GB/T 4937.201-2018 English PDFUS$599.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 4937.201-2018: Semiconductor devices -- Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Status: Valid
Basic dataStandard ID: GB/T 4937.201-2018 (GB/T4937.201-2018)Description (Translated English): Semiconductor devices -- Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L40 Classification of International Standard: 31.080.01 Word Count Estimation: 30,379 Date of Issue: 2018-09-17 Date of Implementation: 2019-01-01 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GB/T 4937.201-2018: Semiconductor devices -- Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order. Semiconductor devices - Mechanical and climatic test methods - Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat ICS 31.080.01 L40 National Standards of People's Republic of China Semiconductor device mechanical and climatic test methods Part 20-1. Synthesis of moisture and welding heat Affect the operation of sensitive surface mount devices, Packaging, signage and transportation Part 20-1. Handling, packing, labeling and shippingpingofsurface-mountdevices (IEC 60749-20-1..2009, IDT) 2018-09-17 released.2019-01-01 implementation State market supervision and administration China National Standardization Administration issued ContentForeword III Introduction V 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 General Principles of Applicability and Reliability 3 4.1 Assembly Process 3 4.1.1 Batch reflow soldering 3 4.1.2 Local heating 3 4.1.3 Cartridge components 3 4.1.4 Point-to-point welding 3 4.2 Reliability 3 5 dry packaging 3 5.1 Requirements 3 5.2 Drying of SMDs and carrier materials before sealing to moisture barriers 4 5.2.1 Drying requirements for grade A2 4 5.2.2 Drying requirements of B2a~B5a grade 4 5.2.3 Drying requirements for carrier materials 4 5.2.4 Other drying requirements 4 5.2.5 Timeout between baking and sealing 4 5.3 Dry packaging 4 5.3.1 Overview 4 5.3.2 Material 5 5.3.3 Label 7 5.3.4 Lifetime in the package 7 6 drying 7 6.1 Drying condition option 7 6.2 After the factory environment is exposed 9 6.2.1 Workshop Life Time 9 6.2.2 Continuous exposure for any length of time 9 6.2.3 Short-term exposure 9 6.3 General Principles of Baking 10 6.3.1 High temperature carrier 10 6.3.2 Low temperature carrier 10 6.3.3 Paper and plastic containers 10 6.3.4 Baking time 10 6.3.5 ESD protection 10 6.3.6 Reuse of carriers 10 6.3.7 Solderability Limit 10 7 use 11 7.1 Workshop Life Time Start Point 11 7.2 Packaging bags entering the factory inspection 11 7.2.1 Receiving 11 7.2.2 Component Inspection 11 7.3 Workshop life 11 7.4 Safe storage 11 7.4.1 Safe storage category 11 7.4.2 Dry packaging 12 7.4.3 Drying cabinet 12 7.5 reflow soldering 12 7.5.1 reflow welding category 12 7.5.2 Unsealed moisture-proof bag 12 7.5.3 Reflow soldering temperature extreme value 12 7.5.4 Additional heat distribution parameters 12 7.5.5 Multiple reflows 13 7.5.6 Maximum reflow times 13 7.6 Drying indicator 13 7.6.1 Drying requirements 13 7.6.2 Humidity overrun in dry package 13 7.6.3 Workshop life or ambient temperature (humidity) overrun 13 7.6.4 B6 grade SMDs 13 Appendix A (Normative) Symbols and Labels for Moisture Sensitive Devices 14 A.1 Purpose 14 A.2 Symbols and Labels 14 A.2.1 Moisture Sensitive Symbols 14 A.2.2 Moisture Sensitive Identification (MSID) Tag 14 A.2.3 Moisture Sensitive Warning Label 14 Appendix B (informative) Circuit board rework 18 B.1 Desoldering, rework and reinstallation of components 18 B.1.1 Desoldering pretreatment 18 B.1.2 Desoldering of components for failure analysis 18 B.1.3 Desoldering and reinstallation 18 B.2 Baking the board of assembled components 18 Appendix C (informative) Degradation caused by factory environmental conditions 19 Reference 23ForewordGB/T 4937 "Mechanical and Climatic Test Methods for Semiconductor Devices" consists of the following components. --- Part 1. General; --- Part 2. Low pressure; --- Part 3. External visual inspection; --- Part 4. Strongly accelerated steady-state damp heat test (HAST); ---Part 5. Steady-state temperature and humidity bias life test; ---Part 6. High temperature storage; --- Part 7. Internal water vapor content test and other residual gas analysis; --- Part 8. Sealing; ---Part 9. Logo