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GB 51385-2019: (Process design standard for microwave integrated component production plant)
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(Process design standard for microwave integrated component production plant)
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GB 51385-2019
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PDF similar to GB 51385-2019
Standard similar to GB 51385-2019 GB 50694 GB 51392 GB 51377 Basic data | Standard ID | GB 51385-2019 (GB51385-2019) | | Description (Translated English) | (Process design standard for microwave integrated component production plant) | | Sector / Industry | National Standard | | Classification of Chinese Standard | P82 | | Classification of International Standard | 31.020 | | Word Count Estimation | 50,571 | | Date of Issue | 2019 | | Date of Implementation | 2019-12-01 | | Issuing agency(ies) | Ministry of Housing and Urban-Rural Development of the People's Republic of China; State Administration for Market Regulation | GB 51385-2019: (Process design standard for microwave integrated component production plant)---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
1 General
1.0.1 This standard is formulated for the purpose of standardizing the process design of microwave integrated component production plants, achieving advanced technology, safety and applicability, economical rationality, energy saving and environmental protection.
1.0.2 This standard applies to the process design of newly built, rebuilt and expanded microwave integrated component production plants.
1.0.3 In addition to conforming to this standard, the process design of the microwave integrated component production plant shall comply with the current relevant national standards.
2 terms
2.0.1 microwave integrated module
Composed of shells, substrates, components, micro-modules, and interfaces, components with specific functions in the 0.3GHz to 300GHz frequency band.
2.0.2 Process layout process layout
Space arrangement to meet product production process and output requirements.
2.0.3 Chip die
Unpackaged substrate division unit, the surface is a semiconductor integrated circuit.
2.0.4 Micro-module stage assemblies
There are tiny components with independent functions and no complete package in microwave integrated components.
2.0.5 Partial package partial package
Hermetic protection of special areas of microwave integrated components.
2.0.6 Debug adjustment
The adjustment of material, structure and size makes the product meet the specified functions and indicators.
3 overall design
3.0.1 For the overall design of the factory, various disciplines should be organized to carry out design review and design verification, and the design output should meet the requirements of the overall design outline or overall design guidance.
3.0.2 The general design outline of the factory shall include requirements for electrostatic protection, environmental protection, energy conservation, safe production, automation, and informatization.
3.0.3 The overall design of the factory should review the design of each specialty, and the professional design should meet the requirements of the overall design, and actively coordinate and optimize among the specialties.
3.0.4 The overall design of the factory should conform to the manufacturing process, and should match the expected production capacity of the factory, and meet the design requirements of single shift and weekly (monthly) production capacity.
3.0.5 The overall design of the factory should make the production, testing, and turnover links meet the requirements of product qualification rate.
3.0.6 The overall design of the factory should reasonably set the clean room area and cleanliness level according to the process requirements.
3.0.7 The overall design of the factory should adopt new technology, new technology, new equipment and new materials according to the characteristics of the production process, and create conditions for construction, commissioning and overhaul, maintenance management and safe operation, and the functional areas should be set flexibly.
3.0.8 The capacity and resource allocation of each process in the factory should meet the production needs of the product, and the workstations should be set up reasonably.
3.0.9 Elevators should be installed inside the multi-storey factory building. The flow of logistics, people and information should be reasonable and concise, and the flow should be smooth. The rhythm of semi-automatic and automatic production should match.
4 plant design
4.1 Site selection and layout
4.1.1 Site selection should be based on national and local overall planning, comprehensively considering factors such as water supply and drainage, power supply, electricity, communication facilities, traffic conditions and the environment.
4.1.2 The general layout of the factory area shall be determined according to the requirements of functional areas such as process production, power auxiliary, storage, office and management.
4.1.3 The entrances and exits for the flow of people and goods in the factory area should be set up separately.
4.1.4 The vehicle parking site in the factory area should be reasonably determined according to the number of employees, composition characteristics, and surrounding public transportation conditions, and should meet local planning requirements.
4.1.5 The production plant should be equipped with a circular fire exit, which should comply with the relevant provisions of the current national standard "Code for Fire Protection Design of Buildings" GB 50016.
4.1.6 The pavement of roads in the factory area should adopt materials with good overall performance and low dust generation.
