GB/T 8446.1-2022 English PDFUS$439.00 · In stock
Delivery: <= 4 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 8446.1-2022: Heat sinks for power semiconductor devices - Part 1: Radiators Status: Valid GB/T 8446.1: Historical versions
Basic dataStandard ID: GB/T 8446.1-2022 (GB/T8446.1-2022)Description (Translated English): Heat sinks for power semiconductor devices - Part 1: Radiators Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: K46 Word Count Estimation: 22,210 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GB/T 8446.1-2022: Heat sinks for power semiconductor devices - Part 1: Radiators---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.Heat sinks for power semiconductor devices - Part 1.Radiators ICS 29.120.99 CCSK46 National Standards of People's Republic of China Replacing GB/T 8446.1-2004 Heat sinks for power semiconductor devices Part 1.Heat sink Published on 2022-03-09 2022-10-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration directory Preface I Introduction III 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Type and cooling method code 2 5 Dimensions and installation dimensions3 5.1 Dimensions of SF series heat sink 3 5.2 Dimensions of SS Series Heatsinks 8 6 Other technical requirements10 6.1 Appearance 10 6.2 Main performance 10 6.3 Radiator Assembly 11 7 Inspection rules 12 7.1 Lot-by-lot inspection 12 7.2 Type test 12 8 Marking, packaging, transportation and storage 13 8.1 Flags 13 8.2 Packaging 13 8.3 Transport and storage 13 Appendix A (Informative) Heatsink Characteristic Curve Example 14 Appendix B (normative) Sampling Table 16 Reference 17 forewordThis document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents" drafted. GB/T 8446 "Heat sinks for power semiconductor devices" and the following standards together constitute the series of heat sinks for power semiconductor devices in my country standard. ---JB/T 5781 Specifications for Profile Heatsinks for Power Semiconductor Devices; ---JB/T 8175 Profile dimensions of heat sinks for power semiconductor devices; ---JB/T 8757 Heat pipe radiator for power semiconductor devices; ---JB/T 9684 Guidelines for selection of heat sinks for power semiconductor devices. This document is part 1 of GB/T 8446 "Heat sinks for power semiconductor devices". GB/T 8446 has released the following parts. --- Part 1.Heat sink; --- Part 2.Measurement methods of thermal resistance and flow resistance; --- Part 3.Insulation and fasteners. This document replaces GB/T 8446.1-2004 "radiators for power semiconductor devices - Part 1.Casting series". and Compared with GB/T 8446.1-2004, in addition to structural adjustment and editorial changes, the main technical changes are as follows. a) Changed the "scope" and "normative references" (see Chapters 1 and 2, Chapters 1 and 2 of the.2004 edition); b) Changed the definitions of "heat sink", "heat sink", "thermal resistance", "flow resistance", "tabletop" and "tabletop temperature", and added "(water cooling body) The definition of "cavity" (see Chapter 3, Chapter 3 of the.2004 edition); c) Change "water-cooled radiator" to "water-cooled radiator" (see 4.1, 6.2 and Chapter 7, 4.2, 5.4, Chapter 6 and.2004 edition). Chapter 7); d) Deleted bolt-shaped self-cooling radiator SZ series and bolt-shaped air-cooling radiator SL series (see 4.3, Chapter 5 of the.2004 edition and Chapter 6); e) change the notation "α" representing the angle in Figure 4 and Table 4 to "β" (see 5.2.1, 5.4 of the.2004 edition); f) Added SF3× series heat sink and SS3× series heat sink (see Chapter 4~Chapter 6); g) Changed the provisions on the leakage test pressure of the cavity of the water cooling radiator (see 6.2, 6.3 of the.2004 edition), deleted the withstand voltage of the insulating parts Pressure requirements and regulations on heat sink material (see 6.3.1 and 6.4 of the.2004 edition); h) Added requirements for salt spray resistance (see 6.1 and 7.2); i) Changed "periodic inspection" to "type test", and changed the corresponding provisions (see 7.2, 7.2 of the.2004 edition); j) Changed Appendix A and Appendix B (see Appendix A and Appendix B, Appendix A and Appendix B of the.2004 edition). Please note that some content of this document may be patented. The issuing agency of this document assumes no responsibility for identifying patents. This document is proposed by China Electrical Equipment Industry Association. This document is under the jurisdiction of the National Standardization Technical Committee for Power Electronic Systems and Equipment (SAC/TC60). This document is drafted by. Xiangbo Heat Transfer Technology Co., Ltd., Xi'an Perui Power Semiconductor Converter Technology Co., Ltd., Global Energy Internet Research Institute Co., Ltd., Guangzhou Gaolan Energy Saving Technology Co., Ltd., Jiangsu Xincaiyang Electromechanical Technology Co., Ltd., Hebei Hua Entire Industry Co., Ltd., CRRC