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GB/T 14140-2025 English PDF

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Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version GB/T 14140-2025 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically.

US$209.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email.
GB/T 14140-2025: Test method for measuring diameter of semiconductor wafer
Status: Valid

GB/T 14140: Historical versions

Standard ID	USD	BUY PDF	Lead-Days	Standard Title (Description)	Status
GB/T 14140-2025	209	Add to Cart	3 days	Test method for measuring diameter of semiconductor wafer	Valid
GB/T 14140-2009	229	Add to Cart	3 days	Test method for measuring diameter of semiconductor wafer	Valid
GB/T 14140.1-1993	199	Add to Cart	2 days	Silicon slices and wafers--Measuring of diameter--Optical projecting method	Obsolete
GB/T 14140-1993	RFQ	ASK	3 days	Test method for measuring diameter of semiconductor wafer	Obsolete

Basic data

Standard ID: GB/T 14140-2025 (GB/T14140-2025)
Description (Translated English): Test method for measuring diameter of semiconductor wafer
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: H17
Classification of International Standard: 77.040
Word Count Estimation: 10,187
Date of Issue: 2025-08-01
Date of Implementation: 2026-02-01
Older Standard (superseded by this standard): GB/T 14140-2009, GB/T 30866-2014
Issuing agency(ies): State Administration for Market Regulation, Standardization Administration of China

GB/T 14140-2025: Test method for measuring diameter of semiconductor wafer

---This is an excerpt. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.), auto-downloaded/delivered in 9 seconds, can be purchased online: https://www.ChineseStandard.net/PDF.aspx/GBT14140-2025
ICS 77.040 CCSH17 National Standard of the People's Republic of China Replaces GB/T 14140-2009, GB/T 30866-2014 Semiconductor wafer diameter test method Released on August 1, 2025 Implementation on February 1, 2026 State Administration for Market Regulation The National Standardization Administration issued

Preface

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents" Drafting. This document replaces GB/T 14140-2009 “Measurement method for diameter of silicon wafers” and GB/T 30866-2014 “Measurement method for diameter of silicon carbide single crystal wafers”. This document is based on GB/T 14140-2009 and integrates the contents of GB/T 30866-2014. Compared with.2009, in addition to structural adjustments and editorial changes, the main technical changes are as follows. a) The optical projection method (see Method 1 of GB/T 14140-2009) has been deleted; b) The scope has been changed (see Chapter 1, Chapter 1 and Chapter 13 of GB/T 14140-2009); c) The terms and definitions have been changed (see Chapter 3 and Chapter 15 of GB/T 14140-2009); d) Added the profilometer method (see Chapter 4); e) The principle of the micrometer method has been changed (see 5.1, Chapter 16 of GB/T 14140-2009); f) Added the interference factor of micrometer screw deformation during micrometer testing (see 5.2.5); g) The diameter test position of the micrometer method has been changed (see 5.6.1, 20.2 of GB/T 14140-2009); h) The precision of the micrometer method has been changed (see 5.8, Chapter 23 of GB/T 14140-2009); i) The test report for the micrometer method has been modified (see 5.9, Chapter 24 of GB/T 14140-2009); j) Added the vernier caliper method (see Chapter 6). Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents. This document was jointly issued by the National Technical Committee on Semiconductor Equipment and Materials Standardization (SAC/TC203) and the National Technical Committee on Semiconductor Equipment and Materials Standardization (SAC/TC203). It is jointly proposed and coordinated by the Materials Technical Committee of the Chemical Engineering Technical Committee (SAC/TC203/SC2). This document was drafted by. Maxik Electronic Materials Co., Ltd., Nonferrous Metals Technology and Economic Research Institute Co., Ltd., Shandong Yanais Semiconductor Materials Co., Ltd., Hangzhou Zhongxin Wafer Semiconductor Co., Ltd., Zhejiang Haina Semiconductor Co., Ltd., Zhejiang Jinruihong Technology Co., Ltd., Shanghai Xinsheng Semiconductor Technology Co., Ltd., Huzhou Dongni Semiconductor Technology Co., Ltd., Zhejiang Jingsheng Machinery Co., Ltd., Guangdong Tianyu Semiconductor Co., Ltd., Guangdong Pioneer Microelectronics Technology Co., Ltd., Qingdao Huaxin Jingdian Technology Co., Ltd. Co., Ltd., Shenzhen Dexin Microelectronics Co., Ltd., Zhejiang Caizi Technology Co., Ltd., Henan Huifeng Diamond Co., Ltd., Hangzhou Langxun Technology Technology Co., Ltd., Hangzhou Xinyun Semiconductor Group Co., Ltd. The main drafters of this document are. Tian Suxia, Chen Weiqun, Li Suqing, Zhang Liang, Shao Qi, Guo Ke, Zhu Xiaotong, Wang Jianghua, Rao Weixing, Zhang Haiying, Feng Tian, Yan Yang, Cao Jianwei, Liu Wei, Xiao Yanqing, Feng Liming, Wang Minghua, Wang Zhiqiang, Xu Zhen, Li Zhikai, and Ding Shengfeng. The previous versions of this document and the documents it replaces are as follows. --- First published in.1993 as GB/T 14140.1-1993 and GB/T 14140.2-1993; --- Merged into GB/T 14140-2009 during the first revision in.2009; --- This is the second revision and incorporates the content of GB/T 30866-2014 "Test method for diameter of silicon carbide single crystal wafers". Semiconductor wafer diameter test method

