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GB/T 29847-2025: Test methods for copper foil used for printed boards
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GB/T 29847-2025	English	599	Add to Cart	5 days [Need to translate]	Test methods for copper foil used for printed boards
GB/T 29847-2013	English	719	Add to Cart	6 days [Need to translate]	Test methods for copper foil used for printed boards

Similar standards

GB/T 41203 | GB/T 37406 | GB/T 29848 | GB/T 29846 |

GB/T 29847-2025: Test methods for copper foil used for printed boards

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ICS 31.030 CCSL90 National Standard of the People's Republic of China Replaces GB/T 29847-2013 Test methods for copper foil for printed circuit boards Released on 2025-03-28 2025-10-01 Implementation State Administration for Market Regulation The National Standardization Administration issued

Table of contents

Preface III 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Test conditions 2 5 Sampling method 2 6 Appearance and dimensional test methods 2 7 Physical properties test methods 7 8 Process performance test methods 13 Appendix A (Informative) Preparation method of microsection specimen 22

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents" Drafting. This document replaces GB/T 29847-2013 "Test methods for copper foil for printed boards". Compared with GB/T 29847-2013, except for the structural adjustment In addition to the integration and editorial changes, the main technical changes are as follows. a) Added the terms "pinhole" and "penetration point" (see 3.5, 3.6); deleted the term "profile factor" (see 3.1 of the.2013 edition); The terms "treatment" and "arithmetic mean deviation of profile" are changed to "surface treatment" and "surface roughness" (see 3.1, 3.2,.2013 edition) 3.2, 3.3); the definition of the term "micro roughness" has been changed (see 3.3, 3.4 of the.2013 edition); b) The sampling method has been changed (see Chapter 5, Chapter 5 of the.2013 edition); c) The permissible error of magnifying glass or microscope instruments has been changed (see Chapter 6, 6.1.2 of the.2013 edition); d) Added discoloration points in surface inspection (see 6.1.3.4); e) The pinhole inspection (penetrant method) has been modified (see Chapter 6, 6.2 of the.2013 edition); f) Deleted "the total thickness and outline factor of treated or untreated copper foil" in the appearance and size test methods (see 6.3 of the.2013 edition); g) Increased roughness (laser method) (see 6.7); h) Deleted bending fatigue and ductility (see 7.2 of the.2013 edition); i) increased bending resistance (see 7.2); j) increased flexural resistance (see 7.3); k) Deleted "Peel strength measurement after thermal stress" (see 7.3.3.3 of the.2013 edition); l) Deleted "Peel strength measurement after exposure to process solution" (see 7.3.3.4 of the.2013 edition); m) Added "peel strength after solvent resistance" (see 7.4.3.3); n) Added "solder heat resistance" (see 7.5); o) Added "high temperature oxidation resistance" (see 8.7); p) Deleted "Purity of copper foil or copper plating" (see 9.1 of the.2013 edition); q) Added “Chemical composition of copper foil” (see 8.8). Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents. This document was proposed and coordinated by the National Technical Committee for Semiconductor Equipment and Materials Standardization (SAC/TC203). This document was drafted by. China Electronics Technology Standardization Institute, Sichuan Mingfeng Electronic Materials Technology Co., Ltd., Shanxi Beitong New Materials Technology Co., Ltd., Guangdong Yinghua Electronic Technology Co., Ltd., Jiangsu Mingfeng Electronic Materials Technology Co., Ltd., Chongqing Yulong Optoelectronics Technology Co., Ltd. Co., Ltd., Shenzhen Huike New Materials Co., Ltd., Lingbao Jinyuan Chaohui Copper Co., Ltd., Junxuan New Materials (Hangzhou) Co., Ltd., Shaanxi Baoyu Technology Industry Co., Ltd., Shenzhen Linghangda Electronics Co., Ltd., and Jiangxi Jiangxi Copper Foil Technology Co., Ltd. The main drafters of this document are. Cao Kewei, Wang Pengju, Wu Ting, Li Xueping, Zhang Baoshuai, Shi Zeyuan, Ming Zhiyao, Zhao Junsha, Wu Yiran, Xu Jianwei, Zhao Xiaohui, Tang Jianming, Zeng Zhaofeng, Xu Jiaolong, Qian Yan, Chai Shengli, Wang Chunwen, Yu Kemiao. This document was first published in.2013 and this is the first revision. Test methods for copper foil for printed circuit boards

1 Scope

This document describes the test methods for the appearance, dimensions, physical properties, processing properties, and other properties of copper foil for printed boards. This document applies to the testing of copper foil for rigid or flexible printed boards.

2 Normative references

The contents of the following documents constitute essential clauses of this document through normative references in this document. For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to This document. GB/T 2036 Terminology for printed circuits GB/T 3131 Tin-lead solder GB/T 4723 Copper-clad phenolic paper laminate for printed circuits GB/T 5121.1 Chemical analysis methods for copper and copper alloys Part 1.Determination of copper content GB/T 5121.2 Chemical analysis methods for copper and copper alloys Part 2.Determination of phosphorus content GB/T 5121.3 Chemical analysis methods for copper and copper alloys Part 3.Determination of lead content GB/T 5121.4 Chemical analysis methods for copper and copper alloys Part 4.Determination of carbon and sulfur content GB/T 5121.5 Chemical analysis methods for copper and copper alloys Part 5.Determination of nickel content GB/T 5121.6 Chemical analysis methods for copper and copper alloys Part 6.Determination of bismuth content GB/T 5121.7 Chemical analysis methods for copper and copper alloys Part 7.Determination of arsenic content GB/T 5121.8 Chemical analysis methods for copper and copper alloys Part 8.Determination of oxygen content GB/T 5121.9 Chemical analysis methods for copper and copper alloys Part 9.Determination of iron content GB/T 5121.10 Chemical analysis methods for copper and copper alloys Part 10.Determination of tin content GB/T 5121.11 Chemical analysis methods for copper and copper alloys Part 11.Determination of zinc content GB/T 5121.15 Chemical analysis methods for copper and copper alloys Part 15.Determination of cobalt content GB/T 5121.16 Chemical analysis methods for copper and copper alloys Part 16.Determination of chromium content GB/T 5121.27 Chemical analysis methods for copper and copper alloys Part 27.Inductively coupled plasma optical emission spectrometry GB/T 13557-2017 Test methods for flexible copper clad materials for printed circuits

3 Terms and definitions

The terms and definitions defined in GB/T 2036 and the following apply to this document. 3.1 Surface treatment surface treatment An electrical, mechanical or chemical process applied to the surface of copper foil. Note. Used to improve surface oxidation resistance, corrosion resistance or adhesion to laminate substrates and other properties. 3.2 Surface roughness Ra ...