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GA/T 1091-2019: Specifications for evaluation of environmental adaptability of integrated circuits on 13.56 MHz in electronic certificates
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Basic data | Standard ID | GA/T 1091-2019 (GA/T1091-2019) | | Description (Translated English) | Specifications for evaluation of environmental adaptability of integrated circuits on 13.56 MHz in electronic certificates | | Sector / Industry | Public Security (Police) Industry Standard (Recommended) | | Classification of Chinese Standard | A90 | | Classification of International Standard | 35.020 | | Word Count Estimation | 18,153 | | Date of Issue | 2019 | | Date of Implementation | 2019-06-15 | | Issuing agency(ies) | Ministry of Public Security | GA/T 1091-2019: Specifications for evaluation of environmental adaptability of integrated circuits on 13.56 MHz in electronic certificates
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Specifications for evaluation of environmental adaptability of integrated circuits on 13.56 MHz in electronic certificates
ICS 35.020
A 90
GA
People's Republic of China Public Safety Industry Standard
Replaces GA 1091-2013
13.56MHz electronic certificate chip
Environmental Adaptability Evaluation Specification
Specifications for evaluation of environmental adaptability of
integrated circuits on 13.56MHz in electronic certificates
Published by the Ministry of Public Security of the People's Republic of China
Contents
Foreword ... III
1 Scope ... 1
2 Normative references ... 1
3 Terms and definitions ... 1
4 Symbols and abbreviations ... 2
5 General requirements ... 2
6 Test items ... 2
6.1 Alternating magnetic fields ... 2
6.2 Electrostatic Discharge Sensitivity ... 3
6.3 Varying field strength ... 3
6.4 Frequency of change ... 4
6.5 Varying modulation depth ... 5
6.6 Combined state subcarrier modulation signal amplitude ... 5
6.7 Stability baking ... 7
6.8 Low temperature storage ... 7
6.9 Temperature cycling ... 8
6.10 High pressure cooking ... 8
6.11 Dynamic bending ... 9
6.12 Dynamic distortion ... 9
6.13 Vibration fatigue ... 9
6.14 Shock ... 10
6.15 Adhesive strength of molding compound to frame ... 10
6.16 Point pressure ... 11
6.17 Compatibility of Card-making Processes ... 11
7 Evaluation rules ... 11
7.1 Evaluation classification ... 11
7.2 Sampling rules ... 13
7.3 Decision rules ... 13
8 Evaluation Report ... 14
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
This standard replaces GA 1091-2013 "13.56MHz-based electronic document chip environment adaptability evaluation specification", and GA 1091-2013
Compared with the main changes are as follows.
-Amended to a recommended standard.
-The unit that proposed the standard was changed to the Public Security Administration of the Ministry of Public Security (see the preface, the preface of the.2013 edition);
-Modified the normative reference document ISO /IEC 10373-6..2016 (see Chapter 2, Chapter 2 of the.2013 edition);
-Modified the normative reference document ISO /IEC 14443-1..2016 (see Chapter 2, Chapter 2 of the.2013 edition);
-The normative reference document ISO /IEC 14443-2..2016 has been modified (see Chapter 2, Chapter 2 of the.2013 edition).
Please note that some elements of this document may involve patents. The issuer of this document is not responsible for identifying these patents.
This standard is proposed by the Public Security Administration of the Ministry of Public Security.
This standard is under the jurisdiction of the Computer and Information Processing Standardization Technical Committee of the Ministry of Public Security.
This standard was drafted. First Research Institute of the Ministry of Public Security.
The main drafters of this standard. Sui Hongbo, Zhou Dongping, Xiao Tingting, Zhang Wenzhi, Zhou Peng, Han Pengxiao.
Publication of previous versions of this standard.
--GA 1091-2013.
13.56MHz-based electronic document chip environment adaptability evaluation specification
1 Scope
This standard specifies the test items based on the compatibility of electrical, climatic, mechanical environment, and card-making processes for electronic certificate chips at 13.56MHz,
Test methods and environmental adaptability evaluation rules.
