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SJ/T 11503-2015 PDF English

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SJ/T 11503-2015: Test methods for measuring surface roughness of polished monocrystalline silicon carbide wafers
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SJ/T 11503-2015English279 Add to Cart 3 days [Need to translate] Test methods for measuring surface roughness of polished monocrystalline silicon carbide wafers

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Basic data

Standard ID SJ/T 11503-2015 (SJ/T11503-2015)
Description (Translated English) Test methods for measuring surface roughness of polished monocrystalline silicon carbide wafers
Sector / Industry Electronics Industry Standard (Recommended)
Classification of Chinese Standard H83
Classification of International Standard 29.045
Word Count Estimation 12,144
Date of Issue 2015-04-30
Date of Implementation 2015-10-01
Quoted Standard GB/T 14264; GB/T 25915.1-2010
Regulation (derived from) Ministry of Industry and Information Technology Announcement (2015 No. 28)
Issuing agency(ies) Ministry of Industry and Information Technology
Summary This Standard specifies the test silicon carbide single crystal polished surface roughness comprising surface profiler and atomic force microscopy. This Standard applies to silicon carbide single product polished surface roughness testing. Among them, the atomic force microscope method applies only after chemical mechanical polishing or optically polished and the surface roughness of the ups and downs in a few tenths of a micron wide silicon carbide single crystal polished.

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