durability; --- Part 10. Mechanical shock; --- Part 11. rapid temperature change double tank method; --- Part 12. Sweeping vibration; --- Part 13. Salt spray; --- Part 14. Terminal strength (lead robustness); ---Part 15. Resistance to soldering of through-hole mounting devices; --- Part 16. Particle collision noise detection (PIND); ---Part 17. Neutron irradiation; ---Part 18. Ionizing radiation (total dose); ---Part 19. Chip shear strength; --- Part 20. The combined effects of moisture-resistant and soldering heat on plastic surface mount devices; ---Part 20-1. Operation, packaging, marking and transport of surface mount devices sensitive to the combined effects of moisture and soldering heat; ---Part 21. Solderability; ---Part 22. Bonding strength; --- Part 23. High temperature working life; --- Part 24. Accelerated moisture-resistant and non-biased strong accelerated stress test (HSAT); ---Part 25. Temperature cycling; --- Part 26. Electrostatic discharge (ESD) sensitivity test human body model (HBM); --- Part 27. Electrostatic discharge (ESD) sensitivity test mechanical model (MM); --- Part 28. Electrostatic discharge (ESD) sensitivity test, charged device model (CDM), device level; ---Part 29. Latch test; --- Part 30. Pre-treatment of unsealed surface mount devices prior to reliability testing; --- Part 31. Flammability of plastic encapsulated devices (internal); --- Part 32. Flammability of plastic encapsulated devices (external); ---Part 33. Accelerated moisture resistance without bias high pressure cooking; --- Part 34. Power cycling; --- Part 35. Acoustic scanning microscopy of plastic electronic components; ---Part 36. Constant acceleration; --- Part 37. Plate-level drop test method using accelerometers; --- Part 38. Soft error test methods for semiconductor memory devices; --- Part 39. Measurement of moisture diffusivity and water dissolution rate of raw materials for semiconductor components; --- Part 40. Plate-level drop test method using tension meter; --- Part 41. Reliability test methods for non-volatile memory devices; --- Part 42. Storage of temperature and humidity; --- Part 43. Guide to the reliability identification scheme for integrated circuits (ICs); --- Part 44. Test method for neutron beam irradiation single particle effect of semiconductor devices. This part is part 20-1 of GB/T 4937. This part is drafted in accordance with the rules given in GB/T 1.1-2009. This section uses the translation method equivalent to IEC 60749-20-1.2009 "Semiconductor Device Machinery and Climate Test Method No. 20-1 Part. Operation, packaging, marking and transportation of surface mount devices that are sensitive to the combined effects of moisture and soldering heat. The documents of our country that have a consistent correspondence with the international documents referenced in this part are as follows. GB/T 4937.20-2018 Methods of mechanical and climatic testing of semiconductor devices - Part 20 Resistance to moisture and welding heat (IEC 60749-20.2008, IDT) GB/T 4937.30-2018 Methods of mechanical and climatic testing of semiconductor devices - Part 30. Non-sealing surface mounters Pre-treatment before reliability test (IEC 60749-30.2011, IDT) For ease of use, this section has made the following editorial changes. --- Table 2 (a) and Table 2 (b) are combined into Table 2, and the titles of the two sub-tables are separately incorporated into the table; --- The second last row of Table 2, the "2~6" in the second column is corrected to "B2~B6". Please note that some of the contents of this document may involve patents. The issuing organization of this document is not responsible for identifying these patents. This part was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This part is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This section was drafted. The 13th Research Institute of China Electronics Technology Group Corporation, Shenzhen Standard Technology Research Institute, Guangdong Inspection and Quarantine Technology Center of surgery. The main drafters of this section. Liu Wei, Peng Hao, Gao Ruixin, Wang Yingcheng, Yan Xuan, Song Yuxi, Gao Jinhuan.IntroductionAfter the appearance of surface mount devices (SMDs), the reflow process may cause damage to the package, causing "cracks and delamination". This