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GB/T 4937.21-2018 English PDF

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GB/T 4937.21-2018: Semiconductor devices -- Mechanical and climatic test methods -- Part 21: Solderability
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Basic data

Standard ID: GB/T 4937.21-2018 (GB/T4937.21-2018)
Description (Translated English): Semiconductor devices -- Mechanical and climatic test methods -- Part 21: Solderability
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L40
Classification of International Standard: 31.080.01
Word Count Estimation: 18,139
Date of Issue: 2018-09-17
Date of Implementation: 2019-01-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 4937.21-2018: Semiconductor devices -- Mechanical and climatic test methods -- Part 21: Solderability


---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Semiconductor devices - Mechanical and climatic test methods - Part 21. Solderability ICS 31.080.01 L40 National Standards of People's Republic of China Semiconductor device mechanical and climatic test methods Part 21. Solderability Part 21. Solderability (IEC 60749-21.2011, IDT) Published on.2018-09-17 2019-01-01 implementation State market supervision and administration China National Standardization Administration issued

Content

Foreword III 1 Scope 1 2 Normative references 1 3 test device 1 3.1 Solder tank 1 3.2 Infiltration device 1 3.3 Optical equipment 1 3.4 Water vapor aging equipment 1 3.5 Lighting equipment 2 3.6 Material 2 3.6.1 Flux 2 3.6.2 Solder 2 3.7 SMD reflow soldering equipment 3 3.7.1 Template or mask 3 3.7.2 Rubber roller or metal scraper 3 3.7.3 Test substrate 3 3.7.4 Solder Paste 3 3.7.5 Reflow device 4 3.7.6 Flux cleaning solvent 4 4 Procedure 4 4.1 Backward compatibility 4 4.2 Pretreatment 4 4.2.1 General requirements 4 4.2.2 Water vapor aging pretreatment 4 4.2.3 High temperature storage pretreatment 5 4.3 Immersion and observation of weldability test procedure 5 4.3.1 General requirements 5 4.3.2 Dip soldering conditions 5 4.3.3 Procedure 6 4.4 Simulated board level installation SMDs reflow solderability test procedure 11 4.4.1 General requirements 11 4.4.2 Test equipment setup 11 4.4.3 Sample preparation and surface conditions 13 4.4.4 Visual inspection 13 5 Description 13 Figure 1 Wing package inspection area 8 Figure 2 J-lead package inspection area 9 Figure 3 Inspection area of rectangular components (surface mount device) 10 Figure 4. Small outline integrated circuit package (SOIC) and quad flat package (QFP) inspection area (surface mount device) 11 Figure 5 Flat peak peak reflow curve Figure 12 Table 1 Water vapor aging conditions 4 Table 2 Correspondence between altitude and water vapor temperature 5 Table 3 Dip solder test conditions 5 Table 4 Maximum content of impurities in the soldering tank 7

Foreword

GB/T 4937 "Mechanical and Climatic Test Methods for Semiconductor Devices" consists of the following components. --- Part 1. General; --- Part 2. Low pressure; --- Part 3. External visual inspection; --- Part 4. Strongly accelerated steady-state damp heat test (HAST); ---Part 5. Steady-state temperature and humidity bias life test; ---Part 6. High temperature storage; --- Part 7. Internal water vapor content test and other residual gas analysis; --- Part 8. Sealing; ---Part 9. Logo durability; --- Part 10. Mechanical shock; --- Part 11. rapid temperature change double tank method; --- Part 12. Sweeping vibration; --- Part 13. Salt spray; --- Part 14. Terminal strength (lead robustness); ---Part 15. Resistance to soldering of through-hole mounting devices; --- Part 16. Particle collision noise detection (PIND); ---Part 17. Neutron irradiation; ---Part 18. Ionizing radiation (total dose); ---Part 19. Chip shear strength; --- Part 20. The combined effects of moisture-resistant and soldering heat on plastic surface mount devices; ---Part 20-1. Operation, packaging, marking and transport of surface mount devices sensitive to the combined effects of moisture and soldering heat; ---Part 21. Solderability; ---Part 22. Bonding strength; --- Part 23. High temperature working life; --- Part 24. Accelerated moisture-resistant and non-biased strong accelerated stress test (HSAT); ---Part 25. Temperature cycling; --- Part 26. Electrostatic discharge (ESD) sensitivity test human body model (HBM); --- Part 27. Electrostatic discharge (ESD) sensitivity test mechanical model (MM); --- Part 28. Electrostatic discharge (ESD) sensitivity test, charged device model (CDM), device level; ---Part 29. Latch test; --- Part 30. Pre-treatment of unsealed surface mount devices prior to reliability testing; --- Part 31. Flammability of plastic encapsulated devices (internal); --- Part 32. Flammability of plastic encapsulated devices (external); ---Part 33. Accelerated moisture resistance without bias high pressure cooking; --- Part 34. Power cycling; --- Part 35. Acoustic scanning microscopy of plastic electronic components; ---Part 36. Constant acceleration; --- Part 37. Plate-level drop test method using accelerometers; --- Part 38. Soft error test methods for semiconductor memory devices; --- Part 39. Measurement of moisture diffusivity and water dissolution rate of raw materials for semiconductor components; --- Part 40. Plate-level drop test method using tension meter; --- Part 41. Reliability test methods for non-volatile memory devices; --- Part 42. Storage of temperature and humidity; --- Part 43. Guide to the reliability identification scheme for integrated circuits (ICs); --- Part 44. Test method for neutron beam irradiation single particle effect of semiconductor devices. This part is the 21st part of GB/T 4937. This part is drafted in accordance with the rules given in GB/T 1.1-2009. This section uses the translation method equivalent to IEC 60749-21.2011 "Semiconductor device mechanical and climatic test methods Part 21. Solderability. Please note that some of the contents of this document may involve patents. The issuing organization of this document is not responsible for identifying these patents. This part was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This section drafted by. China Electronics Technology Group Corporation, the thirteenth research institute, Shenzhen Institute of Standard Technology. The main drafters of this section. Song Yuxi, Peng Hao, Gao Ruixin, Zhuo Xuan, Zhu Zhengang. Semiconductor device mechanical and climatic test methods Part 21. Solderability