This standard applies to the evaluation of electronic certificate chips using 13.56MHz RF operating mode.
2 Normative references
The following documents are essential for the application of this document. For dated references, only the dated version applies to this document.
For undated references, the latest version (including all amendments) applies to this document.
GB/T 2423.5-1995 Environmental test for electric and electronic products-Part 2. Test methods Test Ea and guidelines. Impact
GB/T 2829-2002 Sampling procedures and tables for periodic inspection and counting (applicable to inspection of process stability)
GB/T 17554.1-2006 Identification card test methods-Part 1. General characteristics test
GJB 150.4A-2009 Environmental test methods for military equipment laboratories Part 4. Low temperature test
GJB 548B-2005 Microelectronic device test methods and procedures
ISO /IEC 10373-6..2016 Identification card test methods-Part 6. Identification cards-Test methods
-Part 6. Proximity cards)
ISO /IEC 14443-1..2016 Identification cards. Contactless integrated circuit cards. Proximity cards. Part 1. Physical characteristics
cards-Contactless integrated circuit cards-Proximity cards -Part 1. Physical characteristics)
ISO /IEC 14443-2..2016 Identification cards. Contactless integrated circuit cards. Proximity cards. Part 2. RF power and signal interfaces
(Identification cards-Contactless integrated circuit cards-Proximity cards -Part 2. Radio frequency
power and signal interface)
3 terms and definitions
The following terms and definitions apply to this document.
3.1
Sample
A component formed by encapsulating a chip with a specified material and process.
3.2
Sample card
A plastic card containing a sample and antenna coil and capable of communicating with an RF card reader.
3.3
TypeA chip TypeA integrated circuit
The chip works with the Type A communication protocol defined in ISO /IEC 14443-2..2016.
3.4
TypeB chip TypeB integrated circuit
A chip that works with the Type B communication protocol defined in ISO /IEC 14443-2..2016.
4 Symbols and acronyms
The following symbols and abbreviations apply to this document.
HvA. short side displacement of the card body.
HvB. Long side displacement of the card body.
. The twist angle of the card body.
RF. Radio Frequency.
5 General requirements
The general requirements are.
a) Select the test items specified in this document according to the evaluation goals;
b) The sample provider shall provide the transmission protocol for sample communication to the evaluation agency;
c) The sample or sample card read and write function test described in this document means. first write data to the sample or sample card, then read the data,
If the read data is consistent with the written data, the sample or sample card is read and written normally; otherwise, the sample or sample card is read and written.
Dysfunction
d) When testing the sample, first connect the sample to the matching antenna coil, and then use the RF card reader to test;
When testing the sample card, directly use the RF card reader for testing;
e) The failure of reading or writing test of the sample or sample card shall not include the failure of the antenna and the card body of the sample card.
6 Test items
6.1 Alternating magnetic fields
6.1.1 Purpose
Determine the effect of the alternating magnetic field on the reading and writing functions of the sample.
6.1.2 Test requirements
The test requirements are.
a) Encapsulate the sample into a sample card;
b) frequency. 13.56 MHz;
c) Magnetic field strength. average 10 A/m (rms), maximum 12 A/m (rms);
d) Exposure time. 30 s.
6.1.3 Test method
After reading and writing according to the requirements of 4.4 in ISO /IEC 14443-1..2016, the sample card is read and written.
6.1.4 Failure criterion
Sample card read and write functions are abnormal as sample failure.
6.2 Electrostatic Discharge Sensitivity
6.2.1 Purpose
Determine the effect of static electricity on sample reading and writing functions.
6.2.2 Test requirements
The test requirements are.
a) Voltage level. not less than 3000 V;
b) Discharge method.
1) Terminal 1 discharges terminal 2;
2) Terminal 2 discharges terminal 1;
3) Terminal 1 discharges "bottom";
4) Terminal 2 discharges "bottom";
5) "bottom" discharge terminal 1;
6) "Bottom" discharges terminal 2;
c) Discharge times and intervals. 3 times for each method, with an interval of more than 1 s.