4.1.7 Plant greening should adopt shrubs or lawns without flying catkins.
4.2 Architecture
4.2.1 The fire hazard classification of the production plant shall be Class D, and the fire resistance rating shall not be lower than Class II.
4.2.2 The division of fire protection zones of production workshops shall be determined according to the characteristics of the process and production, and the area of fire protection zones shall comply with the relevant provisions of the current national standard "Code for Fire Protection Design of Buildings" GB 50016.
4.2.3 When the intermediate warehouse is set up in the production plant, it shall comply with the following regulations.
1 Type A and Type B intermediate warehouses should be arranged against the outer wall, and the storage capacity should not exceed the required amount for 24 hours;
2 When setting up Category A, B, and C intermediate warehouses, firewalls and non-combustible floors with a fire resistance rating of not less than 1.5h should be used to separate them from the production and operation parts;
3 The intermediate warehouses of Category D and E in the production plant shall be separated from the production operation parts by the fire partition wall with a fire resistance rating of not less than 2h and the floor slab of 1h;
4 The fire resistance grade and area of the intermediate warehouse shall comply with the provisions of the current national standard "Code for Fire Protection Design of Buildings" GB 50016.
4.2.4 For each fire compartment in the production plant or each floor within a fire compartment, the number of safety exits shall be calculated and determined, and shall not be less than 2.When the building area of each floor in the fire compartment is not greater than 250m², and the number of people working at the same time in the fire compartment is not more than 20, one safety exit can be set.
4.3 Structure
4.3.1 The types and standards of anti-seismic fortification of buildings shall be determined in accordance with the current national standard GB 50223 "Standards for Classification of Seismic Fortification of Construction Engineering".
4.3.2 The deformation joints of the production plant should not pass through the clean production area.
4.3.3 The floor load of the production workshop should be greater than 500kg/m².
5 process layout
5.1 General requirements
5.1.1 The process production area of the microwave integrated component production factory shall include the production workshop and production auxiliary area.
5.1.2 The equipment and facilities in the process production area of the factory should match the production scale and process.
5.1.3 The flow of people and logistics in the process production area of the factory should be reasonably planned according to the production process to avoid crossing.
5.1.4 The area of the process production area of the factory should meet the requirements of equipment, machine positions, operating positions and turntables required for product production, and the space should be fully and rationally used.
5.1.5 The layout of the production workshop should be determined according to the type and quantity of equipment, operating space, flow of people, logistics and safety production requirements.
5.1.6 The layout of adjacent processes in the production workshop should be adjacent to each other. The assembly, testing, packaging and other processes involving chips in the production workshop should be carried out in a clean area, and other processes can be carried out in a non-clean area.
5.1.7 Transfer windows or special transfer aisles, special conveyor belts, etc. should be set between the clean area and the unclean area.
5.1.8 The transportation channel, installation port or inspection port of the production workshop shall be determined according to the equipment transportation, installation and maintenance requirements.
5.1.9 The process layout of the production workshop should ensure the space for piping and wiring and equipment maintenance.
5.1.10 The production workshop should reasonably set up environmental condition detection points.
5.1.11 The type selection of the workbench in the production workshop should have an operating space that meets the requirements of human body characteristics, machine operation, tooling transfer, and environmental engineering.
5.2 Functional division
5.2.1 The production workshop should be divided into material preparation area, cleaning area, assembly area, testing and debugging area, sealing area, coating area, environmental test area, analysis area, inspection and packaging area.
5.2.2 The material preparation area should have the functions of preparing and completing the materials and documents such as consumables, substrates, components, casings, etc., and the location should be close to the entrance of the logistics channel.
5.2.3 The cleaning area should have the cleaning function of consumables, substrates, components, shells, etc., and should meet the following requirements.
1 The cleaning area should be physically separated from other areas;
2.The cleaning area should consider the convenience of drainage, liquid drainage and ventilation, and should lean against the outer wall;
3 The cleaning area should be close to the material preparation area;
4 Water points such as pure water and deionized water should be close to the pure water station;
5.Assembly line layout should be adopted for products with large batches.
5.2.4 The assembly area should have the function of assembling substrates, components, micro-modules, casings, etc. into microwave integrated components as required, and should meet the following requirements.
