SJ/T 11503-2015 English PDF

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SJ/T 11503-2015: Test methods for measuring surface roughness of polished monocrystalline silicon carbide wafers
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
SJ/T 11503-2015	279	Add to Cart	3 days	Test methods for measuring surface roughness of polished monocrystalline silicon carbide wafers	Valid

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Basic data

Standard ID: SJ/T 11503-2015 (SJ/T11503-2015)
Description (Translated English): Test methods for measuring surface roughness of polished monocrystalline silicon carbide wafers
Sector / Industry: Electronics Industry Standard (Recommended)
Classification of Chinese Standard: H83
Classification of International Standard: 29.045
Word Count Estimation: 12,178
Date of Issue: 2015-04-30
Date of Implementation: 2015-10-01
Quoted Standard: GB/T 14264; GB/T 25915.1-2010
Regulation (derived from): Ministry of Industry and Information Technology Announcement (2015 No. 28)
Issuing agency(ies): Ministry of Industry and Information Technology
Summary: This Standard specifies the test silicon carbide single crystal polished surface roughness comprising surface profiler and atomic force microscopy. This Standard applies to silicon carbide single product polished surface roughness testing. Among them, the atomic force microscope method applies only after chemical mechanical polishing or optically polished and the surface roughness of the ups and downs in a few tenths of a micron wide silicon carbide single crystal polished.

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