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GB/T 24300-2025: Test method for flaws in Cu-W electrical contacts
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GB/T 24300-2025: Test method for flaws in Cu-W electrical contacts

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ICS 29.120.99 CCSK14 National Standards of the People's Republic of China Replaces GB/T 24300-2009 Methods for detecting defects in copper-tungsten electrical contacts Published on 2025-10-05 Implemented on May 1, 2026 State Administration for Market Regulation The State Administration for Standardization issued a statement.

Table of contents

Preface III 1.Scope 1 2 Normative References 1 3.Terms and Definitions 1 4.Penetrant Testing 1 4.1 General Rules 1 4.2 Flaw Detection Area 2 5.Detection Method 2 5.1 Flaw Detection Procedure 2 5.2 Preprocessing 2 5.3 Infiltration 2 5.4 Cleaning 2 5.5 Drying 2 5.6 Image Processing 2 5.7 Observation 3 5.8 Post-processing 3 6.Defects show signs 3 6.1 Traces of defects in copper-tungsten alloys 3 6.2 Trace of interface defects in integral copper-tungsten contacts 3 6.3 Traces of defects at the copper end of the integral copper-tungsten contact 3 7.Display and labeling of flaw detection results 3 7.1 Defect Display 3 7.2 Defect Identification 3 8 Test Report 3

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents". Drafting. This document replaces GB/T 24300-2009 "Methods for Testing Defects in Copper-Tungsten Electrical Contacts". Compared with GB/T 24300-2009, except for the structure... Aside from adjustments and editorial changes, the main technical changes are as follows. ---Requirements for flaw detection personnel have been added (see 4.1.1); ---The requirements for flaw detectors have been changed (see 4.1.2, 4.1 in the.2009 version); ---Added requirements for reference test blocks (see 4.1.3); ---The scope of the flaw detection area has been changed (see 4.2,.2009 version 4.2); ---Added requirements for the use of fluorescent penetrants in detection (see 5.3.2, 5.7.2); ---The grading system for defect indication has been removed (see section 6.2 of the.2009 edition); ---The record display of trace level classification has been removed (see Chapter 8 of the.2009 edition). Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents. This document was proposed by the China Electrical Equipment Industry Association. This document is under the jurisdiction of the National Technical Committee on Standardization of Electrical Alloys (SAC/TC228). This document was drafted by. Nanning Bureau of China Southern Power Grid Ultra-High Voltage Transmission Company and Power Department of State Grid Henan Electric Power Company. Research Institute of Science and Technology, Guangxi Power Grid Co., Ltd. Electric Power Research Institute, Guilin Jinge Electrical and Electronic Materials Technology Co., Ltd., Henan Kefeng New Materials Co., Ltd. Materials Co., Ltd., Guilin Electrical Science Research Institute Co., Ltd., Xi'an University of Technology, Suzhou Hilford New Materials Co., Ltd., China Electric Power Research Institute Co., Ltd., Zhejiang Fuda Alloy Materials Technology Co., Ltd., Shaanxi Srui New Materials Co., Ltd., Tianshui Xi'an Electric Power Co., Ltd. Great Wall Alloy Co., Ltd., Beijing University of Science and Technology, Shenyang Jinchang Lanyu New Material Co., Ltd., Zhejiang Naier Alloy Technology Co., Ltd. Xi'an University of Electronic Science and Technology, Guizhou Zhongxi (Shanghai) New Materials Technology Co., Ltd., State Grid Jiangxi Electric Power Research Institute Wenzhou Juxing Technology Co., Ltd., State Grid Ningxia Electric Power Research Institute, North China Electric Power University, Xi'an XD High Voltage Development Co., Ltd. Guanyi Machinery Co., Ltd., Changsha Shenghua Microelectronics Materials Co., Ltd., Shandong Taikai Electric Switch Co., Ltd., Wuhan Tongke Electric Power Technology Co., Ltd., Guangzhou Huasite Alloy Products Co., Ltd., Anhui Mingsheng Hengzhuo Technology Co., Ltd., State Grid Anhui Electric Power Co., Ltd. The company's Electric Power Research Institute, Longyan University, Xinzhou Shanghuayang Electrical Equipment Co., Ltd., Siemens Energy High Voltage Switchgear (Hangzhou) Co., Ltd. Gerun Intelligent Equipment (Shenzhen) Co., Ltd. The main drafters of this document are. Chen Jisheng, Wang Chaohua, Su Yi, Cui Jianhua, Zhang Yan, Cui Defeng, Zhang Qiao, Yang Yucai, Ding Yi, Kong Xin, and Wang Xiaojun. Zhang Hongjun, He Yang, Yang Yongze, Chen Chun, Yu Chuang, Jiang Yibin, Li Yanglin, Huang Guanglin, Ma Feiyue, Ren Hanwen, Cao Weichan, Zhou Jun, Sun Rushui, Tang Huaishou Wen Liping, Wang Shuang, Miao Chunhui, Wu Peng, Li Gang, Ji Cundong, Yan Bo, Long Qi, Zhu Wei, Zhao Haorong, Geng Jinfeng, Du Junli, Pan Jianjin, Wang Jian, Jin Yichen Zhao Jun, Chen Tian, Chen Guang, Cui Bin. The release history of this document and the document it replaces is as follows. ---First published in.2009 as GB/T 24300-2009; ---This is the first revision. Methods for detecting defects in copper-tungsten electrical contacts

1 Scope

This document describes the use of penetrant testing to detect cracks, voids, and localized porosity in copper-tungsten electrical contacts, as well as interfacial cracks in integral copper-tungsten electrical contacts. Methods for identifying common defects such as inclusions, copper end cracks, and porosity. This document applies to the detection of open defects in copper-tungsten electrical contacts and integral copper-tungsten electrical contacts, but is not applicable to copper-tungsten electrical contacts and copper-tungsten... Detection of defects in the overall sealing of electrical contacts.

2 Normative references

The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included. For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies. This document. GB/T 18851.2 Nondestructive testing—Penetrating—Part 2.Testing of penetrant materials GB/T 18851.3 Nondestructive testing—Penetrating—Part 3.Reference blocks

3 Terms and Definitions

The following terms and definitions apply to this document. 3.1 During sintering (or welding), an oxide layer or inclusion layer may exist at the interface between the copper-tungsten alloy of the integral copper-tungsten contact and the conductive end, resulting in... Cracks. 3.2 copper end cracks During sintering (or welding), cracks may form in the copper end of the copper-tungsten integral contact due to the presence of an oxide layer or inclusion layer inside. 4.Penetrant Testing 4.1 General Rules 4.1.1 Personnel A Level 2 Nondestructive Testing Qualification Certificate should be obtained. 4.1.2 Permeable Materials 4.1.2.1 The sensitivity level of the permeation material shall comply with the provisions of GB/T 18851.2, and a permeation material with a sensitivity level of 2 shall be selected. 4.1.2.2 Penetrating materials include penetrants, cleaning agents, and developers. All penetrating materials should be qualified and compatible products manufactured by the same supplier. For this product, it is advisable to use DPT-5 type coloring penetrant or ZB-21 type fluorescent penetrant. 4.1.2.3 The permeable material used for testing should be within its expiration date. When using a Class I permeable material for the first time, it should be tested according to the requirements of GB/T 18851.2. ...