1 The assembly area should include processes such as brazing, electrical assembly, clamping, patching, bonding, chip flipping, chip stacking, underfilling, and testing;
2 The assembly area should be close to the material preparation area and cleaning area;
3 The brazing process and electrical assembly process should be physically separated from other processes, and the space is relatively independent;
4 The brazing process should be close to the cleaning area to facilitate the cleaning of residues such as flux after welding;
5.The placement process should be close to the cleaning area to facilitate the cleaning of substrates and carriers;
6 The online inspection process should be set according to the needs of quality control points;
7 Trial products should adopt manual or semi-automatic assembly line according to process-oriented layout;
8 The production of multi-variety and small-batch products should adopt a process-oriented layout, and the production organization method should be suitable for the specialization of process objects;
9 A single production product should adopt a fully automatic assembly line according to the product-oriented layout, and the equipment layout meets the production process and rhythm requirements of the product.
5.2.5 The testing and debugging area shall have functions such as functional testing, DC parameter testing, full-temperature microwave parameter testing and adjustment, process testing, etc., and shall meet the following requirements.
1 The testing and debugging area should be close to the assembly area;
2 The test and debugging area should set up a relatively independent bonding and bonding debugging station, or set a bonding and bonding station for debugging in the assembly area;
3 Manual or semi-automatic test lines should be arranged according to the process orientation of DC detection, microwave testing and debugging;
4 The fully automatic test line should be arranged according to the test process of the product, and each test equipment and instrument should be configured according to the test cycle;
5 The testing and debugging area should include functional testing, DC parameter testing, microwave debugging, high and low temperature online debugging, process testing stations and corresponding equipment and instruments.
5.2.6 The sealing area shall have the function of realizing airtight packaging of microwave integrated components, and shall meet the following requirements.
1 The capping area should be close to the testing and debugging area;
2 The sealing area should be physically separated from other areas.
5.2.7 The coating area should have the function of protecting microwave integrated components, and should be physically separated from other areas.
5.2.8 The environmental test area should have the function of testing product environmental adaptability and evaluating product reliability, and should meet the following requirements.
1 The environmental test area should include test procedures such as temperature, vibration and aging;
2 The environmental test should be physically separated from other areas.
5.2.9 The analysis area should have the function of qualitative and quantitative analysis of product physical properties and chemical properties, and can be physically separated from other areas.
5.2.10 The inspection and packaging area should have the functions of final appearance inspection and packaging and shipping of finished products, and the location should be close to the exit of the logistics channel.
5.2.11 The auxiliary production area shall include material purification area, personal purification area, rest and living area.
5.2.12 The material purification area should have the function of material cleaning and purification, and should meet the following requirements.
1 The material purification area should be close to the material preparation area;
2 The material purification area should have an independent unpacking, cleaning and finishing site;
3 The air shower room or air shower channel in the material purification area can share the personal purification air shower room or air shower channel.
5.2.13 The personal decontamination area should have the functions of personnel changing clothes and air shower purification, and should meet the following requirements.
1 The personal decontamination area should be adjacent to the entrance of the production workshop;
2 The personal decontamination area should have places for changing shoes, primary changing and secondary changing;
3 The area of the air shower room or air shower channel should match the total number of personnel.
5.2.14 The rest and living area should have functions such as storage of articles, washing of clothes, and rest of personnel, and should meet the following requirements.
1 The rest and living area should be set in a non-clean area, preferably close to the personal purification area;
2 The rest and living area shall include article storage, toilet, drinking water rest area and clothes washing area;
3 The item storage area should be provided with an independent umbrella storage area and clothing storage cabinets.
6 process design requirements
6.1—General requirements
6.1.1 The design of the material preparation area, assembly area, testing and debugging area, sealing area, environmental test area, analysis area, and inspection and packaging area should comply with the relevant provisions of the current national standard "Code for Design of Clean Workshops in the Electronic Industry" GB 50472.
6.1.2 The anti-static design of the production plant shall comply with the relevant provisions of the current national standards "Code for Anti-static Design of Electronic Engineering" GB 50611 and "Code for Design of Clean Plants" GB 50073.