1 Scope

This document describes methods for measuring the diameter of semiconductor wafers using the profilometer, micrometer, and vernier caliper methods. This document is applicable to the test of the diameter of circular semiconductor wafers, and the test range is the nominal diameter not exceeding 300mm. Used to test the out-of-roundness of the wafer.

2 Normative references

The contents of the following documents constitute the essential clauses of this document through normative references in this document. For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to This document. GB/T 14264 Terminology of Semiconductor Materials

3 Terms and Definitions

The terms and definitions defined in GB/T 14264 apply to this document.

4 Profilometer method

4.1 Principles of the Method Place the wafer to be measured on a flat, clean suction cup or wafer edge clamping device and move it between two opposite probes along the specified pattern. The probe scans the surface of the wafer and shines on the test points and the incision position on the edge of the wafer to obtain the data of each point on the edge of the straight line passing through the center point. The diameter of the wafer is obtained by calculating the distances between a series of paired edge points. 4.2 Interference Factors 4.2.1 Wafer cleanliness may interfere with the scanning results and affect the test results. 4.2.2 Wafer edge ripples or unevenness may affect the test results. 4.2.3 Inaccurate equipment calibration will introduce deviations in test results. 4.2.4 The positioning accuracy of the equipment will affect the test location, thereby affecting the location of the sampling point, which may lead to erroneous test results. 4.2.5 Different parameter settings of the test equipment will affect the test results. 4.3 Test conditions The test should be carried out in the following environment. a) Temperature. 23°C ± 5°C. b) Relative humidity. (50±20)%. 4.4 Instruments and Equipment 4.4.1 The edge profile tester shall include the following components. ......

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Tips & Frequently Asked Questions:

Question 1: How long will the true-PDF of GB/T 14140-2025_English be delivered?

Answer: Upon your order, we will start to translate GB/T 14140-2025_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time.

Question 2: Can I share the purchased PDF of GB/T 14140-2025_English with my colleagues?

Answer: Yes. The purchased PDF of GB/T 14140-2025_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.

Question 3: Does the price include tax/VAT?

Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countries

Question 4: Do you accept my currency other than USD?

Answer: Yes. If you need your currency to be printed on the invoice, please write an email to Sales@ChineseStandard.net. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.

Question 5: Should I purchase the latest version GB/T 14140-2025?

Answer: Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version GB/T 14140-2025 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically.