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Integrated circuits - Measurement of electromagnetic emissions - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
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Basic data
| Standard ID | GB/T 44937.2-2025 (GB/T44937.2-2025) |
| Description (Translated English) | Integrated circuits - Measurement of electromagnetic emissions - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method |
| Sector / Industry | National Standard (Recommended) |
| Classification of Chinese Standard | L56 |
| Classification of International Standard | 31.200 |
| Word Count Estimation | 18,153 |
| Date of Issue | 2025-12-31 |
| Date of Implementation | 2026-07-01 |
| Issuing agency(ies) | State Administration for Market Regulation, Standardization Administration of China |
GB/T 44937.2-2025: Integrated circuits - Measurement of electromagnetic emissions - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.200
CCSL56
National Standards of the People's Republic of China
Electromagnetic emission measurement of integrated circuits
Part 2.Radiation Emission Measurement TEM Chamber and
Broadband TEM small cell method
Released on December 31, 2025; to be implemented on July 1, 2026.
State Administration for Market Regulation
The State Administration for Standardization issued a statement.
Table of contents
Preface III
Introduction IV
1.Scope 1
2 Normative References 1
3.Terms and Definitions 1
4.Overview 2
5.Test conditions 2
5.1 General Rules 2
5.2 Power Supply Voltage 2
5.3 Frequency Range 2
6.Test equipment 2
6.1 General Rules 2
6.2 Shielding 2
6.3 Radio Frequency Measurement Instruments 2
6.4 Preamplifier 2
6.5 TEM chamber 2
6.6 Broadband TEM (GTEM) Cell 3
6.7 50Ω terminal 3
6.8 System Gain 3
7.Test Setup 3
7.1 General Rules 3
7.2 Test Configuration 3
7.3 Test PCB 4
8.Experimental Procedure 5
8.1 General Rules 5
8.2 Measuring ambient noise 6
8.3 Check the DUT's operating status 6
8.4 Measuring DUT Emissions 6
9 Test Report 6
9.1 General Rules 6
9.2 Measurement Conditions 6
10 IC transmit reference level 6
Appendix A (Informative) Example 7 of Calibration and Setup Verification
Appendix B (Informative) Description of TEM Cells and Broadband TEM Cells 8
B.1 TEM chamber 8
B.2 Broadband TEM Cell 8
Appendix C (Informative) Calculation of Dipole Moment Based on Measured Data 9
C.1 Overview 9
C.2 Calculation of Dipole Moment 9
Appendix D (Informative) Launch Data Specification 10
D.1 Overview 10
D.2 Transmit Level Specification 10
D.3 Result Presentation Methods 10
D.4 Example 11
References 12
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents".
Drafting.
This document is Part 2 of GB/T 44937 "Measurement of Electromagnetic Emissions of Integrated Circuits". GB/T 44937 has been published as follows.
part.
---Part 1.General Conditions and Definitions;
---Part 2.Radiation Emission Measurement TEM Cell and Broadband TEM Cell Method;
---Part 3.Surface Scanning Method for Radiation Emission Measurement;
---Part 4.Conducted emission measurement using the 1Ω/150Ω direct coupling method;
---Part 5.Conducted Emission Measurement Stand Faraday Cage Method;
---Part 6.Conducted Emission Measurement Using Magnetic Field Probes;
---Part 8.Radiated Emission Measurement IC Stripline Method
This document is equivalent to IEC 61967-2.2005 "Measurement of electromagnetic emissions from integrated circuits 150 kHz to 1 GHz - Part 2.Radiation".
Emission measurement TEM cell and broadband TEM cell methods.
The following minimal editorial changes have been made to this document.
---To align with existing standards, the standard title has been changed to "Measurement of Electromagnetic Emissions of Integrated Circuits - Part 2.Measurement of Radiated Emissions".
TEM cell and broadband TEM cell method.
Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.
This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This document is under the jurisdiction of the National Integrated Circuit Standardization Technical Committee (SAC/TC599).
This document was drafted by. China Electronics Technology Standardization Institute, Zhejiang Nuoyi Technology Co., Ltd., and China Automotive Engineering Research Institute Co., Ltd.
Limited Liability Company, Haiyanxin (Qingdao) Microelectronics Co., Ltd., Xiamen Hainuoda Scientific Instruments Co., Ltd., Sun Yat-sen University, Suzhou Taisite Electronics Technology Co., Ltd.
Technology Co., Ltd., Beijing Zhixin Microelectronics Technology Co., Ltd., Tianjin Advanced Technology Research Institute, the Fifth Research Institute of Electronics of the Ministry of Industry and Information Technology
Beijing National New Energy Vehicle Technology Innovation Center Co., Ltd., China Automotive Technology and Research Center for New Energy Vehicles (Tianjin) Co., Ltd., China Household Electric Appliances
Research Institute of Instrumentation, Nanjing University of Information Science and Technology, Guangzhou Saibao Metrology and Testing Center Service Co., Ltd., Naval Electromagnetic Compatibility Research and Testing Center, China
China National Accreditation Service for Conformity Assessment, Fuzhou Internet of Things Open Laboratory Co., Ltd., JK Automotive (Ningbo Hangzhou Bay New Area) Co., Ltd., China
North Vehicle Research Institute, China Academy of Information and Communications Technology, Hexing Automotive Electronics (Taicang) Co., Ltd., Shenzhen Bilian Electronics Co., Ltd., AVIC
Optoelectronic Technology Co., Ltd., Liuzhou Automobile Testing Co., Ltd., Chongqing Xinminkang Technology Co., Ltd., and Longze (Shanghai) Technology Co., Ltd.
