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Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 45767-2025: Silicon nitride ceramic subtrates Status: Valid
Basic dataStandard ID: GB/T 45767-2025 (GB/T45767-2025)Description (Translated English): Silicon nitride ceramic subtrates Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: Q32 Classification of International Standard: 81.060.30 Word Count Estimation: 13,173 Date of Issue: 2025-06-30 Date of Implementation: 2026-01-01 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GB/T 45767-2025: Silicon nitride ceramic subtrates---This is an excerpt. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.), auto-downloaded/delivered in 9 seconds, can be purchased online: https://www.ChineseStandard.net/PDF.aspx/GBT45767-2025ICS 81.060.30 CCSQ32 National Standard of the People's Republic of China Silicon nitride ceramic substrate Released on June 30, 2025 Implementation on January 1, 2026 State Administration for Market Regulation The National Standardization Administration issued PrefaceThis document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents" Drafting. Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents. This document is proposed by China Building Materials Federation. This document is under the jurisdiction of the National Technical Committee for Standardization of Industrial Ceramics (SAC/TC194). This document was drafted by. Sinoma High-Tech Nitride Ceramics Co., Ltd., Hengyang Kaixin Special Materials Technology Co., Ltd., Zhejiang Polyhedron New Materials Co., Ltd., Zhejiang Litai Composite Materials Co., Ltd., Jilin Changyu Special Ceramics New Materials Technology Co., Ltd., Shandong Industrial Ceramics Porcelain Research and Design Institute Co., Ltd., Zhejiang Dehui Electronic Ceramics Co., Ltd., Zhuzhou Ruidel Intelligent Equipment Co., Ltd., Henan Nolante New Materials Technology Co., Ltd., Shandong Sinoceramic Functional Materials Co., Ltd., Hebei Gaofu Silicon Nitride Materials Co., Ltd., Rogers Technology (Suzhou) Co., Ltd. Co., Ltd., Shanghai Institute of Ceramics, Chinese Academy of Sciences, China National Testing Holding Group Zibo Co., Ltd., Zhuzhou Aisenda New Materials Technology Co., Ltd., Taisheng New Materials Technology Co., Ltd., Jiangsu Fulehua Power Semiconductor Research Institute Co., Ltd., and Kimike Materials Technology (Suzhou) Co., Ltd., Fujian Zhenjing New Materials Technology Co., Ltd., Anyang Henry Hi-Tech Industrial Co., Ltd., Nantong Sanzhi Precision Ceramics Co., Ltd., An Huilanxun Communication Technology Co., Ltd., Jiangxi Silicon Nitride New Materials Co., Ltd., Fujian Huaqing Electronic Materials Technology Co., Ltd., Loudi Andi Yas Electronic Ceramics Co., Ltd., Wuxi Haigood New Technology Co., Ltd., Jinan University, Hunan Weishang Technology Co., Ltd., Xinhua County, Hunan Province Xinxing Electronic Ceramics Co., Ltd., Zhejiang Zhengtian New Materials Technology Co., Ltd., and Shandong Minghui Special Ceramics Co., Ltd. The main drafters of this document are. Sun Feng, Shang Chaofeng, Zhang Hui, Wang Zaiyi, Dong Tingxia, Zhang Yelei, Dong Weiqiang, Chen Changzhu, Li Yongquan, Luan Ting, Zhang Jingxian, Zhang Guojun, Wang Yujin, Li Yingxin, Jiang Danyu, Wang Xingang, Li Kai, Wu Ping, Zhang Yunhe, Sun Wei, Tian Zhuo, Huang Shidong, Gao Liwen, Li Bowen, Dai Weiming, Ge Zhuang, Liu Weiping, Qu Peng, Xia Jinghao, Li Qiuju, Yan Yongjie, Zhu Wei, Lin Wensong, Li Guang, Huang Wensi, Kang Dinghua, Mo Xuekui, Chen Pingsong, Yan Hui, Zeng Xiaofeng, Yuan Zhenwei, Zhang Hengju, Huang Rongxia, Zhang Xuelian, Cao Jianhui, Jiang Weixin, Liu Shen, Zhao Degang, Lin Delong, Wang Meiling. Silicon nitride ceramic substrate1 ScopeThis document specifies the product classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, etc. of silicon nitride ceramic substrates. and storage. This document is applicable to silicon nitride ceramic substrates for power semiconductor modules and can be used as a reference for silicon nitride ceramic substrates for other functions.2 Normative referencesThe contents of the following documents constitute the essential clauses of this document through normative references in this document. For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to This document. GB/T 191 Pictorial markings for packaging, storage and transportation GB/T 1408.1 Test methods for electric strength of insulating materials Part 1.Tests at power frequency GB/T 2828.1 Sampling procedures for inspection by attributes Part 1.Sampling plans for batch inspection based on acceptance quality limit (AQL) GB/T 5594.4 Test methods for properties of structural ceramic materials for electronic components Part 4.Dielectric constant and dielectric loss tangent Value test method GB/T 5594.5 Test methods for properties of structural ceramic materials for electronic components - Test methods for volume resistivity GB/T 6062 Product Geometry Specification (GPS) - Nominal characteristics of contact (stylus) instruments using the surface structure profilometry method GB/T 9530 Terminology of Electronic Ceramics GB/T 10700 Test method for elastic modulus of fine ceramics - Bending method GB/T 14619-2013 Alumina ceramic substrates for thick film integrated circuits GB/T 16534 Test method for room temperature hardness of fine ceramics GB/T 16535 Test method for linear thermal expansion coefficient of fine ceramics - Ejector rod method GB/T 16555 Chemical analysis methods for refractories containing carbon, silicon carbide and nitride GB/T 17991 Terminology for Fine Ceramics GB/T 22588 Flash method for measuring thermal diffusivity or thermal conductivity GB/T 25995 Test method for density and apparent porosity of fine ceramics GB/T 39975-2021 Aluminum nitride ceramic heat sink substrate GB/T 41605 Test method for indentation fracture resistance of silicon nitride materials for rolling bearing balls at room temperature - Indentation method GB/T 45763 Fine ceramics - Test method for flexural strength of thin ceramic plates at room temperature - Three-point bending or four-point bending method3 Terms and DefinitionsThe terms and definitions defined in GB/T 9530 and GB/T 17991 and the following apply to this document. 3.1 A sheet-like silicon nitride ceramic support on which conductor patterns, membrane elements, or electronic components can be printed. Note. Hereinafter referred to as substrate. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 45767-2025_English be delivered?Answer: Upon your order, we will start to translate GB/T 45767-2025_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 45767-2025_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 45767-2025_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.Question 3: Does the price include tax/VAT?Answer: Yes. 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