GB/T 8446.2-2022 English PDFUS$339.00 · In stock
Delivery: <= 4 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 8446.2-2022: Heat sinks for power semiconductor devices - Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop Status: Valid GB/T 8446.2: Historical versions
Basic dataStandard ID: GB/T 8446.2-2022 (GB/T8446.2-2022)Description (Translated English): Heat sinks for power semiconductor devices - Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: K46 Word Count Estimation: 17,140 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GB/T 8446.2-2022: Heat sinks for power semiconductor devices - Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. Heat sinks for power semiconductor devices - Part 2.Measurement methods of thermal resistance and inlet-outlet fluid pressure drop ICS 31.220.01 CCSK46 National Standards of People's Republic of China Replacing GB/T 8446.2-2004 Heat sinks for power semiconductor devices Part 2.Thermal and flow resistance measurement methods Published on 2022-03-09 2022-10-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration directory Preface III Introduction IV 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Thermal resistance measurement method 2 4.1 Principle 2 4.2 Specified points for temperature measurement 2 4.3 Measurement of temperature at specified point 3 4.4 Measurement system 3 4.5 Measurement Conditions 5 4.6 Measurement procedure 5 5 Flow resistance measurement method 6 5.1 Principle 6 5.2 Specified points for pressure measurement 6 5.3 Measuring system 7 5.4 Measurement Conditions 7 5.5 Measurement procedure 7 Appendix A (informative) Determination of thermal resistance of heat sinks for double-sided heat dissipation semiconductor devices by measuring heat flow 8 Appendix B (Informative) Heat Balance Relative Error Calculation 11 Reference 12 forewordThis document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents" drafted. GB/T 8446 "Heat sinks for power semiconductor devices" and the following standards together constitute the series of heat sinks for power semiconductor devices in my country standard. ---JB/T 5781 Specifications for Profile Heatsinks for Power Semiconductor Devices; ---JB/T 8175 Profile dimensions of heat sinks for power semiconductor devices; ---JB/T 8757 Heat pipe radiator for power semiconductor devices; ---JB/T 9684 Guidelines for selection of heat sinks for power semiconductor devices. This document is part 2 of GB/T 8446 "Heat sinks for power semiconductor devices". GB/T 8446 has released the following parts. --- Part 1.Heat sink; --- Part 2.Measurement methods of thermal resistance and flow resistance; --- Part 3.Insulation and fasteners. This document replaces GB/T 8446.2-2004 "Heat sinks for power semiconductor devices - Part 2.Test methods for thermal resistance and flow resistance". Compared with GB/T 8446.2-2004, in addition to structural adjustment and editorial changes, the main technical changes are as follows. a) Two chapters "normative references" and "terms and definitions" have been added (see Chapters 2 and 3); b) The provisions on thermal resistance measurement have been changed and used as Chapter 4 (see Chapter 4, Chapters 2 to 5 of the.2004 edition); c) Changed the provisions of the flow resistance measurement, and as Chapter 5 (see Chapter 5, 3.2, 3.4 and Chapter 5 of the.2004 edition). Please note that some content of this document may be patented. The issuing agency of this document assumes no responsibility for identifying patents. This document is proposed by China Electrical Equipment Industry Association. This document is under the jurisdiction of the National Standardization Technical Committee for Power Electronic Systems and Equipment (SAC/TC60). This document is drafted by. Xiangbo Heat Transfer Technology Co., Ltd., Guangzhou Gaolan Energy Saving Technology Co., Ltd., Global Energy Internet Research Institute Co., Ltd., Xi'an Perry Power Semiconductor Converter Technology Co., Ltd., Jiangsu Xincaiyang Electromechanical Technology Co., Ltd., Hebei Hua Entire Industry Co., Ltd., CRRC Zhuzhou Electric Locomotive Research Institute Co., Ltd., Jiangsu Hongwei Technology Co., Ltd., Jiangsu Haiding Electric Technology Co., Ltd., Hubei Taiji Semiconductor Co., Ltd., Xi'an