GB/T 29845-2013 English PDF

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GB/T 29845-2013: Guide for final assembly, packaging, transportation, unpacking, and relocation of semiconductor manufacturing equipment
Status: Valid

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 29845-2013	259	Add to Cart	3 days	Guide for final assembly, packaging, transportation, unpacking, and relocation of semiconductor manufacturing equipment	Valid

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Basic data

Standard ID: GB/T 29845-2013 (GB/T29845-2013)
Description (Translated English): Guide for final assembly, packaging, transportation, unpacking, and relocation of semiconductor manufacturing equipment
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L95
Classification of International Standard: 31.550
Word Count Estimation: 11,157
Quoted Standard: GB/T 25915.1; SEMI C41; SEMI F63
Regulation (derived from): National Standards Bulletin No. 22 of 2013
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This standard specifies: Semiconductor manufacturing equipment (SME) in supplier factories final assembly (assembly), packaging, transportation and clean room production areas in the customer specific things to do, such as unpacking and placement. This st

GB/T 29845-2013: Guide for final assembly, packaging, transportation, unpacking, and relocation of semiconductor manufacturing equipment

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Guide for final assembly, packaging, transportation, unpacking, and relocation of semiconductor manufacturing equipment ICS 31.550 L95 National Standards of People's Republic of China Final assembly of semiconductor manufacturing equipment, packaging, transportation, Unpacking and placement guidelines Guideforfinalassembly, packaging, transportation, unpacking, and Issued on. 2013-11-12 2014-04-15 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Table of Contents

Preface Ⅰ 1 Scope 1 2 Normative references 1 3 Abbreviations 1 4 Cleaning and Packaging Materials 1 5 assembly and pre-packaged program 2 6 triple-wrapped 2 7 3 Packager 8 boxing program 3 9 packaging and fixing procedures 4 10 monitoring equipment installer 5 Marking and labeling 11 5 12 Packing List 6 13 Transport 6 14 unloading, unpacking and handling 6 Check 7 15

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. This standard by the National Standardization Technical Committee of semiconductor equipment and materials (SAC/TC203) and focal points. This standard was drafted. the Ministry of Industry and Information Technology and the Institute of Electronics Industry Standardization, Beijing Sevenstar Electronics Co., Ltd. The main drafters of this standard. Huang Yinghua, Liu Jun, Wu Liangjun, Zhong Hua, Zhou Li group Fengya Bin. Final assembly of semiconductor manufacturing equipment, packaging, transportation, Unpacking and placement guidelines

1 Scope

This standard gives the semiconductor manufacturing equipment (SME) in the final assembly suppliers' factories (assembly), packaging, transportation and customer Jie Unpacking and placement cleanroom production areas and other specific activities guide. This standard applies to semiconductor manufacturing equipment, components and parts in the independent final assembly suppliers' factories (assembly), packaging and transport to And from the customer on the loading dock/reception area to the high purity and ultrahigh-purity applications cleanroom production area of \u200b\u200bthe transfer process. This standard does not contain specific requirements relating to the environment, health and safety (EHS), does not apply to the wafer or wafer particle mass (such as Ion pollution) associated with the process specification.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 25915.1 cleanroom and associated controlled environments - Part 1. air cleanliness level SEMIC41 2- propanol specifications and guidelines (SpecificationandGuidelinesfor2-propanol) SEMIF63 semiconductor processing with ultrapure water guide (GuidelinesforUltrapureWaterUsedinSemiconductor processing)

3 Abbreviations

The following abbreviations apply to this document. APA. American Engineered Wood Association (theengineeredwoodassociation) EPS. expandable polystyrene (expandedpolystyrene) IPA. isopropanol (isopropylalcohol) SME. Semiconductor Manufacturing Equipment (semiconductormanufacturingequipment) UPW. ultrapure water (ultrapurewater)

4 Cleaning and Packaging Materials

For cleaning and triple packaging, it is recommended to use the following materials. --- UPW (see SEMIF63); --- IPA (see SEMIC41); --- With extremely low particle generation, low ion release levels, polyester materials, GB/T 25915.1 in ISO Class 5 Cleanroom Allow the swab and wipes with sealed edges; --- With extremely low particle generation, low ion release level, no hydrocarbons of about 150μm thick polyethylene natural film; --- Having a tape of ultra-low particle generation. ......

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