6.2.3 Test method
Perform the reading and writing function test on the sample after executing according to the requirements of 3.1 ~ 3.3 in method 3015 of GJB 548B-2005.
6.2.4 Failure criterion
Sample reading and writing functions are considered invalid.
6.3 Varying field strength
6.3.1 Purpose
Determine the effect of field strength changes on sample read and write functions.
6.3.2 Test requirements
The test requirements are.
a) Encapsulate the sample into a sample card;
b) According to ISO /IEC 14443-2..2016 6.2, the field strength values of 1.5A/m, 3.5A/m, 5.5A/m, 7.5A/m
RF workplace
c) Generate communication signal modulation waveforms of TypeA chip and TypeB chip respectively according to 8.1 and 9.1 of ISO /IEC 14443-2..2016.
6.3.3 Test method
Read and write test the sample card at each test point (see Table 1 and Table 2).
Table 1 TypeA chip change field strength test
Workplace strength
A/m
Modulation depth
1.5
100 3.5
5.5
7.5
Table 2 TypeB chip change field strength test
Workplace strength
A/m
Modulation depth
1.5
10 3.5
5.5
7.5
6.3.4 Failure criterion
At any one test point, the abnormal reading and writing function of the sample card is regarded as the sample failure.
6.4 Frequency of change
6.4.1 Purpose
Determine the effect of carrier frequency changes on sample read and write functions.
6.4.2 Test requirements
The test requirements are.
a) Encapsulate the sample into a sample card;
b) Set the carrier frequencies to 13.567 MHz, 13.56 MHz, and 13.553 MHz;
c) Generate communication signal modulation waveforms of TypeA chip and TypeB chip respectively according to 8.1 and 9.1 of ISO /IEC 14443-2..2016.
6.4.3 Test method
Read and write test the sample card at each test point (see Tables 3 and 4 for details).
Table 3 TypeA chip change frequency test
Carrier frequency
MHz
Modulation depth
13.553
100 13.56
13.567
Table 4 TypeB chip change frequency test
Carrier frequency
MHz
Modulation depth
13.553
10 13.56
13.567
6.4.4 Failure criterion
At any one test point, the abnormal reading and writing function of the sample card is regarded as the sample failure.
6.5 Varying modulation depth
6.5.1 Purpose
Determine the effect of modulation depth changes on the read and write capabilities of TypeB chip samples.
6.5.2 Test requirements
The test requirements are.
a) Encapsulate the sample into a sample card;
b) Generate the modulation waveform of TypeB chip communication signal according to 9.1 of ISO /IEC 14443-2..2016
6.5.3 Test method
Read and write test the sample card at each test point (see Table 5).
Table 5 Variation modulation depth test
Modulation depth
Carrier frequency
MHz
Workplace strength
A/m
13.56
4.5 10
6.5.4 Failure criterion
At any one test point, the abnormal reading and writing function of the sample card is regarded as the sample failure.
6.6 Combined state subcarrier modulation signal amplitude
6.6.1 Purpose
Determine the effect of changes in frequency, field strength, and modulation depth on the electrical properties of the sample.
6.6.2 Test requirements
The test requirements are.
a) Encapsulate the sample into a sample card;
b) Generate communication signal modulation waveforms for TypeA chip and TypeB chip respectively according to 8.1 and 9.1 of ISO /IEC 14443-2..2016.
6.6.3 Test method
Perform the test according to 7.2.1.2 of ISO /IEC 10373-6..2016, and test the subcarrier modulation of the return signal of the sample card at each test point
Signal amplitude (see Tables 6 and 7).
