined by the following terms and definitions apply to this document.
3.1
Secondary surface adhesivesurface
Etching or other methods to remove copper foil adhesive layer after the basement membrane surface.
3.2
Vertical machinedirection; MD
In the continuous manufacture of flexible polyimide CCL lengthwise direction, consistent with the material when the continuous production direction.
3.3
Transversely transversed; TD
The width direction of the flexible polyimide copper clad laminate is perpendicular to the MD direction.
4 product classification, identification, structure and grading
4.1 Classification
Flexible polyimide CCL according to the application of the production process and the type of adhesive can be divided into five different models. Its model and special
According to the provisions of Table 1.
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