GB/T 8646-1998 PDF English
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GB/T 8646: Historical versions
| Std ID | Version | USD | Buy | Deliver [PDF] in | Title (Description) |
| GB/T 8646-1998 | English | 279 | Add to Cart | 3 days [Need to translate] | Fine aluminum-1% silicon wire for semiconductor lend-bonding |
| GB/T 8646-1988 | English | RFQ | ASK | 3 days [Need to translate] | Aluminium-silicon (AISi 1) wire for semiconductor lead bonding |
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Basic data
| Standard ID | GB/T 8646-1998 (GB/T8646-1998) |
| Description (Translated English) | Fine aluminum-1% silicon wire for semiconductor lend-bonding |
| Sector / Industry | National Standard (Recommended) |
| Classification of Chinese Standard | H81;H61 |
| Classification of International Standard | 29.045 |
| Word Count Estimation | 7,717 |
| Date of Issue | 7/15/1998 |
| Date of Implementation | 2/1/1999 |
| Older Standard (superseded by this standard) | GB 8646-1988 |
| Adopted Standard | ASTM F487-1988, NEQ |
| Regulation (derived from) | Development & Reform Commission Bulletin 2006 No. 46; National AQSIQ National Standardization Committee Bulletin (2007 No. 146) |
| Issuing agency(ies) | State Quality and Technical Supervision |