Table 6 TypeA chip combined state subcarrier modulation signal amplitude test
Carrier frequency
MHz
Modulation depth
Workplace strength
A/m
13.553
1.5
1.5
1.5
1.5
4.5
4.5
4.5
4.5
7.5
7.5
7.5
7.5
13.567
1.5
1.5
1.5
1.5
4.5
4.5
4.5
4.5
7.5
7.5
7.5
7.5
Table 7 TypeB chip combined state subcarrier modulation signal amplitude test
Carrier frequency
MHz
Modulation depth
Workplace strength
A/m
13.553
8 1.5
10 1.5
12 1.5
14 1.5
8 4.5
10 4.5
12 4.5
Table 7 (continued)
Carrier frequency
MHz
Modulation depth
Workplace strength
A/m
13.553
14 4.5
8 7.5
10 7.5
12 7.5
14 7.5
13.567
8 1.5
10 1.5
12 1.5
14 1.5
8 4.5
10 4.5
12 4.5
14 4.5
8 7.5
10 7.5
12 7.5
14 7.5
6.6.4 Failure criterion
Sample card return signal Subcarrier modulation signal amplitude should be at least 3.0/H1.2 mV (peak), where H is in A/m
The value of the magnetic field strength (rms). If the test results do not meet this condition, the sample is deemed to be invalid.
6.7 Stability baking
6.7.1 Purpose
Determine the effect of high temperature storage on sample reading and writing functions.
6.7.2 Test requirements
The test requirements are.
a) Temperature. 175 ℃;
b) Time. 6 h.
6.7.3 Test method
After performing according to the requirements of Chapter 3 of Method 1008.1 of GJB 548B-2005, perform the reading and writing function test on the sample.
6.7.4 Failure criterion
Sample reading and writing functions are considered invalid.
6.8 Low temperature storage
6.8.1 Purpose
Determine the effect of low-temperature storage on sample reading and writing functions.
6.8.2 Test requirements
The test requirements are.
a) Temperature. -40 ℃;
b) Time. After the temperature of the test sample has stabilized, it is held for another 24 h.
6.8.3 Test method
After performing according to 7.2.1 of GJB 150.4A-2009, perform the reading and writing function test on the sample.
6.8.4 Failure criterion
Sample reading and writing functions are considered invalid.
6.9 Temperature cycling
6.9.1 Purpose
Determine the effects of extreme high and low temperatures and the alternation of extreme high and low temperatures on sample read and write functions.
6.9.2 Test requirements
The test requirements are.
a) Number of cycles. 10 times;
b) High and low temperature conversion time. no more than 30 s;
c) residence time. 30 min;
d) Temperature. high temperature 125 ℃, low temperature -55 ℃.
6.9.3 Test method
After performing according to the requirements of Chapter 3 of Method 1010.1 in GJB 548B-2005, perform the reading and writing function test on the sample.
6.9.4 Failure criterion
Sample reading and writing functions are considered invalid.
6.10 High pressure cooking
6.10.1 Purpose
Determine the effect on the reading and writing functions of the sample under high pressure and high temperature conditions with a certain humidity.
6.10.2 Test requirements
The test requirements are.
a) Pressure. 170 kPa;
b) Temperature. (120 ± 2) ℃;
c) Relative humidity. (85 ± 5)%;
d) Duration. 48 h.
6.10.3 Test method
Place the sample on the sieve plate of the high pressure cooking test chamber. The steam pressure, temperature and humidity in the working area of the test chamber are as described in 6.10.2.
After the test, the sample was removed and dried, and the sample was read and written for 2 h at room temperature.
6.10.4 Failure criterion
Sample reading and writing functions are considered invalid.
6.11 Dynamic bending
6.11.1 Purpose
Determine the effect of bending stress on the read and write capabilities of the sample.
6.11.2 Test requirements
The test requirements are.
a) Encapsulate the sample into a sample card;
b) HvB = 20 mm, HvA = 10 mm;
c) Total bending times. 4000 times.
6.11.3 Test method
After the test is performed in accordance with the requirements of 5.8 in GB/T 17554.1-2006, the sample card is read and written.
6.11.4 Failure criterion
Sample card read and write functions are abnormal as sample failure.
6.12 Dynamic distortion
6.12.1 Purpose
Determine the effect of torsional stress on the read and write capabilities of the sample.
6.12.2 Test requirements
The test requirements are.
a) Encapsulate the sample into a sample card;
b) Torsion angle = (15 ± 1) °;
c) the test frequency is 0.5 Hz;
d) Total number of twists. 4000 times.
