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Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 43059-2023: Requirements of flatness control for printed boards and printed board assemblies Status: Valid
Basic dataStandard ID: GB/T 43059-2023 (GB/T43059-2023)Description (Translated English): Requirements of flatness control for printed boards and printed board assemblies Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L94 Classification of International Standard: 31.180 Word Count Estimation: 10,136 Date of Issue: 2023-09-07 Date of Implementation: 2024-04-01 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GB/T 43059-2023: Requirements of flatness control for printed boards and printed board assemblies---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.ICS 31.180 CCSL94 National Standards of People's Republic of China Flatness control requirements for printed boards and printed board assemblies Published on 2023-09-07 2024-04-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration Committee ForewordThis document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47). This document was drafted by. The 15th Research Institute of China Electronics Technology Group Corporation, Beijing Zunguan Technology Co., Ltd., Hanjiang District, Putian City Ton Multilayer Circuit Co., Ltd., China Electronics Standardization Institute, Xiamen Bolian Technology Co., Ltd. The main drafters of this document. Chen Changsheng, Sun Jingjing, Bian Hongli, Tang Ruifang, Guo Xiaoyu, Fu Yuhui, Lou Yafen, Cao Yi, Wu Yongjin. Flatness control requirements for printed boards and printed board assemblies1 ScopeThis document specifies the requirements for flatness control of printed boards and printed board assemblies. This document applies to the control of flatness in the design, manufacture and use of rigid printed boards and rigid printed board assemblies (assemblies).2 Normative reference documentsThe contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document. GB/T 2036 Printed circuit terminology GB/T 4722-2017 Test methods for rigid copper-clad laminates for printed circuits3 Terms and definitionsThe terms and definitions defined in GB/T 2036 apply to this document.4 General requirements4.1 Design Designers of rigid printed boards or rigid printed board assemblies should ensure structural balance. For printed board structural balance refers to any way The resin, reinforcement materials and metal foil are evenly distributed towards the central printed board. If there are additional metal layers bonded to the substrate (such as heat sink chip), the metal layer will affect the flatness of the printed board. Rigid printed board assemblies usually have components mounted on both sides. The location of the components is determined by their size, mass, and pins in contact with the printed board. Determined by quantity, the position of components directly affects the flatness of the printed board assembly. 4.2 Rigid printed board manufacturing Manufacturers of rigid printed boards should ensure minimal warpage of the printed boards. 4.3 Assembly The assembly of rigid printed boards should ensure that the rigid printed boards are not deformed, especially during the entire welding process and manual operation. 4.4 Use Users should ensure good storage conditions and storage equipment to minimize the possibility of distortion after assembly. 5 Flatness control of rigid copper-clad foil substrate 5.1 Influencing factors 5.1.1 Reinforcement materials Fiberglass fabrics have the potential to create stress during weaving and handling. Stress of Single Fiberglass Fabric on Laminate Warpage ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 43059-2023_English be delivered?Answer: Upon your order, we will start to translate GB/T 43059-2023_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 43059-2023_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 43059-2023_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.Question 3: Does the price include tax/VAT?Answer: Yes. 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