GB/T 17473.6-2008 English PDFUS$139.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 17473.6-2008: Test methods of precious metal pastes used for microelectronics -- Determination of resolution Status: Valid GB/T 17473.6: Historical versions
Basic dataStandard ID: GB/T 17473.6-2008 (GB/T17473.6-2008)Description (Translated English): Test methods of precious metal pastes used for microelectronics -- Determination of resolution Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: H68 Classification of International Standard: 77.120.99 Word Count Estimation: 6,676 Date of Issue: 2008-03-31 Date of Implementation: 2008-09-01 Older Standard (superseded by this standard): GB/T 17473.6-1998 Quoted Standard: GB/T 8170 Regulation (derived from): National Standard Approval Announcement 2008 No.5 (Total No.118) Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China Summary: This standard specifies the method for determining precious metal microelectronics slurry resolution. This section applies to microelectronics-Determination of precious metal slurry resolution. GB/T 17473.6-2008: Test methods of precious metal pastes used for microelectronics -- Determination of resolution---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. Test methods of precious metal pastes used for microelectronics. Determination of resolution ICS 77.120.99 H68 National Standards of People's Republic of China Replacing GB/T 17473.6-1998 Microelectronics precious metal pastes used test method Resolution Determination Posted 2008-03-31 2008-09-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released ForewordThis standard replaces GB/T 17473-1998 "precious metal pastes used for thick film microelectronics test methods" (all parts), this sub-standard Seven parts. --- GB/T 17473.1-2008 microelectronics test method for measuring precious metal slurry solids content; --- GB/T 17473.2-2008 microelectronics test method for measuring the fineness of precious metal pastes; --- GB/T 17473.3-2008 microelectronics precious metal pastes used test method for measuring the resistance parties; --- GB/T 17473.4-2008 microelectronics adhesion testing precious metal pastes used test methods; --- GB/T 17473.5-2008 microelectronics precious metal slurry viscosity measurement test methods; --- GB/T 17473.6-2008 microelectronics resolution measurement test methods of precious metal pastes; --- GB/T 17473.7-2008 microelectronics precious metal pastes used test methods weldability, resistance to soldering determination. This section GB/T 17473-2008 Part 6. This Part replaces GB/T 17473.6-1998 "precious metal pastes used for thick film microelectronics Test Method for Determination of the resolution." This portion of the GB/T 17473.6-1998 compared to the main changes are as follows. --- Modify the original standard name for the microelectronics precious metal pastes used test methods resolution determination; --- Increased curable precious metal content of the slurry was measured resolution; --- The original "photoresist film 20-25μm diameter stainless steel mesh mesh network" to "photoresist film mesh, mesh pore size of not greater than 54μm"; --- Increased 6.3 curable printed samples according prescribed process requirements stand, drying, curing, film thickness control samples after curing System in 1μm ~ 15μm; --- Resolution specifications grade redefined as 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm five levels. This part is proposed by the China Nonferrous Metals Industry Association. The non-ferrous metal part by the National Standardization Technical Committee centralized. This section is your research Platinum Ltd. is responsible for drafting. Drafters of this section. Liu Cheng, Zhaoru Yun, Chen Fusheng, Ma Xiaofeng, Liu Jisong, Zhu Wuxun. This part of the standard replaces the previous editions are. --- GB/T 17473.6-1998. Microelectronics precious metal pastes used test method Resolution Determination1 ScopeThis section provides microelectronics method for the determination of precious metal pastes resolution. This section applies to the determination of precious metal pastes microelectronics resolution.2 Normative referencesThe following documents contain provisions which, through reference in this text, constitute provisions of this part. For dated references, subsequent Amendments (not including errata content) or revisions do not apply to this section, however, encourage the parties to this part of the research agreement Whether the latest versions of these documents. For undated reference documents, the latest versions apply to this section. GB/T 8170 numerical rounding rules3 Method summaryPaste by screen printing in a pattern. Graphics by normal use conditions slurry sintering or curing requires curing or sintering with microstructure Mirror at a certain magnification observation and measurement of the pattern line width and line spacing film, the slurry was measured resolution.4 Materials4.1 photoresist film mesh, mesh pore size of not greater than 54μm. 4.2 comply with different use requirements slurry of substrate. Substrate surface roughness of not more than 1.5μm (measured at distance of 10mm condition the amount).5 instruments and equipment5.1 screen printing machine. 5.2 infrared dryer, the highest temperature 350 ℃, temperature control accuracy of ± 5 ℃. 5.3 tunnel sintering furnace, the maximum temperature 1000 ℃, temperature control accuracy of ± 10 ℃. 5.4 electric blast oven, the highest temperature 300 ℃, temperature control accuracy of ± 5 ℃. 5.5 reading microscope, magnification 25X ~ 100X, reading accuracy 0.01mm or more. 5.6 light cut thickness or electronic micrometer, reading accuracy of 1μm or more.6 measuring stepTest at a temperature of 20 ℃ ~ 25 ℃, relative humidity of 45% to 75% and atmospheric pressure 86kPa ~ 106kPa environment. 6.1 Stir the sample can not be introduced impurities. Screen printing machine to print graphics on a substrate, a print pattern of Table 1, the film width Degrees and line spacing is equal to five groups of 4 lines graphical components. 6.2 The printed substrate levels sintered slurry placed 5min. Infrared dryer under the conditions of 150 ℃ ~ 300 ℃ drying, the sample Dry film thickness control in 10μm ~ 35μm. After drying the sample placed in the tunnel sintering furnace, according to the slurry fired furnace temperature curve setting Sintered fired film thickness control in 5μm ~ 25μm. 6.3 The printed sample curable slurry process requirements of its provisions allowed to stand, drying, curing, after curing the film thickness control samples In 1μm ~ 15μm. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 17473.6-2008_English be delivered?Answer: Upon your order, we will start to translate GB/T 17473.6-2008_English as soon as possible, and keep you informed of the progress. 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