6.12.3 Test method
After the test is performed in accordance with the requirements of 5.9 in GB/T 17554.1-2006, the sample card is read and written.
6.12.4 Failure criterion
Sample card read and write functions are abnormal as sample failure.
6.13 Vibration fatigue
6.13.1 Purpose
Determine the effect of vibration on the appearance and reading and writing functions of the sample in the specified frequency range.
6.13.2 Test requirements
The test requirements are.
a) Vibration frequency. (60 ± 20) Hz;
b) Peak acceleration. 196 m/s2 (20 g);
c) Vibration time. 10 minutes in the Z direction;
d) Magnification of visual inspection of samples. 10-20 times.
6.13.3 Test method
Perform the visual inspection and read/write function test on the samples after performing in accordance with the requirements of Chapter 3 of Method.2005 in GJB548B-2005.
6.13.4 Failure criterion
Samples with cracked appearance or abnormal reading and writing functions are considered invalid.
6.14 Impact
6.14.1 Purpose
Determine the sample's resistance to the specified impact conditions.
6.14.2 Test requirements
The test requirements are.
a) Encapsulate the sample into a sample card;
b) Acceleration. 5000 m/s2 (500 g);
c) Pulse duration. 1 ms;
d) Pulse waveform. half sine;
d) Impact application direction. Three consecutive impacts shall be applied to each of the three mutually perpendicular directions of the card body, that is, a total of 18 times.
6.14.3 Test method
Perform the reading and writing function test on the sample card after executing according to Chapter 8 of GB/T 2423.5-1995.
6.14.4 Failure criterion
Sample card read and write functions are abnormal as sample failure.
6.15 Adhesive strength of molding compound to frame
6.15.1 Purpose
Determine the effect of the adhesion strength between the sample molding compound and the frame on its appearance and reading and writing functions.
6.15.2 Test requirements
The test requirements are.
a) Force. 20 N;
b) Speed. 10 mm/min;
c) Action time. 1 min.
6.15.3 Test method
After the tensile force acts vertically on the rubber surface of the sample, the sample is visually inspected and tested for reading and writing functions.
6.15.4 Failure criterion
The sample molding compound and the lead frame fall off or the reading and writing function is abnormal as failure.
6.16 points of pressure
6.16.1 Purpose
Determine the sample's ability to withstand concentrated stress.
6.16.2 Test requirements
The test requirements are.
a) Steel ball diameter. 5 mm;
b) Working pressure. 4 kg;
c) Action time. 1 min.
6.16.3 Test method
The working pressure is applied vertically to the center of the sample (including the center of the rubber surface and the center of the metal surface), and the sample is visually inspected and read and written.
6.16.4 Failure criterion
Samples with cracked appearance or abnormal reading and writing functions are considered invalid.
6.17 Compatibility of Card Making Process
6.17.1 Purpose
Examine the damage of the samples after the card-making process.
6.17.2 Test requirements
Business card process conditions.
6.17.3 Test method
Take 5,000 to 10,000 samples of the same batch as an inspection batch, and complete the card making according to the welding, lamination, and electrical writing procedures, and the statistics are combined.
Number of cases.
6.17.4 Non-conformance criteria
After the test, if the number of qualified products does not meet the specified requirements, it is deemed to be unqualified (refer to the product standard for the number of qualified products).
7 Evaluation rules
7.1 Evaluation Category
According to the purpose of evaluation, the evaluation is divided into three categories. technical confirmation, design confirmation, and production confirmation, which are as follows.
a) Technical validation.
1) Confirm that the electrical performance and function of the tested object meet the requirements;
2) The product should be technically confirmed after the design and manufacture or selection;
3) Technical confirmation is carried out for sample inspection. The number of samples is not less than 25. See Table 8 for technical confirmation test items;
Table 8 Technical confirmation test items
No. Name Samples (permissible number of failures)
1 Electrostatic discharge sensitivity 3 (0)
2 Varying field strength 3 (0)
3 Frequency of change 3 (0)
4 Combined state subcarrier modulation signal amplitude 3 (0)
5 Varying modulation depth 3 (0)
b) Design confirmation.
