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GB/T 19922-2005 English PDF

US$259.00 · In stock
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GB/T 19922-2005: Standard test methods for measuring site flatness on silicon wafers by noncontact scanning
Status: Valid
Standard IDUSDBUY PDFLead-DaysStandard Title (Description)Status
GB/T 19922-2005259 Add to Cart 3 days Standard test methods for measuring site flatness on silicon wafers by noncontact scanning Valid

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Basic data

Standard ID: GB/T 19922-2005 (GB/T19922-2005)
Description (Translated English): Standard test methods for measuring site flatness on silicon wafers by noncontact scanning
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: H17
Classification of International Standard: 77.040.01
Word Count Estimation: 10,111
Date of Issue: 2005-09-19
Date of Implementation: 2006-04-01
Adopted Standard: ASTM F1530-1994, MOD
Regulation (derived from): Announcement of Newly Approved National Standards No. 12 of 2005 (No. 86 overall)
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People Republic of China, China National Standardization Administration Committee
Summary: This standard specifies the capacitive displacement sensing method for the determination of local flatness of the wafer surface method. This standard applies to non-contact, non-destructive measurement of dry, clean the surface of the semiconductor wafer local flatness. For more than 100mm in diameter and thickness of 250��m and above corrosion, polished and epitaxial wafers.
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