The main drafters of this document are. Zheng Yimin, Cui Qiang, Fu Jun, Huang Xuemei, Wu Jianfei, Fang Wenxiao, Zhu Sai, Zhang Zhizhong, Hu Xiaojun, and Li Huanran.
Fu Rongjie, Wang Xincai, Liang Jiming, Chu Rui, Li Qi, Jian Duanduan, Zhang Jie, Tan Zeqiang, Qi Xin, Chen Yan, Zhang Yong, Liu Jia, Lai Qiuhui, Zhu Chongming
Zhao Ji, Wang Ziren, Li Wang, Liu Haitao, Guo Hui, Zhang Jiyu, Chen Xiaoyong, Bao Yuhang.
Introduction
To standardize electromagnetic emission measurement for integrated circuits, and to provide different electromagnetic emission measurement methods for integrated circuit manufacturers and testing institutions.
GB/T 44937, "Measurement of Electromagnetic Emissions of Integrated Circuits," specifies the general conditions, definitions, and different measurement methods for electromagnetic emission measurements of integrated circuits.
The experimental procedures and requirements for quantitative methods are proposed to consist of nine parts.
---Part 1.General Conditions and Definitions. The purpose is to define the general conditions and definitions for electromagnetic emission measurements of integrated circuits.
---Part 1-1.General Conditions and Definitions of Near-Field Scanning Data Exchange Format. The purpose is to specify the near-field scanning data exchange format.
Format.
---Part 2.Radiation Emission Measurement using TEM Cells and Broadband TEM Cells. The aim is to define the TEM cell and broadband TEM cell methods.
Test procedures and requirements for the TEM chamber method.
---Part 3.Surface Scanning Method for Radiation Emission Measurement. The purpose is to specify the test procedures and requirements for the surface scanning method.
---Part 4.Conducted Emission Measurement - 1Ω/150Ω Direct Coupling Method. The purpose is to define the 1Ω/150Ω direct coupling method.
Test procedures and test requirements.
---Part 4-1.Application Guidelines for Conducted Emission Measurements using the 1Ω/150Ω Direct Coupling Method. The aim is to provide guidance on the application of the 1Ω/150Ω direct coupling method.
Application guidelines for the coupling method.
---Part 5.Conducted Emission Measurement Stand Faraday Cage Method. The purpose is to define the test procedures for the stand Faraday cage method.
and testing requirements.
---Part 6.Conducted Emission Measurement Using Magnetic Field Probes. The purpose is to specify the test procedures and requirements for the magnetic field probe method.
---Part 8.Radiated Emission Measurement - IC Stripline Method. The purpose is to specify the test procedures and requirements for the IC stripline method.
Electromagnetic emission measurement of integrated circuits
Part 2.Radiation Emission Measurement TEM Chamber and
Broadband TEM small cell method
1 Scope
This document describes a method for measuring electromagnetic radiation from integrated circuits (ICs). The IC under test must be mounted on an IC test printed circuit board.
The PCB is fixed to the top or bottom of a transverse electromagnetic wave (TEM) cell or a gigahertz transverse electromagnetic wave (GTEM) cell.
It is located on a mating port (called the housing port). Unlike typical use where it is located inside the chamber, this PCB is integrated as part of the chamber wall.
This method applies to any modified TEM or GTEM cell with added housing ports (see Appendix B). However, the radio frequency being measured...
(RF) voltage is affected by many factors. The main factors affecting the measured RF voltage are the core board and the IC test PCB (chamber housing).
The distance between them.
This method uses a 1GHz TEM cell (the distance between the core board and the ground plane is 45mm) and a GTEM cell (the distance between the core board and the mating port area).
The experiment was conducted with an average ground-level distance of 45 mm. Other cells may not need to produce the same spectral output, but only require similar frequency and sensitivity.
Its characteristics allow it to also be used for comparative measurements. This is applicable to measurements produced by TEM cells or GTEM cells with different distances between the ground plane and the core plate.
The quantitative data are compared after applying correction factors.
The IC test PCB controls the geometric position and orientation of the IC relative to the chamber, preventing any cable connections between the IC and the chamber.
(These cables are routed on the back of the PCB, outside the TEM chamber). One 50Ω port in the TEM chamber terminates a 50Ω load. TEM Chamber
The other 50Ω port, or the only 50Ω port in the GTEM cell, is connected to the input of a spectrum analyzer or receiver for use in...
The radio frequency emission generated by the IC and transmitted on the core board of the chamber is measured.
2 Normative references
The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included.
For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies.
This document.
Vocabulary(IEV)-Part 131.Circuittheory)
Note. GB/T 2900.74-2008 Electrical Engineering Terminology - Circuit Theory (IEC 60050-131.2002, MOD)
Note. GB/T 4365-2024 Electrotechnical Terminology Electromagnetic Compatibility (IEC 60050-161.2021, MOD)
IEC 61967-1 Measurement of electromagnetic emissions from integrated circuits—Part 1.General conditions and definitions
Note. GB/T 44937.1-2025 Electromagnetic emission measurement of integrated circuits - Part 1.General conditions and definitions (IEC 61967-1.2018, IDT)
3 Terms and Definitions
The terms and definitions defined in IEC 61967-1, IEC 60050-131, and IEC 60050-161 apply to this document.
...