6.1.3 In the anti-static work area, indirect electrostatic grounding should be adopted for workbenches and shelves, and direct electrostatic grounding should be adopted for equipment and instruments.
6.1.4 The air cleanliness level of the production workshop should be determined according to the specific product. The microwave integrated components before capping should be assembled in a clean environment with a cleanliness level of 8 or better.
6.1.5 The temperature of the clean area in the production workshop should be 23°C ± 3°C, and the relative humidity should be 40% to 70%.
6.1.6 The power supply and distribution of the production workshop shall meet the configuration equipment requirements.
6.1.7 The gas required for production shall include oxygen, nitrogen, helium, argon, compressed air, nitrogen-hydrogen mixture, etc., and shall comply with the following regulations.
1 The compressed air pressure should be 0.6MPa~0.7MPa, and the dew point should be lower than -40℃ when the dew point is 0.7MPa;
2 The pressure of high-purity nitrogen should be 0.4MPa~0.7MPa, and the gas purity should be 99.999%;
3 The pressure of pure nitrogen should be 0.4MPa~0.7MPa, and the gas purity should be 99.99%;
4 The pressure of high-purity helium should be 0.4MPa~0.7MPa, and the gas purity should be 99.999%;
5 The pressure of high-purity oxygen should be 0.4MPa~0.7MPa, and the gas purity should be 99.999%;
6 The pressure of high-purity argon gas should be 0.4MPa~0.7MPa, and the gas purity should be 99.999%;
7 The pressure of high-purity nitrogen-hydrogen mixed gas (N295% H25%) should be 0.4MPa~0.7MPa, and the gas purity should be 99.999%.
6.1.8 A high-efficiency gas filter should be installed before the point of use of high-purity gas.
6.1.9 The process vacuum should be better than 0.08MPa.
6.1.10 The waterways required for production should include water supply and drainage, pure water and process cooling water, and the process cooling water should adopt a circulation system.
6.1.11 The water quality, water quantity and water pressure of pure water shall meet the requirements of the production process.
6.1.12 Demineralized water should be used for process cooling water, and the pressure at the end of use should be 0.2MPa~0.3MPa.
6.1.13 Anti-diffusion measures should be taken for production processes with large amounts of heat and dust during the production process.
6.1.14 The production workshop should be equipped with testing equipment such as differential pressure tester, temperature and humidity recorder, and air particle recorder.
6.2 Device configuration
6.2.1 The selection and configuration of equipment should be determined according to the product category and capacity planning.
6.2.2 The equipment configuration in the material preparation area shall meet the following requirements.
1 The material preparation area should be equipped with operation equipment, storage equipment and detection equipment;
2 Operational equipment should be equipped with anti-static workbench, magnifying glass, microscope, and should be equipped with coding machine, vacuum packaging machine or hot-melt sealing machine, etc.;
3 The appearance re-inspection of components and consumables should use a magnifying glass with lighting, and the microscope should be equipped with an independent light source; the chip appearance inspection should be equipped with a binocular low-power stereoscopic optical High-power stereoscopic optical microscope, the magnification should be 100 times to 1000 times;
4.Ion fans should be equipped in the area of sorting chips and other electrostatic sensitive devices in the warehouse;
5 Storage equipment should be equipped with shelves, nitrogen-filled cabinets, and drying cabinets;
6 Inspection equipment should be equipped with digital microscopes, automatic optical inspection instruments, laser film thickness testers, microwave probe test benches, electronic scales, calipers, etc.;
7 Plants with many types of materials and a high degree of informatization should be equipped with material coding machines, and the control software should be embedded in the information system of microwave integrated component production plants.
