GB/T 42975-2023 English PDF

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GB/T 42975-2023: Semiconductor integrated circuits - Test method of driver device
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Basic data

Standard ID: GB/T 42975-2023 (GB/T42975-2023)
Description (Translated English): Semiconductor integrated circuits - Test method of driver device
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L56
Classification of International Standard: 31.200
Word Count Estimation: 26,256
Date of Issue: 2023-09-07
Date of Implementation: 2024-01-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 42975-2023: Semiconductor integrated circuits - Test method of driver device

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.200 CCSL56 National Standards of People's Republic of China Semiconductor integrated circuit driver test methods Published on 2023-09-07 2024-01-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration Committee

Table of contents

PrefaceⅠ 1 Scope 1 2 Normative reference documents 1 3 Terms and Definitions 1 4 General requirements 1 5 Static parameter test 2 5.1 Input high level voltage (VIH) 2 5.2 Input low level voltage (VIL) 3 5.3 Input clamping voltage (VIK) 3 5.4 Input high level current (IIH) 4 5.5 Input low level current (IIL) 5 5.6 Input impedance (RIN) 6 5.7 Output high-level voltage (VOH) 6 5.8 Output low level voltage (VOL) 7 5.9 Output impedance (ROUT) 8 5.10 Output leakage current (ILK) 9 5.11 Output short circuit current (IOS) 10 5.12 Peak current (IPK) 10 5.13 Differential output voltage (VOD) 12 5.14 Differential output voltage change (ΔVOD) 14 5.15 Common mode output voltage (VOS) 14 5.16 Common mode output voltage change (ΔVOS) 15 5.17 Quiescent current (IDDQ) 15 6 Dynamic Parameter Test 16 6.1 Supply current (IDD) 16 6.2 Output transmission delay time from low level to high level (tPLH) 17 6.3 Output transmission delay time from high level to low level (tPHL) 20 6.4 Output rise time (tr) 20 6.5 Output falling time (tf) 21 6.6 Output Skew (tSK) 21 6.7 Clock Jitter (jADD) 22 6.8 Input capacitance (Ci) and output capacitance (CO) 23

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This document was drafted by. China Electronics Technology Standardization Institute, China Electronics Technology Group Corporation 24th Research Institute, Anhui Dahua Semiconductor Technology Co., Ltd., China Electronics Technology Group Corporation Thirteenth Research Institute, Guangdong Zhongshaoxuan Standardization Technology Research Institute Co., Ltd. Department, China Electronics Technology Group Corporation 58th Research Institute, China Aerospace Science and Technology Corporation Ninth Research Institute 771st Research Institute, Chengdu Zhenxin Technology Co., Ltd. The main drafters of this document. Liu Fang, Zhou Jun, Yang Xiaoqiang, Zong Lei, Liu Fan, Huo Yuzhu, Lin Yupan, Lu Jian, Liang Xi, and Wang Huiying. Semiconductor integrated circuit driver test methods

1 Scope

This document specifies the basic principles and test procedures of electrical characteristics testing methods for semiconductor integrated circuit drivers (hereinafter referred to as devices). This document applies to 74/54 series drivers, bus drivers, PIN switch drivers, Darlington drivers, clock drivers, Electrical performance testing of drivers manufactured by various semiconductor processes such as LVDS drivers, MOSFET drivers and differential drivers. other Use as a reference for testing specific drives.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document. GB/T 9178-1988 Integrated circuit terminology GB/T 17574-1998 Semiconductor devices integrated circuits Part 2.Digital integrated circuits

3 Terms and definitions

The terms and definitions defined in GB/T 9178-1988 apply to this document.

4 General requirements

4.1 Test environment conditions Unless otherwise specified, the electrical test ambient temperature is 25 3-5℃; the ambient air pressure is 86kPa~106kPa. If the ambient humidity affects the test Response should be specified in relevant documents. 4.2 Test matters During the test, the following requirements are met. a) If there is no special instructions, the range of ambient or reference point temperature deviation from the specified value shall comply with the provisions of the device detailed specifications; b) External interference should not affect the test accuracy, and the test error caused by the test equipment should comply with the provisions of the device detailed specifications; c) The power supply voltage applied to the device under test should be within ±1% of the specified value, and the accuracy of other electrical parameters applied to the device under test should comply with Comply with the provisions of device-related documents; d) When the device under test is connected or disconnected from the test system, the service limit conditions of the device should not be exceeded; e) Device damage caused by electrostatic discharge should be avoided; f) Whether the non-tested input terminals and output terminals are left unconnected shall comply with the provisions of relevant documents. 4.3 Related documents The relevant documents in this document refer to the driver-related product detailed specifications, product manuals and other technical documents. ......

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