brings new quality and reliability issues. In order to avoid failure related to wet and reflow soldering, this section is operated and packaged. And transportation requirements describe the standard grades of shop life exposed to wet and reflow-sensitive SMDs. GB/T 4937.20 The classification procedure is specified and the labeling requirements are specified in Appendix A of this section. The atmosphere's moisture is diffused into the permeable encapsulant and the SMDs are soldered to the printed circuit board (PCBs) assembly process. In the process, the entire package needs to be exposed to a reflow high temperature higher than.200 ° C, in the rapid expansion of moisture, material mismatch, material interface degradation Under the action, it can cause cracks in the package and/or delamination of key interfaces inside the package. The reflow process involved in this section includes convection, convection/infrared (IR), infrared, gas phase (VPR) and hot air rework. For most SMDs, it is not recommended to use the assembly method of immersing the components in the molten solder as a whole. Semiconductor device mechanical and climatic test methods Part 20-1. Synthesis of moisture and welding heat Affect the operation of sensitive surface mount devices, Packaging, signage and transportation1 ScopeThis part of GB/T 4937 applies to all non-hermetic surface mounters that are reflow soldered and exposed to the atmosphere. Piece (SMD). The purpose of this section is to provide SMD contractors and users with moisture, reflow, graded according to IEC 60749-20. Standard method for the handling, packaging, transportation and use of solder-sensitive SMDs. These methods are provided to avoid the absorption of moisture and violence Damage caused by exposure to high temperatures at reflow, which can result in reduced yield and reliability. Through the application of these programs, Safe and non-destructive reflow soldering, the components are packaged in a dry package to provide the life of the package stored in a sealed dry bag from the date of sealing. Two methods of water vapor immersion test, Method A and Method B, are specified in the IEC 60749-20 welding resistance test. Method A, is on false It is specified under the premise that the relative humidity in the moisture-proof bag is less than 30%. Method B is based on the assumption that the contractor's exposure time (MET) does not exceed 24h, and the relative humidity in the moisture-proof bag is less than 10%. In the actual operating environment, the SMDs using Method A allow The absorbed moisture reaches 30% RH, and the SMDs using Method B allow the absorption of moisture to reach 10% RH. This section specifies the above test Operating conditions of SMDs under conditions. Note. The hermetically sealed SMD is not a moisture sensitive device and does not require moisture protection.2 Normative referencesThe following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article. Pieces. For undated references, the latest edition (including all amendments) applies to this document. IEC 60749-20 - Mechanical and climatic test methods for semiconductor devices - Part 20 Thermal combined effects (Semiconductordevices-Mechanical and climatictestmethods-Part 20. Resistanceof PlasticencapsulatedSMDstothecombinedeffectofmoistureandsolderingheat) Semiconductors - Mechanical and climatic test methods - Part 30. s Pre-test pretreatment (Semiconductordevices-Mechanical and climatictestmethods-Part 30. Precondition- Ingofnon-hermeticsurfacemountdevicespriortoreliabilitytesting)3 Terms and definitionsThe following terms and definitions apply to this document. 3.1 Active desiccant activedesiccant A fresh (new) desiccant, or a desiccant that returns to its original characteristics after baking as recommended by the manufacturer. 3.2 Barcode label barcodelabel A code consisting of parallel bars and spaces that provide a label of certain information, each code having a specific width. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 4937.201-2018_English be delivered?Answer: Upon your order, we will start to translate GB/T 4937.201-2018_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 4937.201-2018_English with my colleagues?Answer: Yes. 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