6.2.3 The configuration of equipment in the cleaning area shall meet the following requirements.
1 The equipment in the cleaning area should meet the cleaning requirements for consumables, substrates, casings, etc. during the production of microwave integrated components;
2 The cleaning area should be equipped with wet cleaning equipment, fume hood, cleaning operation table, ultrasonic cleaning machine, oven, gas phase cleaning machine and heating table should be equipped;
3 The oven and heating table should be placed separately;
4 The cleaning area should be equipped with special cleaning solvent storage cabinets;
5 The cleaning area should be equipped with a nitrogen gun.
6.2.4 The configuration of equipment in the assembly area shall comply with the following regulations.
1 The assembly area should include brazing, electrical assembly, clamping, patching, bonding, flipping, chip stacking, and testing processes. It should be equipped with material transfer boxes, plasma cleaning machines, anti-static workbenches, microscopes, etc.;
2 The brazing process should be equipped with automatic feeder, heating table, chain furnace, oven, vacuum welding furnace, brazing furnace, helium mass spectrometer leak detector, etc.;
3 The electrical installation process should be equipped with hot tables, welding robots, automatic wire stripping machines, precision rework systems, solder paste printing machines, reflow ovens, etc.;
4 The clamping process should be equipped with automatic feeder, screw automatic locking equipment, etc.;
5 The eutectic patch process should be equipped with tweezers eutectic machine, automatic friction eutectic machine, vacuum eutectic furnace, chain eutectic furnace, vapor phase welding machine, hot stage, etc.;
6 The sticking and patching process should be equipped with a manual glue dispenser or an automatic glue dispenser, an oven or a curing furnace, and an automatic placement machine should be equipped;
7 The bonding process should be equipped with manual, automatic bonding machines and micro-gap welding machines, etc.;
8 The flip-chip process should be equipped with flip-chip welding machines, bottom filling equipment, etc.;
9 Microwave integrated component production plants in the chip stacking process should be equipped with dicing machines, stacking chip loading machines, etc.;
10 The detection process should be equipped with tensile and shear force testers, X-ray detectors, and automatic optical detectors.
6.2.5 The configuration of equipment in the testing and debugging area shall comply with the following regulations.
1 The test and debugging area should be equipped with anti-static workbench, microscope, DC power supply, signal source, network analyzer, spectrum tester, noise tester, high and low temperature debugging platform, high and low temperature working box, special test tooling, etc.;
2 The test and debugging area should be equipped with automatic test equipment and microwave probe test bench;
3 The test and debugging area should be equipped with storage cabinets for special test tooling, test cables, debugging tools, and test spare parts;
6.2.6 The configuration of equipment in the capping area shall comply with the following regulations.
1 The sealing area should be equipped with parallel seam welding equipment, laser welding equipment, energy storage welding machine, electron beam welding and vacuum brazing furnace, low temperature reflow welding machine, vapor phase welding machine, laser marking machine, etc. according to the product;
2.The capping area should be equipped with coarse and fine inspection leak detection means. For microwave integrated components with airtight requirements, graded leak detection should be equipped with helium mass spectrometer leak detector, fluorine oil leak detector, optical leak detector and other testing equipment.
6.2.7 The configuration of equipment in the coating area shall meet the following requirements.
1 External coating should be equipped with automatic spraying equipment, paint spraying cabinets or fume hoods with water curtains, paint mixers, washing machines, dryers, etc.;
2 Internal coating should be equipped with vacuum vapor deposition equipment;
3 Ink marking machine or screen printing equipment for product identification.
6.2.8 The environmental test area should be equipped with high and low temperature boxes and vibration tables.
6.2.9 The analysis area should be equipped with an optical microscope with a maximum magnification of 1000 times, a thermal imaging analyzer, a wetting angle tester, a tensile shear tester, a particle collision noise tester, an X-ray detector, a scanning electron microscope, etc.
6.2.10 The inspection and packaging area should be equipped with corresponding inspection and packaging equipment according to product characteristics.
6.3 Process requirements
6.3.1 The material preparation area shall meet the following requirements.
1 The material preparation area should be divided into clean area and non-clean area, and the cleanliness level of the clean area should be 8 or better than 8;
2 The material preparation area should ensure the storage conditions such as vacuum, drying, and nitrogen protection for process accessories, consumables, and components;
3 The material preparation area should include a material testing workbench, a complete set of preparation workbench, etc.;
4 The space for placing the nitrogen charging cabinet should be equipped with equipment power interface, nitrogen, compressed air interface and anti-static grounding interface. The space for placing the dehumidifier should be equipped with equipment power interface, compressed air interface and anti-static grounding interface;
5 The space for placing automatic shelves should be equipped with equipment power interfaces and compressed air interfaces;
6 The space for placing the vacuum packaging and laminating machine should be equipped with power interface, vacuum pump and power interface or vacuum pipeline interface.