1) Confirm the environmental adaptability of the tested object and the requirements;
2) Product confirmation or major design changes due to performance optimization should be confirmed by design;
3) Design confirmation (except for the card-making process compatibility test) 300 samples are taken as an inspection lot, and the sampling plan is described in 7.2
Sampling and judgment; the number of samples for the card-making process matching test is taken from one inspection lot, see 6.17.3 for the number of each inspection lot.
Judge in accordance with the relevant product standards. The design confirmation test items are shown in Table 9;
Table 9 Design confirmation test items
No. Name Samples (permissible number of failures)
1 Alternating magnetic field 8 (0)
2 Electrostatic discharge sensitivity 8 (0)
3 Varying field strength 8 (0)
4 Change frequency 8 (0)
5 Combined state subcarrier modulation signal amplitude 8 (0)
6 Varying modulation depth 8 (0)
7 Stability baking 8 (0)
8 Low temperature storage 8 (0)
9 Temperature cycle 8 (0)
10 High pressure cooking 8 (0)
11 Dynamic bending 8 (0)
12 Dynamic distortion 8 (0)
Table 9 (continued)
No. Name Samples (permissible number of failures)
13 Vibration fatigue 8 (0)
14 Impact 8 (0)
15 Adhesive strength of molding compound to frame 8 (0)
16 points of pressure 8 (0)
17 Card making process matching 1 inspection lot (take product standard as reference)
c) Production confirmation.
1) Confirm the quality stability of the mass production of the test object;
2) Before the product enters mass production, or due to changes in manufacturing processes or changes in the manufacturer, production confirmation should be made;
3) Production confirmation (except for the card-making process matching test) 300 samples are taken as an inspection lot, and the sampling plan described in 7.2 is used
Sampling and judgment; the number of samples for the card-making process matching test is taken from 3 inspection batches. For the number of each inspection batch, see 6.17.3.
Judgment according to the corresponding product standards. See Table 10 for production confirmation test items.
Table 10 Production confirmation test items
No. Name Samples (permissible number of failures)
1 Alternating magnetic field 8 (0)
2 Electrostatic discharge sensitivity 8 (0)
3 Stability baking 8 (0)
4 Low temperature storage 8 (0)
5 High pressure cooking 8 (0)
6 Dynamic bending 8 (0)
7 Dynamic distortion 8 (0)
8 Adhesive strength of molding compound to frame 8 (0)
9 points pressure 8 (0)
10 Card-making process matching 3 inspection batches (referring to product standards)
7.2 Sampling rules
The random sampling method is implemented in accordance with the sampling plan stipulated in the GB/T 2829-2002 standard. The unqualified quality level is RQL = 20.
Level Ⅱ is selected, and the specific sampling plan (n; Ac, Re) is. (8; 0, 1).
7.3 Decision rules
7.3.1 Test judgment rules
After a certain test is completed, when all samples pass the test (0 failure), the evaluation item is judged to be qualified; if one or more of the samples fail
Pass, you can do another test according to the number of original test samples or sample cards; if there are still failed samples or failed sample cards, the test is judged
Failure; otherwise, the judgment test passes (the judgment of the card making process compatibility test is based on the failure criteria of the test, see 6.17.4).
7.3.2 Evaluation judgment rules
Of all the tests included in each type of evaluation, when any one of the tests fails, the evaluation is judged to fail.
8 Evaluation Report
A report should be written on the results of the 13.56MHz-based electronic document chip environmental adaptability evaluation. The report should include in principle (but not limited to)
Yu) The following main content.
a) evaluation purpose;
b) evaluation plan and evaluation basis;
c) Test work order and test data;
d) Signature of the tester or test unit;
e) The manufacturer, brand model, type, ex-factory number and ex-factory date of the sample chip being evaluated;
f) test results of the sample being evaluated;
g) Evaluation place and date.
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