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GB/T 41213-2021 English PDF

Q: How long will the true-PDF of English version of GB/T 41213-2021 be delivered?

Upon your order, we will start to translate GB/T 41213-2021_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.

Q: Can I share the purchased PDF of GB/T 41213-2021_English with my colleagues?

Yes. The purchased PDF of GB/T 41213-2021_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.

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Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries). Avoidance of Double Taxation Agreements (DTAs) between Singapore and 100+ Countries: https://www.iras.gov.sg/taxes/international-tax

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US$269.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email.
GB/T 41213-2021: Integrated circuit full automatic die bonder
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 41213-2021	269	Add to Cart	3 days	Integrated circuit full automatic die bonder	Valid

Similar standards

SJ/T 11795 GB/T 4184 GB/T 41203 GB/T 40577 GB/T 37466

Basic data

Standard ID: GB/T 41213-2021 (GB/T41213-2021)
Description (Translated English): Integrated circuit full automatic die bonder
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L95
Word Count Estimation: 13,126
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 41213-2021: Integrated circuit full automatic die bonder

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Integrated circuit full automatic die bonder ICS 31:220 CCSL95 National Standards of People's Republic of China Fully automatic chip loader for integrated circuits Published on 2021-12-31 2022-07-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration directory Preface III 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Product structure, classification, model and basic parameters 2 4:1 Structure 2 4:2 Category 2 4:3 Type 2 4:4 Basic parameters 2 5 Working conditions 3 5:1 Cleanliness 3 5:2 Relative humidity 3 5:3 Ambient temperature 3 5:4 Anti-static requirements 3 5:5 Power Requirements 3 5:6 Equipment Current Requirements 3 5:7 Compressed air pressure and flow requirements 3 5:8 Vacuum pressure requirements 3 6 Requirements 4 6:1 Appearance 4 6:2 Transfer mechanism 4 6:3 Welding mechanism 4 6:4 Image Recognition System 4 6:5 Wafer table 4 6:6 Thimble mechanism 4 6:7 Dispensing mechanism 4 6:8 Blanking mechanism 5 6:9 Electrical section 5 6:10 Software Part 5 6:11 Safety requirements 5 7 Test method 6 7:1 Appearance 6 7:2 Transfer mechanism 6 7:3 Welding mechanism 6 7:4 Image Recognition System 6 7:5 Wafer table 6 7:6 Thimble mechanism 6 7:7 Dispensing mechanism 7 7:8 Blanking mechanism 7 7:9 Electrical inspection 7 7:10 Software Detection 7 7:11 Product Safety 7 8 Inspection rules 7 8:1 Inspection classification 7 8:2 Type inspection 7 8:3 Factory inspection 8 9 Marking, Packaging, Shipping and Storage 8 9:1 Flags 8 9:2 Packaging 9 9:3 Transport 9 9:4 Storage 9

foreword

This document is in accordance with the provisions of GB/T 1:1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules of Standardization Documents" drafted: Please note that some content of this document may be patented: The issuing agency of this document assumes no responsibility for identifying patents: This document is proposed and managed by the National Technical Committee for Standardization of Semiconductor Equipment and Materials (SAC/TC203): This document is drafted by: Dalian Jiafeng Automation Co:, Ltd:, China Electronics Standardization Institute: The main drafters of this document: Wang Yunfeng, Huang Jian, Liang Jingjing, Bian Zhicheng, Sun Yongjun, Sun Qichao, Li Deming, Zhang Fei, Du Fengqin, Feng Yabin, Cao Kewei: Fully automatic chip loader for integrated circuits

1 Scope

This document specifies the structure, classification, basic parameters, working conditions, requirements, test methods and inspection regulations of the automatic chip loader for integrated circuits: regulations, marking, packaging, transportation and storage: This document applies to fully automatic chip loaders for integrated circuit packaging:

2 Normative references

The contents of the following documents constitute essential provisions of this document through normative references in the text: Among them, dated citations documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to this document: GB/T 191 Graphical signs of packaging, storage and transportation GB/T 5226:1-2019 Mechanical and Electrical Safety Mechanical and Electrical Equipment Part 1: General Specifications GB/T 13306 Signs GB 50073-2013 Design code for clean workshop

3 Terms and Definitions

The following terms and definitions apply to this document: 3:1 wafer Silicon wafers used in the fabrication of integrated circuits: Note 1: The shape is circular: Note 2: It can be processed into various circuit element structures on silicon wafers, and become semiconductor products such as ICs and discrete devices with specific electrical functions: 3:2 Scribing film tape The film remaining after the wafer is cut and the protective film is removed: Note: It plays the role of supporting and fixing the chip: 3:3 carrier A kind of electrical connection between the terminal of the internal circuit of the chip and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire, etc:) It is a key structural part of the electrical circuit: Note 1: Including lead frame, substrate and ceramic plate, etc: Note 2: It acts as a bridge to connect with external wires: 3:4 pressure force The pick-up pressure to pick up the die from the wafer and the solder pressure to attach the die to the carrier: ......

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Tips & Frequently Asked Questions:

Question 1: How long will the true-PDF of GB/T 41213-2021_English be delivered?

Answer: Upon your order, we will start to translate GB/T 41213-2021_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.

Question 2: Can I share the purchased PDF of GB/T 41213-2021_English with my colleagues?

Answer: Yes. The purchased PDF of GB/T 41213-2021_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.

Question 3: Does the price include tax/VAT?

Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countries

Question 4: Do you accept my currency other than USD?

Answer: Yes. If you need your currency to be printed on the invoice, please write an email to Sales@ChineseStandard.net. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.