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Terms of microlithography technology for microelectronics
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Basic data | Standard ID | GB/T 44928-2024 (GB/T44928-2024) | | Description (Translated English) | Terms of microlithography technology for microelectronics | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L90 | | Classification of International Standard | 31.030 | | Word Count Estimation | 190,124 | | Date of Issue | 2024-12-31 | | Date of Implementation | 2024-12-31 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 44928-2024: Terms of microlithography technology for microelectronics
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ICS 31.030
CCSL90
National Standard of the People's Republic of China
Microelectronics Microlithography Terminology
Released on 2024-12-31
2024-12-31 implementation
State Administration for Market Regulation
The National Standardization Administration issued
Table of Contents
Preface III
1 Scope 1
2 Normative references 1
3 Terms and Definitions 1
3.1 Microelectronics Lithography Technology 1
3.2 Advanced Lithography Technology 11
3.3 Microlithography Patterning and Graphics Data Processing Technology 47
3.4 Microlithography photosensitive materials, chrome plates and substrate materials 55
3.5 Photomask Technology 60
3.6 Photolithography (exposure, etching and micro-nano processing) technology 63
3.7 Electron beam mask manufacturing and direct writing technology 84
3.8 Lithography and Mask Quality Parameter Measurement and Evaluation 89
3.9 Mask manufacturing equipment and microlithography equipment 100
Index 132
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document was proposed and coordinated by the National Technical Committee for Semiconductor Equipment and Materials Standardization (SAC/TC203).
This document was drafted by. Institute of Microelectronics, Chinese Academy of Sciences.
The main drafters of this document are. Chen Baoqin, Wang Xiang, Li Hewei, Wang Liyu, Li Xintao, Feng Boru, Xue Lijun, Hao Meiling and Xue Cairong.
Microelectronics Microlithography Terminology
1 Scope
This document defines microelectronics lithography, advanced lithography, microlithography patterning and patterning technology related to microelectronics microlithography.
Data processing technology, microlithography photosensitive materials, chrome plates and substrate materials, photomask technology, photolithography process (exposure, etching and micro-nano processing) technology
technology, electron beam mask manufacturing and direct writing technology, lithography and mask quality parameter measurement and evaluation, mask manufacturing equipment and microlithography equipment, etc.
and definitions.
This document is applicable to teaching, scientific research, production, application, trade and technical exchange in the field of microelectronics microlithography technology.
2 Normative references
This document has no normative references.
3 Terms and definitions
3.1 Microelectronics Lithography
3.1.1
Microelectronics
Research on solid functional materials (mainly semiconductor materials) and the development and production technology of microelectronic components based on these functional materials
The discipline includes its physical properties, working principles, design theory of circuit integration and system integration, and production process and manufacturing technology.
3.1.2
Semiconductor materials, semiconductor physics, semiconductor devices, microelectronics, semiconductor integrated circuit design and manufacturing process technology and industrialization
A comprehensive science that integrates both science and technology.
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