1 Scope

This part of GB/T 4937 specifies the solderability test of the lead-out of the component package soldered with lead-tin solder or lead-free solder. Test procedures. This test method specifies the "immersion and observation" solderability test procedures for through-hole, axial and surface mount devices (SMDs), and optional The SMDs board-level solderability test program is used to simulate the soldering process used in the use of components. This test method also specifies Aging condition, which is optional. This test is a destructive test except as otherwise provided in the relevant documents. Note 1. This test method is basically the same as GB/T 2423, but due to the special requirements of semiconductor components, this test method is adopted. Note 2. This test method does not evaluate the thermal stress effects that may occur during the welding process. See IEC 60749-15 or IEC 60749-20.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article. Pieces. For undated references, the latest edition (including all amendments) applies to this document. IEC 61190-1-2.2007 Connecting materials for electronic components - Part 1-2. Requirements for solders for high quality interconnections of electronic components (At- Tachmentmaterialsforelectronicassembly-Part 1-2.Requirementsforsolderingpastesforhigh-qual- Iityinterconnectsinelectronicsassembly) IEC 61190-1-3.2007 Connecting materials for electronic components - Part 1-3. Electron soldering alloys and solders Solder-free solid solder requirements (Attachmentmaterialsforelectronicassembly-Part 1-3.Requirementsfor Electronicgradesolderaloysandfluxedandnon-fluxedsolidsoldersforelectronicsolderingapplica- Tions)

