PDF GB/T 2423.32-2008 English (GB/T 2423.32-1985: Older version)
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Environmental testing for electric and electronic products - Part 2: Test Methods - Test Ta: Solderability test by the wetting balance method
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| GB/T 2423.32-1985 | English | 199 |
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Basic environmental testing procedures for electric and electronic products - Solderability testing by the wetting balance method
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GB/T 2423.32-2008: PDF in English (GBT 2423.32-2008) GB/T 2423.32-2008
GB
NATIONAL STANDARD OF THE
PEOPLE’S REPUBLIC OF CHINA
ICS 19.040
K 04
GB/T 2423.32-2008 / IEC 60068-2-54:2006
Replacing GB/T 2423.32-1985, GB/T 2424.21-1985
Environmental Testing for Electric and Electronic
Products - Part 2: Test Methods - Test Ta: Solderability
Test by the Wetting Balance Method
(IEC 60068-2-54:2006, IDT)
ISSUED ON: MARCH 24, 2008
IMPLEMENTED ON: OCTOBER 1, 2008
Issued by: General Administration of Quality Supervision, Inspection and
Quarantine;
Standardization Administration of the People’s Republic of
China.
Table of Contents
Foreword ... 3
1 Scope ... 5
2 Normative References ... 5
3 Terms and Definitions ... 5
4 General Description of the Test ... 6
5 Description of the Test Apparatus ... 6
6 Preconditioning ... 7
7 Materials ... 7
8 Procedure ... 8
9 Presentation of Results ... 9
10 Information to be Given in the Relevant Specification ... 12
Appendix A (normative) Equipment Specification ... 13
Appendix B (informative) Guide to the Use of the Wetting Balance for
Solderability Testing ... 14
B.1 Definition of the Measure of “wettability” ... 14
B.2 Specimen Shape ... 14
B.3 Specimen Preparation ... 14
B.4 Characteristics of Test Apparatus ... 15
B.5 Some Representative Force-time Curves ... 17
B.6 Parameters to be Measured from the Force-time Trace ... 19
Bibliography ... 21
Foreword
GB/T 2423 Environmental Testing for Electric and Electronic Products - Part 2: Test
Methods is divided into several parts in accordance with the test methods.
This is Part 32 of GB/T 2423. This Part equivalently adopts international standard IEC
60068-2-54:2006. In comparison with the international standard, this Part mainly
makes the following editorial modifications:
a) The Foreword and Introduction of the international standard are deleted;
b) The Foreword of the national standard is added;
c) The national standards that adopt international standards are quoted;
d) The tabs A.1 ~ A.11 in Appendix A are deleted, and the contents are directly
converted into paragraphs.
In comparison with the previous version, the main differences are as follows:
a) This Part combines GB/T 2423.32-1985 and GB/T 2424.21-1985;
b) Lead-free solder is added;
c) Different test temperatures are set in accordance with the solder composition;
d) The polarity of force of the force-time curve;
e) Representative points and parameters on the force-time curve;
f) GB/T 2424.21-1985 is modified into Appendix B;
g) Bibliography is added.
Appendix A of this Part is normative; Appendix B is informative.
This Part was proposed by and shall be under the jurisdiction of National Technical
Committee 8 on Environmental Conditions of Electric and Electronic Products and
Environmental Test of Standardization Administration of China (SAC/TC 8).
The drafting organization of this Part: Guangzhou National Electric Apparatus
Research Institute.
The main drafter of this Part: Yan Jinglian.
The issuing of the previous versions:
---GB/T 2423.32-1985;
Environmental Testing for Electric and Electronic
Products - Part 2: Test Methods - Test Ta: Solderability
Test by the Wetting Balance Method
1 Scope
This Part of GB/T 2423 outlines Test Ta, solder bath wetting balance method applicable
for any shape of component terminations to determine the solderability. It is especially
suitable for reference testing and for components that cannot be quantitatively tested
by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be
applied if it is suitable.
2 Normative References
The clauses of the following documents become clauses of this Part through the
reference in GB/T 2423. In terms of references with a specified date, all subsequent
amendments (excluding corrected content) or revisions are not applicable to this
Standard. However, all parties that reach an agreement in accordance with this
Standard are encouraged to explore the possibility of adopting the latest editions of
these documents. In terms of references without a specified date, the latest edition is
applicable to this Standard.
GB/T 2421-1999 Environmental Testing for Electric and Electronic Products - Part 1:
General and Guidance (idt IEC 60068-1:1988)
GB/T 2423.28-2005 Basic Environmental Testing Procedures for Electric and
Electronic Products - Part 2: Test Methods - Test T: Soldering (IEC 60068-2-20:1979,
IDT)
IEC 61190-1-3:2002 Attachment Materials for Electronic Assembly - Part 1-3:
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid
Solders for Electronic Soldering Applications
3 Terms and Definitions
For the purposes of this document, the terms and definitions, as defined in GB/T 2421-
1999 and GB/T 2423.28-2005, apply.
......
Source: Above contents are excerpted from the PDF -- translated/reviewed by: www.chinesestandard.net / Wayne Zheng et al.
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