GB/T 4937.30-2018 English PDF

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GB/T 4937.30-2018: Semiconductor devices -- Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 4937.30-2018	184	Add to Cart	3 days	Semiconductor devices -- Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing	Valid

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Basic data

Standard ID: GB/T 4937.30-2018 (GB/T4937.30-2018)
Description (Translated English): Semiconductor devices -- Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L40
Classification of International Standard: 31.080.01
Word Count Estimation: 10,192
Date of Issue: 2018-09-17
Date of Implementation: 2019-01-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 4937.30-2018: Semiconductor devices -- Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
(Semiconductors - Mechanical and climatic test methods - Part 30. Pre-s) ICS 31.080.01 L40 National Standards of People's Republic of China Semiconductor device mechanical and climatic test methods Part 30. Unsealed surface mount devices at Pretreatment before reliability test Part 30. Preconditioningofnon-hermeticsurfacemountdevicespriorto (IEC 60749-30.2011, IDT) Published on.2018-09-17 2019-01-01 implementation State market supervision and administration China National Standardization Administration issued

Foreword

GB/T 4937 "Mechanical and Climatic Test Methods for Semiconductor Devices" consists of the following components. --- Part 1. General; --- Part 2. Low pressure; --- Part 3. External visual inspection; --- Part 4. Strongly accelerated steady-state damp heat test (HAST); ---Part 5. Steady-state temperature and humidity bias life test; ---Part 6. High temperature storage; --- Part 7. Internal water vapor content test and other residual gas analysis; --- Part 8. Sealing; ---Part 9. Logo durability; --- Part 10. Mechanical shock; --- Part 11. rapid temperature change double tank method; --- Part 12. Sweeping vibration; --- Part 13. Salt spray; --- Part 14. Terminal strength (lead robustness); ---Part 15. Resistance to soldering of through-hole mounting devices; --- Part 16. Particle collision noise detection (PIND); ---Part 17. Neutron irradiation; ---Part 18. Ionizing radiation (total dose); ---Part 19. Chip shear strength; --- Part 20. The combined effects of moisture-resistant and soldering heat on plastic surface mount devices; ---Part 20-1. Operation, packaging, marking and transport of surface mount devices sensitive to the combined effects of moisture and soldering heat; ---Part 21. Solderability; ---Part 22. Bonding strength; --- Part 23. High temperature working life; --- Part 24. Accelerated moisture-resistant and non-biased strong accelerated stress test (HSAT); ---Part 25. Temperature cycling; --- Part 26. Electrostatic discharge (ESD) sensitivity test human body model (HBM); --- Part 27. Electrostatic discharge (ESD) sensitivity test mechanical model (MM); --- Part 28. Electrostatic discharge (ESD) sensitivity test, charged device model (CDM), device level; ---Part 29. Latch test; --- Part 30. Pre-treatment of unsealed surface mount devices prior to reliability testing; --- Part 31. Flammability of plastic encapsulated devices (internal); --- Part 32. Flammability of plastic encapsulated devices (external); ---Part 33. Accelerated moisture resistance without bias high pressure cooking; --- Part 34. Power cycling; --- Part 35. Acoustic scanning microscopy of plastic electronic components; ---Part 36. Constant acceleration; --- Part 37. Plate-level drop test method using accelerometers; --- Part 38. Soft error test methods for semiconductor memory devices; --- Part 39. Measurement of moisture diffusivity and water dissolution rate of raw materials for semiconductor components; --- Part 40. Plate-level drop test method using tension meter; --- Part 41. Reliability test methods for non-volatile memory devices; --- Part 42. Storage of temperature and humidity; --- Part 43. Guide to the reliability identification scheme for integrated circuits (ICs); --- Part 44. Test method for neutron beam irradiation single particle effect of semiconductor devices. This part is the 30th part of GB/T 4937. This part is drafted in accordance with the rules given in GB/T 1.1-2009. This section uses the translation method equivalent to IEC 60749-30.2011 "Semiconductor device mechanical and climatic test methods Part 30. Pre-treatment of unsealed surface mount devices prior to reliability testing. The documents of our country that have a consistent correspondence with the international documents referenced in this part are as follows. Semiconductors - Mechanical and climatic test methods - Part 4. Strongly accelerated steady-state damp heat test (IEC 60749-4.2002, IDT). Please note that some of the contents of this document may involve patents. The issuing organization of this document is not responsible for identifying these patents. This part was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This section drafted by. China Electronics Technology Group Corporation, the thirteenth research institute, Shenzhen Institute of Standard Technology. The main drafters of this section. Selection, Peng Hao, Gao Ruixin, Gao Jinhuan, Liu Wei. Semiconductor device mechanical and climatic test methods Part 30. Unsealed surface mount devices at Pretreatment before reliability test

1 Scope

This part of GB/T 4937 specifies the standard procedures for the pre-treatment of non-sealed surface mount devices (SMDs) prior to reliability testing. This section specifies the pre-processing of SMDs. SMDs are required to perform appropriate procedures in accordance with the procedures specified in this section before performing the specified indoor reliability test (identification/reliability monitoring). Pretreatment to evaluate the long-term reliability of the device (affected by weld stress). Note. GB/T 4937.20 and the moisture-induced stress sensitivity conditions [or moisture sensitivity level (MSL)] in this section and the actual reflow conditions The relationship between them depends on the temperature measurement of the semiconductor device manufacturer. Therefore, it is recommended to monitor the moisture sensitivity of the highest temperature in real time during the assembly process. The temperature of the top surface of the SMD package ensures that its temperature does not exceed the component evaluation temperature.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article. Pieces. For undated references, the latest edition (including all amendments) applies to this document. GB/T 4937.20-2018 Methods of mechanical and climatic testing of semiconductor devices - Part 20 Combined effects of wet and welding heat (IEC 60749-20.2008, IDT) Semiconductors - Mechanical and climatic test methods - Part 4. Strong accelerated steady-state damp heat test (HAST) [Semiconductordevices-Mechanicalandclimatictestmethods-Part 4.Dampheat,steadystate, Highlyacceleratedstresstest(HAST)] Methods of mechanical and climatic test methods for semiconductor devices - Part 5. Steady temperature and humidity bias life test (Semi- conductordevices-Mechanicalandclimatictestmethods-Part 5.Steady-statetemperaturehumidity Biaslifetest) Methods of mechanical and climatic test methods for semiconductor devices - Part 11. s. conductordevices-Mechanicalandclimatictestmethods-Part 11.Rapidchangeoftemperature- Two-fluid-bathmethod) Methods of mechanical and climatic test methods for semiconductor devices - Part 24. Accelerated Test (Semiconductordevices-Mechanicalandclimatictestmethods-Part 24.Acceleratedmethisturere- sistance-UnbiasedHAST) Semiconductors - Mechanical and climatic test methods - Part 25. Temperature cycling (Semiconductor devices-Mechanicalandclimatictestmethods-Part 25.Temperaturecycling) IEC 60749-33. Mechanical and climatic test methods for semiconductor devices - Part 33 (Semiconductordevices-Mechanicalandclimatictestmethods-Part 33.Acceleratedmoistureresist- ance-Unbiasedautoclave)

3 General

The welding heat test will increase the pressure of moisture in the SMDs (the SMDs are absorbed during storage), which will cause the SMDs plastic package to break. ......

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