6.3.2 The process in the cleaning area should meet the following requirements.
1 The cleaning area should be divided into clean area and non-clean area, and the level of clean area should be level 8 or better than level 8;
2 The circuit substrate and components before assembly should be cleaned in a clean area, and machined parts, cavities after brazing joints and other components can be cleaned in a non-clean area;
3 The cleaning water tank should be equipped with tap water and pure water, and the countertop should bear a certain weight and be resistant to acid and alkali, aging and high temperature;
4 The exhaust system in the cleaning area should be located above the washing machine, and an appropriate margin should be reserved for the exhaust air volume;
5 The cleaning area should be equipped with pure water tanks and spray tanks according to the output and types of cleaning materials;
6 The piping of the drainage system shall be resistant to acid and alkali corrosion and immersion in organic solvents;
7 Cleaning waste liquid should be treated centrally;
8 Safety protection facilities such as eye washers should be equipped next to the washing machine;
9 The plasma cleaning machine should be equipped with high-purity gas interfaces such as argon, oxygen, and nitrogen.
6.3.3 The assembly area shall meet the following requirements.
1 The assembly area should be divided into clean area and non-clean area, and the level of clean area should be level 7;
2 On the basis of the overall lighting system in the work area, local lighting should be set up for the bonding and eutectic workstations using microscopes;
3 The magnification of the assembly microscope should be 10 times to 40 times, and the magnification of the inspection microscope should be 10 times to 100 times;
4 The brazing and electrical assembly process should be arranged in a non-clean area, and a smoke purification and filtration system should be equipped;
5 All kinds of welding furnaces and welding robots should be equipped with high-purity nitrogen ports, and should be equipped with compressed air, cooling liquid and air exhaust outlets as required;
6 The precision rework system should be equipped with compressed air interface;
7 Automatic feeder, screw automatic locking equipment, etc. should be equipped with compressed air interface;
8 Dispensing equipment should be equipped with compressed air interface;
9 Manual, semi-automatic and automatic eutectic machines should use high-purity nitrogen or nitrogen-hydrogen mixed gas, and process exhaust should be set when nitrogen-hydrogen mixed gas is used;
10 The vacuum eutectic machine should use high-purity nitrogen. If formic acid and nitrogen-hydrogen mixed gas are used, there should be a tail gas treatment device;
11 The oven and curing furnace should choose a model with programmable temperature and time, and the oven should be equipped with an exhaust system;
12 Manual, semi-automatic and automatic placement machines should be equipped with compressed air interfaces and vacuum interfaces;
13 Gold wire, silicon-aluminum wire, thick aluminum wire bonding machine and gold ribbon bonding machine should be equipped with compressed air interface, and should be equipped with vacuum interface and nitrogen interface;
14 The flip-chip welding machine should be equipped with a vacuum interface, a high-purity nitrogen interface, and should be equipped with a compressed air interface;
15 The bottom filling equipment should be equipped with compressed air interface;
16 The dicing machine used in the chip stacking process should be equipped with a vacuum interface and a compressed air interface;
17 Tensile shear force tester should be equipped with vacuum interface and compressed air interface.
6.3.4 The testing and debugging area shall comply with the following regulations.
1 The testing and commissioning area should be divided into clean area and non-clean area, and the level of clean area should be level 7;
2 The testing and debugging of microwave integrated components with chips before sealing should be carried out in a clean area;
3 The debugging area should be set as a relatively independent area in the microwave test and debugging area. When there is no separate index adjustment station in the debugging area, it is advisable to specify the corresponding bonding, electrical assembly, and bonding stations in the assembly area;
4 Screening test before chip assembly, a chip probe station can be built in the test area for testing.
6.3.5 The technical design of the capping area shall meet the following requirements.
1 The capping area should be divided into clean area and non-clean area, and the level of clean area should be level 7;
2 The main part of the sealing and welding equipment should be placed in a clean area, and the auxiliary part of the sealing and welding equipment can be placed in a non-clean area;
3 Laser sealing welding, parallel seam welding and other equipment should be equipped with glove boxes and nitrogen...
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