3 test device

3.1 solder bath The solder bath depth should be no less than 40mm, the capacity should be no less than 300mL, and can accommodate at least 1kg of solder. The device should be able to warm the solder The degree is kept within ±5 °C of the specified temperature value. 3.2 Infiltration device A mechanical wetting device should be used which controls the rate at which the lead is immersed and raised in the solder bath, as well as the residence time in the bath. (Total time to stay at the specified infiltration depth). 3.3 Optical equipment An optical microscope that provides a magnification of 10 to 20 times should be used. 3.4 Water vapor aging equipment A container that is large enough to hold the sample, corrosion resistant, and capped should be used. The sample should be placed at a position that is at least 40 mm above the water surface at the bottom Set. The sample should be placed in a suitable support mode, and the support sample should be made of materials free of impurities. Note. During the aging process of water vapor, the aging device is installed in a suitable manner to prevent water (water vapor condensate) from dripping onto the surface of the sample. 3.5 Lighting equipment The luminaire should be capable of providing uniform, flash-free, full-scatter illumination to the sample. 3.6 Materials 3.6.1 Flux Unless otherwise specified in the relevant documentation, the flux shall be a standard reactive rosin flux (ROL1 flux conforms to IEC 61190-1-3. The flux type and designation of Table 2 in.2007 shall include rosin with a mass fraction of (25 ± 5)% and diethylamine of (0.15 ± 0.01)%. Hydrochloride and (74.85 ± 0.5)% 2-propanol (isopropanol). At (25 ± 2) ° C, the relative density of the standard active rosin flux should be 0.843 ± 0.005. The regulations are as follows. a) Rosin. 1) Color. standard rosin or grayish white; 2) Acid value (KOH content per gram of rosin, in mg). 155 (minimum); 3) Softening point (ring and ball method). 70 ° C (minimum value); 4) Flow point (Ebrod). 76 ° C (minimum); 5) Ash. 0.05% (maximum); 6) Solubility. Dissolve the rosin in an equal amount of isopropanol, the solution should be clear, and there should be no sediment after standing at room temperature for one week. appear. b) 2-propanol (isopropanol). 1) Purity. 2-propanol (isopropyl alcohol) at a mass ratio of at least 99.5%; 2) Acidity (calculated as acetic acid). up to 0.002% by mass ratio (excluding carbon dioxide); 3) Non-volatile ingredients. up to 2 mg per 100 mL. 3.6.2 Solder 3.6.2.1 Lead Tin Solder Unless otherwise specified in the relevant documents, the requirements for lead-tin solder are as follows. a) Chemical composition. The solder should not contain impurities such as aluminum, zinc or cadmium which may affect the performance of the solder. The mass fraction of each component is as follows. 1) Tin. 59%~61%; 2) 锑. maximum value of 0.5%; 3) Copper. 0.1% maximum; 4) Arsenic. a maximum of 0.05%; 5) Iron. maximum 0.02%; 6) Lead. the remaining part. b) Melting temperature range. The melting temperature of the solder with a tin content of 60% is as follows. 1) Completely solid. 183 ° C; 2) Complete liquid. 185 °C. 3.6.2.2 Lead-free solder Except as otherwise provided in the relevant documents, the mass fractions of the various components of lead-free solder are as follows. a) tin. 95%~96.5%; b) Silver. 3%~4%; c) Copper. 0.5% to 1%. 3.7 SMD reflow soldering equipment 3.7.1 Template or mask The stencil or reticle has a geometric opening suitable for the test lead. In addition to the agreement between the supplier and the user, when the component leads When the distance is less than 0.5mm, the nominal thickness of the template should be 0.1mm; when the component lead pitch is between 0.5mm~0.65mm, the mode The nominal thickness of the board shall be 0.15 mm; when the component lead pitch is greater than 0.65 mm, the nominal thickness of the stencil shall be 0.2 mm. 3.7.2 Rubber roller or metal scraper Solder paste should be applied to the stencil or mask, metal scraper for narrow pitch samples, and rubber for standard pitch samples roller. 3.7.3 Test substrate The SMD samples used to simulate the board-level reflow test should be evaluated for the substrate used. Note 1. Ceramic substrates (alumina 90%~98%) can be used in all reflow tests. Note 2. The glass epoxy substrate can be used for all reflow tests. The glass epoxy substrate needs to be able to withstand the soldering temperature (eg, the substrate is not suitable for the hot plate) welding). Note 3. In order to visually inspect the lead end of the test sample, the test substrate needs to be metal-free (no pad). 3.7.4 Solder paste Unless otherwise specified in the relevant documents, the composition of the solder paste shall comply with the provisions of 3.7.4.1 and 3.7.4.2. 3.7.4.1 Lead-containing solder paste The solder composition shall comply with the provisions of 3.6.2. Unless otherwise specified in the relevant documents, the particle size of the solder powder should be between 20μm and 45μm. The composition of the flux shall comply with the provisions of 3.6.1. The viscosity range and measurement method of solder paste should be specified in the relevant documents. 3.7.4.2 Lead-free solder paste The solder composition shall comply with the provisions of 3.6.2. The solder powder size shall comply with the provisions of 4 of Table 2 of IEC 61190-1-2.2007, namely. ---The particles are not more than 40μm; --- particles larger than 38 μm less than 1%; - at least 90% of the particles between -20μm and 38μm; --- Particles smaller than 22 μm are less than 10%. The shape of the solder powder should be spherical. The flux used should be a polymerized rosin with a mass fraction of 30% (softening point temperature approx. 95 ° C), 30% diacid-modified rosin (softening point temperature about 140 ° C), 34.7% diethylene glycol monobutyl ether, 0.9% 1,3-diphenyl 胍-HBr, 0.5% oxalic acid (chlorine content less than 0.1%) and 4% hardened castor oil. The solder paste used should consist of a solder powder with a mass fraction of 88% and a flux of 12%. Viscosity range should be (180 ± 5) Pa·s. Note. The storage and storage period of the solder paste (floor life) must comply with the requirements of the contractor. 3.7.5 Reflow device A convection reflow oven (preferred) or an infrared reflow oven should be able to achieve a reflow temperature profile of the solder paste used. 3.7.6 Flux cleaning solvent Cleaning solvents for cleaning leads and lead-out fluxes should remove visible flux residues and meet local environmental requirements.

