GB/T 34649-2017 English PDF

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GB/T 34649-2017: Magnetron sputtering ruthenium target
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 34649-2017	199	Add to Cart	3 days	Magnetron sputtering ruthenium target	Valid

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Basic data

Standard ID: GB/T 34649-2017 (GB/T34649-2017)
Description (Translated English): Magnetron sputtering ruthenium target
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: H68
Classification of International Standard: 77.150.99
Word Count Estimation: 10,128
Date of Issue: 2017-09-29
Date of Implementation: 2018-04-01
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China

GB/T 34649-2017: Magnetron sputtering ruthenium target

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Magnetron sputtering ruthenium target ICS 77.150.99 H68 National Standards of People's Republic of China Ruthenium targets for magnetron sputtering 2017-09-29 Posted 2018-04-01 implementation General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China China National Standardization Administration released

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard is proposed by China Nonferrous Metals Industry Association. This standard by the National Non-ferrous Metal Standardization Technical Committee (SAC/TC243) centralized. This standard is drafted by. There are billion New Materials Co., Ltd., non-ferrous metal technology and Economy Institute. The drafters of this standard. Luojun Feng, Ding Zhaohong, Li Yongjun, Xiang Lei, Wan Xiaoyong, Liu Shuqin, Xiong Xiaodong, Wang Zhuang, He Xin, Teng Haitao, Gao Yan. Ruthenium targets for magnetron sputtering

1 Scope

This standard specifies the ruthenium target magnetron sputtering requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality certificate and Order (or contract) content. This standard applies to the field of microelectronics sputtering ruthenium target magnetron sputtering (hereinafter referred to as ruthenium target).

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this article Pieces. For undated references, the latest edition (including all amendments) applies to this document. GB/T 1804 General tolerances Tolerances for linear and angular dimensions without tolerances GB/T 5163 Sintered metal materials (excluding cemented carbide) Permeable sintered metal material density, oil content and open area Determination GB/T 6394 metal average grain size determination method GB/T 14265 metal materials, hydrogen, oxygen, nitrogen, carbon and sulfur analysis methods General GB/T 23275 Methods for chemical analysis of ruthenium powder Determination of lead, iron, nickel, aluminum, copper, silver, gold, platinum, iridium, palladium, rhodium and silicon glow discharge Mass spectrometry YS/T 837 Sputtering target - backplane combined with quality ultrasonic testing methods

3 Terms and definitions

The following terms and definitions apply to this document. 3.1 Magnetron sputtering physical vapor deposition; PVD A method of physical vapor deposition coating. By introducing an electric field and a magnetic field on the surface of the target, the magnetic field is used to restrict the charged particles High plasma density, and the use of an electric field of inert gas (usually Ar gas) particles accelerated bombardment of the target surface, thereby sputtering out of the material atoms or Atomic group, the final deposition to form a film coating. 3.2 Palladium for magnetron sputtering prepared from metallic ruthenium was used to prepare ruthenium film plating.

4 requirements

4.1 Product Classification 4.1.1 ruthenium target divided by chemical composition Ru-99.95, Ru-99.99, Ru-99.995, Ru-99.999 four grades. 4.1.2 According to the target welding method can be divided into single type and welding type, backplane materials, including aluminum, copper and copper alloy. 4.1.3 ruthenium target cross-sectional shape can be divided into round, rectangular and shaped (ring, triangle) and so on. ......

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