SJ/T 11216-1999 PDF English
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Basic data
| Standard ID | SJ/T 11216-1999 (SJ/T11216-1999) |
| Description (Translated English) | Technology requirement for infrared for air reflow soldering |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | J33 |
| Word Count Estimation | 10,154 |
| Date of Issue | 8/26/1999 |
| Date of Implementation | 12/1/1999 |
| Summary | This standard specifies the basic standard surface assembly (SMA) using infrared, hot air or hot air and infrared heating with a heat source and the use of tin-lead solder paste reflow soldering, after welding quality inspection and test methods temperature curve. This standard applies to the use of surface mount components assembled rigid single, infrared, hot air or infrared hot double-sided PCB assembly with reflow soldering. |