4 procedures

4.1 Backward compatibility Generally, lead-containing terminals are evaluated using lead-tin solder solderability test conditions, while lead-free leads are lead-free solder solderability test strips. Pieces. If the lead-free terminal is used in lead-tin soldering (backward compatibility), it should be evaluated using standard lead-tin SMT reflow test conditions. The backward compatibility test does not apply to lead-free BGA packages. 4.2 Pretreatment 4.2.1 General requirements Pretreatment, also known as accelerated aging, can be selected as needed before solderability testing. 4.2.2 Water vapor aging pretreatment 4.2.2.1 Water vapor aging pretreatment conditions The pretreatment conditions for water vapor aging are shown in Table 1. Table 1 Water vapor aging conditions condition Exposure time A 1±0.5 B 4±0.5 C 8±0.5 D 16±0.5 Note 1. Only one interruption is allowed during the aging process, and the time must not exceed 10 minutes. Note 2. Precautionary measures. The aging device should be properly installed to avoid condensation on the surface of the sample after condensation. Note 3. Water vapor aging condition B is required unless otherwise specified in the relevant documents. Note 4. Pretreatment in a humid environment is to verify the effect of moisture and soldering heat on surface mount semiconductor package devices, not the solderability test standard. portion. See GB/T 4937.20. Note 5. Water vapor aging pretreatment condition A is applied to the surface of the lead end to complete the nickel-plated palladium and nickel-palladium-gold samples. 4.2.2.2 Water vapor aging procedure Prior to soldering, the sample should be subjected to moisture aging and the surface of the sample exposed to a water vapor aging device as specified in 3.4. Sample should be suspended Place to ensure that all parts are boiling above distilled water or deionized water surface at least 40mm, the time of exposure in water vapor meets the rules Set requirements. The temperature of the water vapor on the lead plane of the component shall comply with the requirements of Table 2. When the water vapor aging is over, the sample should be removed from the water vapor aging equipment. Table 2 Correspondence between altitude and water vapor temperature Altitude Water vapor temperature 0~600 93 3-5 601~1250 91 3-5 1251~1850 89 3-5 >1850 87 3-5 4.2.2.3 System cleaning The water vapor aging equipment should be drained and cleaned at least monthly (or before use). Depending on the resistivity, appearance or cleanliness of the water, Increase the cleaning frequency. Use a non-polluting solvent when cleaning. 4.2.2.4 Drying and storage procedures When the test sample is removed from the water vapor aging equipment, the sample can be dried according to one of the following procedures. a) in a dry environment (dry nitrogen is recommended), baking up to 1 h at 100 ° C; b) Dry in air at room temperature for at least 15 min. Note. If the solderability test is not performed within 2 hours after the sample is taken out of the aging equipment, it should be stored in a dry jar or dry nitrogen tank before the test. Medium, and the longest does not exceed 72h. If this storage requirement is exceeded, the sample will not be used for testing. 4.2.3 High temperature storage pretreatment The sample can be replaced by water vapor aging by high temperature storage under the condition of (150±5) °C for 4h~16h. 4.3 Immersion and observation of weldability test procedures 4.3.1 General requirements The test shall be carried out in accordance with the number of outlets specified in the relevant specifications. During the operation, care should be taken to protect the test surface from friction, Grease or sweat, etc. cause scratching or contamination. Solderability testing should be carried out in fume hoods that comply with safety regulations and regulations. 4.3.2 Dip soldering conditions Solderability dip solder test conditions are shown in Table 3. Table 3 Dip solder test conditions Conditional solder type Solder temperature Residence time A (lead tin, surface mount device only) lead tin solder 215 ± 5 5 ± 0.5 B (lead tin, surface mount device and via device) lead tin solder 235±5 5±0.5 C (lead-free, surface mount devices and through-hole devices) lead-free solder 245±5 5±0.5 D (lead-free, backward compatibility) lead-tin solder 215±5 5±0.5 4.3.3 Procedure 4.3.3.1 General requirements The test procedure includes the following steps. --- Appropriate pre-processing of the terminals, if applicable; ---Water vapor aging or high temperature storage of the sample, if applicable; --- Use flux to immerse the terminal into the molten solder; --- Check and evaluate the test site at the lead end. 4.3.3.2 Lead-out preprocessing The extraction end should not be wiped, cleaned, scraped or rubbed before the test. Any special treatment of the outlet, such as the bend before the test Music or reshaping, etc., should be specified in the relevant documents. If it is necessary to remove the insulation of the str......
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