GB/T 42973-2023 English PDF

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GB/T 42973-2023: Semiconductor integrated circuits - Digital-analog(DA) converter
Status: Valid

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Basic data

Standard ID: GB/T 42973-2023 (GB/T42973-2023)
Description (Translated English): Semiconductor integrated circuits - Digital-analog(DA) converter
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L56
Classification of International Standard: 31.200
Word Count Estimation: 34,322
Date of Issue: 2023-09-07
Date of Implementation: 2024-01-01
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 42973-2023: Semiconductor integrated circuits - Digital-analog(DA) converter

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.200 CCSL56 National Standards of People's Republic of China Semiconductor integrated circuit Digital to analog (DA) converter Published on 2023-09-07 2024-01-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration Committee

Table of contents

PrefaceⅠ 1 Scope 1 2 Normative reference documents 1 3 Terms and Definitions 2 4 Category 2 4.1 Overview 2 4.2 Nyquist Rate DA Converter 2 4.3 Oversampling DA converter 2 5 Technical requirements 3 5.1 Temperature 3 5.2 Electrical Characteristics 3 5.3 Packaging characteristics 4 5.4 Other indicators 4 6 Electrical Characteristics Test Method 4 6.1 General instructions 4 6.2 Static characteristics 5 6.3 Dynamic characteristics 14 7 Inspection Rules 25 7.1 General requirements 25 7.2 Inspection classification 25 7.3 Quality Assessment Category 25 7.4 Sampling plan 25 7.5 Inspection lot composition 26 7.6 Appraisal and inspection 26 7.7 Quality consistency inspection 26 7.8 Screening 29 8 flag 30 9 Packaging, transportation and storage30 9.1 Packaging30 9.2 Transport30 9.3 Storage30

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents. This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This document was drafted by. China Electronics Technology Standardization Institute, Chengdu Huawei Electronics Technology Co., Ltd., Chengdu Zhenxin Technology Co., Ltd. Co., Ltd., the 58th Research Institute of China Electronics Technology Group Corporation, the 24th Research Institute of China Electronics Technology Group Corporation, Sichuan Yi Shengxinke Information Technology Co., Ltd., Beijing Xinkejian Technology Co., Ltd., Institute of Semiconductors, Chinese Academy of Sciences, Sanqi (Huizhou) Electronic Technology Co., Ltd., Hangzhou Van High-tech Co., Ltd. The main drafters of this document. Li Kun, Zhang Chi, Li Dagang, Wang Huiying, Zhang Tao, Lei Langcheng, Liu Xianjun, Zhong Mingchen, Li Wenchang, Li Hailong, Lin Ling, Sui Chunjuan. Semiconductor integrated circuit Digital to analog (DA) converter

1 Scope

This document specifies the classification, technical requirements, test methods, and Inspection rules, marking, packaging, transportation and storage. This document applies to DA converters designed and manufactured using semiconductor integrated circuit technology.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document. GB/T 4589.1-2006 Semiconductor devices Part 10.General specifications for discrete devices and integrated circuits GB/T 4937.3-2012 Mechanical and climatic test methods for semiconductor devices Part 3.External visual inspection GB/T 4937.4-2012 Mechanical and climatic test methods for semiconductor devices Part 4.Strongly accelerated steady-state damp heat test (HAST) GB/T 4937.11-2018 Mechanical and climatic test methods for semiconductor devices Part 11.Rapid temperature change double liquid bath method GB/T 4937.13-2018 Mechanical and climatic test methods for semiconductor devices Part 13.Salt spray GB/T 4937.14-2018 Mechanical and climatic test methods for semiconductor devices Part 14.Terminal strength (leads are secure sex) GB/T 4937.15-2018 Mechanical and climatic test methods for semiconductor devices Part 15.Solder resistance of through-hole mounting devices Receive heat GB/T 4937.21-2018 Mechanical and climatic test methods for semiconductor devices Part 21.Solderability GB/T 4937.23 Mechanical and climatic test methods for semiconductor devices Part 23.High temperature operating life GB/T 4937.26 Mechanical and climatic test methods for semiconductor devices Part 26.Electrostatic discharge (ESD) sensitivity test Human Body Model (HBM) GB/T 4937.27 Mechanical and climatic test methods for semiconductor devices Part 27.Electrostatic discharge (ESD) sensitivity test Machine Model(MM) GB/T 9178 Integrated circuit terminology GB/T 12750 Semiconductor device integrated circuits Part 11.Specifications for semiconductor integrated circuits (excluding hybrid circuits) SJ/T 10147 Integrated circuit anti-static packaging tube SJ/T 11587 Technical requirements for anti-static packaging of electronic devices IEC 60749-8.2002 Mechanical and climatic test methods for semiconductor devices Part 8.Sealing (Semiconductor IEC 60749-9.2017 Mechanical and climatic test methods for semiconductor devices Part 9.Marking durability (Semiconductor IEC 60749-24.2004 Mechanical and climatic test methods for semiconductor devices Part 24.Steady-state damp heat (Semiconductor ......

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