Zhuzhou Electric Locomotive Research Institute Co., Ltd., Jiangsu Hongwei Technology Co., Ltd., Jiangsu Haiding Electric Technology Co., Ltd., Hubei Taiji Semiconductor Co., Ltd., Xi'an Power Electronics Technology Research Institute, Changzhou Borui Electric Power Automation Equipment Co., Ltd. company. The main drafters of this document. Zeng Maojin, Wei Hongqi, Zhou Jianhui, Guan Shengli, Sang Chun, Song Xiaofei, Tian En, Wang Xiaobao, Tao Yong, Yan Jiasheng, Li Xiaoguo, Yun Qianglong, Wen Yuliang, Ji Weifeng, Ji Xiyang, Han Haolei, Cui Pengfei, Lu Zhengbai. The previous versions of this document and its superseded documents are as follows. ---First published in 1979 as JB2594-1979 "Heat radiator for power semiconductor devices"; ---First published as GB/T 8446.1 in 1987 and replaced JB2594-1979, first revised in.2004; ---This is the second revision.IntroductionGB/T 8446 "Heat radiator for power semiconductor devices" gives the radiator, insulating parts and fasteners that constitute the heat sink for power semiconductor devices Technical requirements for firmware, inspection rules, requirements for marking, packaging, transportation and storage, and measurement methods for thermal resistance and flow resistance of heat sinks are to be determined by 3 part composition. --- Part 1.Heat sink. The purpose is to specify the terms, definitions, and techniques of heat sinks constituting heat sinks for power semiconductor devices. requirements, inspection rules and requirements for marking, packaging, transport and storage. --- Part 2.Thermal and flow resistance measurement methods. The purpose is to standardize heat sinks (including heat sinks) that constitute heat sinks for power semiconductor devices Methods for the measurement of thermal and flow resistance of cast, extruded, profiled and heat pipe radiators). --- Part 3.Insulation and fasteners. The purpose is to specify insulating members and fasteners constituting heat sinks for power semiconductor devices technical requirements, inspection rules and requirements for marking, packaging, transportation and storage. Heat sinks for power semiconductor devices Part 1.Heat sink1 ScopeThis document specifies the terms and definitions, types and cooling methods, external dimensions and installation dimensions of heat sinks for power semiconductor devices dimensions, technical requirements, inspection rules, and requirements for marking, packaging, transportation and storage. This document applies to air-cooled heat sinks and water-cooled heat sinks for power semiconductor devices. Dimensions and mounting dimensions conform to this article The profile heat sinks specified in Chapter 5 of the software can also be used by reference. This document does not apply to heat pipe type heat sinks.2 Normative referencesThe contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to this document. GB/T 1031-2009 Product Geometric Technical Specification (GPS) Surface Structure Profile Method Surface Roughness Parameters and Their Values GB/T 1804-2000 General Tolerances Unmarked Tolerances of Linear and Angular Dimensions GB/T 1958-2017 Product Geometric Specifications (GPS) Geometric Tolerance Detection and Verification GB/T 2423.17-2008 Environmental Testing of Electrical and Electronic Products Part 2.Test Method Test Ka. Salt Spray GB/T 8446.2 Heat sinks for power semiconductor devices - Part 2.Test methods for thermal resistance and flow resistance GB/T 8446.3 Heat sinks for power semiconductor devices - Part 3.Insulators and fasteners JB/T 4159 General technical requirements for tropical electrical products3 Terms and DefinitionsThe following terms and definitions apply to this document. 3.1 radiator heatsink It consists of a heat sink, conductive terminals, fasteners and insulating parts (if any), etc., and is a mechanical assembly with heat dissipation function for semiconductor devices. Note. The radiator is usually "set" as the product unit. [Source. GB/T 2900.32-1994, 2.4.1, with modifications] 3.2 Radiator A thermal conductor that plays a major role in the heat dissipation function of the radiator. [Source. GB/T 2900.32-1994, 2.4.2, with modifications] 3.3 Cooling medium A liquid (eg, water) or gas (eg, air) that removes heat generated by a semiconductor device. [Source. GB/T 3859.1-2013, 3.8.1, with modifications] ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 8446.1-2022_English be delivered?Answer: Upon your order, we will start to translate GB/T 8446.1-2022_English as soon as possible, and keep you informed of the progress. The lead time is typically 2 ~ 4 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 8446.1-2022_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 8446.1-2022_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.Question 3: Does the price include tax/VAT?Answer: Yes. 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