Institute of Power Electronics Technology. The main drafters of this document. Cui Pengfei, Zeng Maojin, Zhou Jianhui, Wen Yuliang, Wei Hongqi, Sang Chun, Song Xiaofei, Tian En, Wang Xiaobao, Tao Yong, Yan Jiasheng, Li Xiaoguo, Guan Shengli, Guo Shaoqiang, Yu Wangchun, Ji Weifeng, Lu Zhengbai, Yun Qianglong. The previous versions of this document and its superseded documents are as follows. --- First published in 1987 as GB/T 8446.2, first revised in.2004; ---This is the second revision.IntroductionGB/T 8446 "Heat radiator for power semiconductor devices" gives the radiator, insulating parts and fasteners that constitute the heat sink for power semiconductor devices Technical requirements for firmware, inspection rules, requirements for marking, packaging, transportation and storage, and measurement methods for thermal resistance and flow resistance of heat sinks are to be determined by 3 part composition. --- Part 1.Heat sink. The purpose is to specify the terms, definitions, and techniques of heat sinks constituting heat sinks for power semiconductor devices. requirements, inspection rules and requirements for marking, packaging, transport and storage. --- Part 2.Thermal and flow resistance measurement methods. The purpose is to standardize heat sinks (including heat sinks) that constitute heat sinks for power semiconductor devices Methods for the measurement of thermal and flow resistance of cast, extruded, profiled and heat pipe radiators). --- Part 3.Insulation and fasteners. The purpose is to specify insulating members and fasteners constituting heat sinks for power semiconductor devices technical requirements, inspection rules and requirements for marking, packaging, transportation and storage. Heat sinks for power semiconductor devices Part 2.Thermal and flow resistance measurement methods1 ScopeThis document gives the terms and definitions and measurement methods of thermal resistance and flow resistance of heat sinks for power semiconductor devices. This document applies to the measurement of thermal and flow resistance of heat sinks (including cast, extruded, profiled and heat pipe heat sinks) for power semiconductor devices.2 Normative referencesThe contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to this document. GB/T 8446.1-2022 Heat sinks for power semiconductor devices - Part 1.Heat sinks3 Terms and DefinitionsTerms and definitions defined in GB/T 8446.1-2022 apply to this document. 3.1 Rsa Under thermal equilibrium conditions, the temperature difference between the surface temperature of the heat sink and the temperature of a specified point in the cooling medium and the consumption of the temperature difference Ratio of power dissipation (heat flow). NOTE. The unit of thermal resistance is degrees Celsius per watt (°C/W) or Kelvin per watt (K/W). [Source. GB/T 8446.1-2022, 3.7] 3.2 pressure drop (of a heat sink) Δp Under steady-state conditions, the total pressure of the cooling medium at a specified point on the upstream side and a specified point on the downstream side of the radiator in a specified air duct or water path poor. Note 1.Flow resistance is also called wind resistance in air duct system and water resistance in waterway system. Note 2.The unit of flow resistance is Pa (Pa). Note 3.The side of the radiator in the air duct or waterway that faces the flow of the cooling medium is the upstream side, and the opposite side is the downstream side. Note 4.The total pressure is the algebraic sum of static pressure and dynamic pressure. [Source. GB/T 8446.1-2022, 3.8] 3.3 Cooling medium A liquid (eg, water) or gas (eg, air) that removes heat generated by a semiconductor device. [Source. GB/T 3859.1-2013, 3.8.1, with modifications] ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 8446.2-2022_English be delivered?Answer: Upon your order, we will start to translate GB/T 8446.2-2022_English as soon as possible, and keep you informed of the progress. The lead time is typically 2 ~ 4 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 8446.2-2022_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 8446.2-2022_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.Question 3: Does the price include tax/VAT?Answer: Yes. 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