GB/T 43021-2023 English PDF

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GB/T 43021-2023: Workmanship requirements for rework, modification and repair of soldered electronic assemblies
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 43021-2023	569	Add to Cart	5 days	Workmanship requirements for rework, modification and repair of soldered electronic assemblies	Valid

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Basic data

Standard ID: GB/T 43021-2023 (GB/T43021-2023)
Description (Translated English): Workmanship requirements for rework, modification and repair of soldered electronic assemblies
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L94
Classification of International Standard: 31.190
Word Count Estimation: 30,320
Date of Issue: 2023-09-07
Date of Implementation: 2024-02-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 43021-2023: Workmanship requirements for rework, modification and repair of soldered electronic assemblies

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.190 CCSL94 National Standards of People's Republic of China Electronic assembly soldering rework, modification and Rework process requirements Published on 2023-09-07 2024-02-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration Committee

Table of contents

PrefaceⅠ 1 Scope 1 2 Normative reference documents 1 3 Terms, definitions and abbreviations1 4 Rework operation 2 5 Rework before welding 4 6 Factors affecting rework after welding 6 7 Preparation for rework and repair after welding 9 8 Rework after welding10 9 Selection of rework equipment, tools and methods 13 10 Manual rework tools and methods 16 11 Mechanized and programmable rework devices and methods 18 12 Auxiliary tools and equipment21 13 Rework records 23 14 Training of operators and inspection personnel24 15 Rework on site25 Reference 26

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47). This document was drafted by. China Aerospace Science and Technology Corporation Ninth Research Institute.200 Factory, China Electronics Technology Standardization Institute, The 15th Research Institute of China Electronics Technology Group Corporation. The main drafters of this document. Bao Jie, Zhao Yue, Wang Yi, Wang Lina, Cao Yi, Guo Xiaoyu. Electronic assembly soldering rework, modification and Rework process requirements

1 Scope

This document specifies the content and process requirements applicable to rework, modification and repair of electronic assembly soldering. This document applies to rework, soldering and manufacturing of electronic assemblies that connect components to printed boards and related parts of the final product. Modification and rework are also applicable to related work activities in the assembly of hybrid installation technology products. This document also includes guidance on design content related to rework. Note. Without causing confusion, the term "rework operations" in this document applies to rework, modification and rework. Operations that are only applicable to rework are marked with "Rework Operation" (Applicable to rework only)" means.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document. GB/T 2036 Printed circuit terminology GB/T 4725 Copper-clad epoxy glass cloth laminates for printed circuits GB/T 19247.1-2003 Printed board assembly Part 1.General specification for electronics using surface mounting and related assembly techniques and electrical welding assembly requirements GB/T 19247.2-2003 Printed board assembly Part 2.Sub-specification assembly requirements for surface mount welding GB/T 19247.3-2003 Printed board assembly Part 3.Specification requirements for through-hole mounting and welding assembly GB/T 19247.4-2003 Printed board assembly Part 4.Requirements for lead-out soldering assembly in sub-standard specifications GB/T 31474 Flux for high-quality internal interconnection in electronic assembly GB/T 31475 Solder paste for high-quality internal interconnection in electronic assembly GB/T 31476 Solder for high-quality internal interconnection in electronic assembly GB/T 33772.1 Quality Evaluation System Part 1.Statistics and Analysis of Defects on Printed Board Assemblies 3 Terms, definitions and abbreviations 3.1 Terms and definitions The terms and definitions defined in GB/T 2036 and below apply to this document. 3.1.1 reworkrework Operations that make unqualified products comply with applicable drawing requirements or technical specifications by using the original process or changing equivalent processes. 3.1.2 Repair The operation of restoring defective product to conform to applicable drawing requirements or specifications. ......

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