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Super abrasive products - Precision dicing and cutting wheels for semiconductor chips
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Basic data
| Standard ID | GB/T 43136-2023 (GB/T43136-2023) |
| Description (Translated English) | Super abrasive products - Precision dicing and cutting wheels for semiconductor chips |
| Sector / Industry | National Standard (Recommended) |
| Classification of Chinese Standard | J43 |
| Classification of International Standard | 25.100.70 |
| Word Count Estimation | 14,161 |
| Date of Issue | 2023-09-07 |
| Date of Implementation | 2024-04-01 |
| Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration |
GB/T 43136-2023: Super abrasive products - Precision dicing and cutting wheels for semiconductor chips
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 25.100.70
CCSJ43
National Standards of People's Republic of China
Superabrasive products
Grinding wheel for precision dicing of semiconductor chips
Published on 2023-09-07
2024-04-01 Implementation
State Administration for Market Regulation
Released by the National Standardization Administration Committee
Table of contents
PrefaceⅠ
1 Scope 1
2 Normative reference documents 1
3 Terms and Definitions 1
4 Product Category 1
4.1 Grinding wheel for precision dicing of wafer chips 1
4.2 Grinding wheel for precision cutting of package chips 2
5 product marking4
5.1 Grinding wheel markings for precision dicing of wafer chips 4
5.2 Grinding wheel markings for precision cutting of package chips 4
6 Technical requirements 5
6.1 Appearance 5
6.2 Basic size limit deviation 5
6.3 Geometric tolerance 7
6.4 Substrate roughness 7
7 Test method 7
7.1 Appearance 7
7.2 Basic dimensions 7
7.3 Geometric tolerance 8
7.4 Substrate roughness 8
8 Inspection rules 8
8.1 Factory inspection 8
8.2 Product quality supervision and inspection8
9 flag 9
9.1 Product Marking9
9.2 Certificate mark 9
9.3 Outer packaging mark 9
10 Packaging, transportation and storage10
10.1 Packaging10
10.2 Transport10
10.3 Storage10
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents"
Drafting.
Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents.
This document is proposed by China Machinery Industry Federation.
This document is under the jurisdiction of the National Abrasives and Abrasives Standardization Technical Committee (SAC/TC139).
This document was drafted by. Zhengzhou Abrasives and Grinding Research Institute Co., Ltd., Nanjing Sanchao New Materials Co., Ltd., Zhengzhou Qisheng Precision
Mi Manufacturing Co., Ltd., Huaqiao University, Suzhou Saier Technology Co., Ltd.
The main drafters of this document. Bao Hua, Zhu Xiaowei, Shao Junyong, Zou Yuyao, Du Xiaoxu, Zhang Liang, Wang Zhan, Li Kenan, Yang Songcan, Wu Zhuan,
Huang Guoqin, Hu Zhiyong, Yu Jiayin, Yu Yueguo, Ran Longguang, Yang Songbin.
Superabrasive products
Grinding wheel for precision dicing of semiconductor chips
1 Scope
This document specifies the product classification, product marking, technical requirements, test methods, inspection rules,
Marking, packaging, shipping and storage.
This document applies to electroplating bonding agents, resin bonding agents and metals used for precision dicing of semiconductor wafer chips and precision cutting of package chips.
Bonded diamond grinding wheel.
2 Normative reference documents
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations
For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to
this document.
GB/T 1800.2-2020 Product Geometric Specification (GPS) Linear Dimensional Tolerance ISO Code System Part 2.Standard
Tolerance zone code and limit deviation table of holes and shafts
GB/T 2829-2002 Periodic inspection counting sampling procedures and tables (applicable to inspection of process stability)
GB/T 16458 Abrasives Terminology
3 Terms and definitions
The terms and definitions defined in GB/T 16458 apply to this document.
4 product categories
4.1 Grinding wheel for precision dicing of wafer chips
The product code is SWDW.
The bond type is electroplating bond.
The shape code is 3A2 (hub type), the shape is shown in Figure 1, and the dimensions are shown in Table 1.
Figure 1 Schematic diagram of the shape of the grinding wheel (type 3A2) used for precision dicing of wafer chips
...
