GB/T 20870.5-2023 English PDF

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GB/T 20870.5-2023: Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
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Basic data

Standard ID: GB/T 20870.5-2023 (GB/T20870.5-2023)
Description (Translated English): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L56
Classification of International Standard: 31.080.01
Word Count Estimation: 34,343
Date of Issue: 2023-09-07
Date of Implementation: 2024-01-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 20870.5-2023: Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.080.01 CCSL56 National Standards of People's Republic of China Semiconductor device Part 16-5.Microwave integrated circuit oscillators (IEC 60747-16-5.2020,IDT) Published on 2023-09-07 2024-01-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration Committee

Table of contents

Preface III Introduction IV 1 Scope 1 2 Normative reference documents 1 3 Terms and Definitions 1 4 Basic ratings and characteristics3 4.1 General requirements 3 4.2 Application Note 4 4.3 Functional specifications 4 4.4 Limit values (absolute maximum rating system) 6 4.5 Working conditions (within the specified operating temperature range) 7 4.6 Electrical Characteristics 7 4.7 Mechanical and Environmental Ratings, Characteristics and Data8 4.8 Additional information8 5 Test Method 8 5.1 General 8 5.2 Oscillation frequency (fosc) 9 5.3 Output power (Po,osc) 10 5.4 Phase noise [φ(f)] 10 5.5 ESC sensitivity (Sf,v) 15 5.6 Amount of push frequency (fosc, push) 16 5.7 Frequency pulling (fosc,pul) 16 5.8 nth harmonic suppression degree (Pnth/P1) 18 5.9 Output power flatness (ΔPo,osc) 18 5.10 ESC linearity19 5.11 Temperature coefficient of oscillation frequency (αf,temp) 20 5.12 Output power temperature coefficient (αP,temp) 22 5.13 Clutter suppression (Ps/P1) 23 5.14 Modulation bandwidth (Bmod) 23 5.15 sensitivity flatness 25 6 Related tests for load mismatch 26 6.1 Load mismatch tolerance (ΨL) 26 6.2 Load mismatch strength (ΨR) 28 Reference 29

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. This document is Part 5 of GB/T 20870 "Semiconductor Devices". GB/T 20870 has released the following parts. ---Part 16-1.Microwave integrated circuit amplifier; ---Part 16-2.Microwave integrated circuit prescaler; ---Part 16-5.Microwave integrated circuit oscillators; ---Part 16-10.Monolithic microwave integrated circuit technology receivable procedures. This document is equivalent to IEC 60747-16-5.2020 "Semiconductor Devices Part 16-5.Microwave Integrated Circuit Oscillators". Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This document was drafted by. China Electronics Technology Group Corporation 13th Research Institute, China Electronics Technology Group Corporation 55th Research Institute, Anhui Juncheng Technology Co., Ltd., Hebei Beixin Semiconductor Technology Co., Ltd., Guangdong Zhongshaoxuan Standardization Technology Research Institute Co., Ltd., Anhui Hui Yihui Electronic Technology Co., Ltd. The main drafters of this document. Chi Lei, Gao Lei, Cui Congjun, Peng Hao, Yin Lijing, Liu Dongyue, Wen Yanbing, Yin Liyi, Mao Zuxue.

Introduction

Semiconductor devices are common basic products in the electronics industry chain and are the most basic units in electronic systems. GB/T 20870 "Semiconductors" "Integrated Device" is a microwave integrated circuit product standard. It is a basic and universal standard for the development, production and inspection of microwave integrated circuits. Evaluating and assessing the quality and reliability of microwave integrated circuits plays an important role and is planned to consist of 10 parts. ---Part 16-1.Microwave integrated circuit amplifier. The purpose is to specify the terminology, basic ratings of microwave integrated circuit amplifiers Values, properties, and test methods. ---Part 16-2.Microwave integrated circuit prescaler. The purpose is to specify the terms and letters of microwave integrated circuit prescalers. Symbols, basic ratings, characteristics, and test methods. ---Part 16-3.Microwave integrated circuit frequency converter. The purpose is to specify the terminology and basic ratings of microwave integrated circuit inverters. Values, properties, and test methods. ---Part 16-4.Microwave integrated circuit switches. The purpose is to specify the terminology, basic ratings, characteristics of microwave integrated circuit switches properties and testing methods. ---Part 16-5.Microwave integrated circuit oscillators. The purpose is to specify the terminology, basic ratings of microwave integrated circuit oscillators Values, properties, and test methods. ---Part 16-6.Microwave integrated circuit frequency multiplier. The purpose is to specify the terminology and basic ratings of microwave integrated circuit frequency multipliers. Values, properties, and test methods. ---Part 16-7.Microwave integrated circuit attenuators. The purpose is to specify the terminology, basic ratings of microwave integrated circuit attenuators Values, properties, and test methods. ---Part 16-8.Microwave integrated circuit limiter. The purpose is to specify the terminology, basic ratings of microwave integrated circuit limiters Values, properties, and test methods. ---Part 16-9.Microwave integrated circuit phase shifters. The purpose is to specify the terminology, basic ratings of microwave integrated circuit phase shifters Values, properties, and test methods. ---Part 16-10.Monolithic microwave integrated circuit technology receivable procedures. The purpose is to specify the design, Terminology, definitions, symbols, quality systems, testing, evaluation, verification methods and other requirements for manufacturing and delivery. This series of standards is equivalent to the IEC 60747-16 series of standards, ensuring that microwave integrated circuit product standards are consistent with international standards, achieving Microwave integrated circuit product standards are in line with international standards. Through the formulation of this series of standards, the terminology definitions and basic specifications of microwave integrated circuit products are unified. The fixed values, characteristics and test methods are of great significance to the research, production, inspection and use of microwave integrated circuits, and at the same time complement and improve the semiconductor The integrated circuit standard system plays a guiding role in the development of the microwave integrated circuit industry. Semiconductor device Part 16-5.Microwave integrated circuit oscillators

1 Scope

This document specifies the terminology, basic ratings, characteristics, and test methods for microwave integrated circuit oscillators. This document applies to fixed frequency oscillators and microwave voltage controlled oscillators, except for oscillator modules that require an external controller (such as synthesizers). Note. This document does not apply to quartz crystal oscillators specified in IEC 60679-1.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document. Note. GB/T 4728 (all parts) Graphical symbols for electrical diagrams [IEC 60617 (all parts)] IEC 60747-1.2006/AMD1.2010 Note. GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1.General provisions (IEC 60747-1.1993, IDT) IEC 60747-4.2007 Semiconductor devices Discrete devices Part 4.Microwave diodes and transistors (Semiconductorde- IEC 60747-4.2007/AMD1.2017 Note. GB/T 20516-2006 Semiconductor devices Discrete devices Part 4.Microwave devices (IEC 60747-4.2001, IDT) IEC 60747-16-3.2002 Semiconductor devices Part 16-3.Microwave integrated circuit frequency converter (Semiconductor IEC 60747-16-3.2002/AMD1.2009 IEC 60747-16-3.2002/AMD2.2017 IEC 61340-5-1 Electrostatics Part 5-1.Basic requirements for electrostatic protection of electronic devices (Electrostatics-Part 5-1. IEC /T R61340-5-2 Electrostatics Part 5-2.User Guide for Electrostatic Protection of Electronic Devices (Electrostatics-Part

3 Terms and definitions

The following terms and definitions apply to this document. 3.1 oscillation frequencyoscilationfrequency The frequency measured at the output. ......

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