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GB/T 14620-2013 English PDF

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GB/T 14620-2013: Alumina ceramic substrates for thin film integrated circuits
Status: Valid

GB/T 14620: Historical versions

Standard IDUSDBUY PDFLead-DaysStandard Title (Description)Status
GB/T 14620-2013329 Add to Cart 3 days Alumina ceramic substrates for thin film integrated circuits Valid
GB/T 14620-1993279 Add to Cart 3 days Alumina ceramic substrates for thin film integratedcircuits Obsolete

Similar standards

GB/T 11446.7   GB/T 11446.6   GB/T 11446.8   GB/T 31379.1   GB/T 29847   GB/T 14619   

Basic data

Standard ID: GB/T 14620-2013 (GB/T14620-2013)
Description (Translated English): Alumina ceramic substrates for thin film integrated circuits
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L90
Classification of International Standard: 31.030
Word Count Estimation: 14,134
Older Standard (superseded by this standard): GB/T 14620-1993
Quoted Standard: GB/T 1958; GB/T 2413; GB/T 2828.1; GB/T 2829; GB/T 5593; GB/T 5594.3; GB/T 5594.4; GB/T 5594.5; GB/T 5594.7; GB/T 5598; GB/T 6062; GB/T 6900; GB/T 9531.1; GB/T 14619-2013; GB/T 16534-2009; GJB 548B-2005; GJB 1201.1-1991
Regulation (derived from): National Standards Bulletin No. 22 of 2013
Issuing agency(ies): General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary: This standard specifies: thin film integrated circuit with alumina ceramic substrates requirements, test methods, inspection rules, marking, packaging, transport and storage. This standard applies to: thin film integrated circuit with an alumina ceramic s

GB/T 14620-2013: Alumina ceramic substrates for thin film integrated circuits

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Alumina ceramic substrates for thin film integrated circuits ICS 31.030 L90 National Standards of People's Republic of China Replacing GB/T 14620-1993 Thin film integrated circuit with an alumina ceramic substrate Issued on. 2013-11-12 2014-04-15 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. This standard replaces GB/T 14620-1993 "thin film integrated with an alumina ceramic substrate," compared with the GB/T 14620-1993, The main changes are as follows. --- Increasing the terms and product identification (see Chapters 3 and 4); --- Increasing the nominal aluminum oxide content can not be less than the actual content of the request (see 4.3); --- Refine the indicators likely to impact on the substrate dimensions before and after the dash (see 5.2.2); --- Increase the straightness of the substrate requirements (see Table 2); --- Distinguish sintering and polishing a substrate (see Tables 1 and 5); --- Test substrate warpage will be described in detail (see Appendix A). The standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China. The standard by the China Electronics Standardization Institute. This standard was drafted. China Electronics Standardization Institute. Drafters of this standard. Cao Yi, T.. The standard standard replaces the previous editions. --- GB/T 14620-1993. Thin film integrated circuit with an alumina ceramic substrate

1 Scope

This standard specifies the thin film integrated alumina ceramic substrate requirements, test methods, inspection rules, marking, packaging, transport and Storage. This standard applies to the thin film integrated circuit with an alumina ceramic substrate (hereinafter referred to as "substrate") production and procurement, the use of thin-film technology Chip components alumina ceramic substrate can also refer to use.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 1958 Geometrical Product Specifications (GPS) shape and position tolerance testing requirements GB/T 2413 piezoelectric ceramic material bulk density measurement method GB/T 2828.1 Sampling procedures for inspection - Part 1. by acceptance quality limit (AQL) retrieval batch inspection sampling plan GB/T 2829 Periodic inspection Sampling procedures and sample forms (for checking the stability of the production process) GB/T 5593 structure ceramic electronic components GB/T 5594.3 Electronic Component structure ceramic average linear expansion coefficient Test Method Test Method GB/T 5594.4 electronic structure ceramic components testing methods dielectric loss tangent of the test method GB/T 5594.5 electronic structure ceramic components volume resistivity test methods Test Method GB/T 5594.7 electronic structure ceramic components liquid permeability test method Test Method GB/T 5598 beryllium oxide ceramic thermal conductivity measurement method GB/T 6062 Geometrical product specifications (GPS) Surface texture Profile method of contact (stylus) instruments nominal characteristics GB/T 6900 LAS Chemical analysis of refractories GB/T 9531.1 electronic ceramic parts technical conditions GB/T 14619-2013 thick film integrated with an alumina ceramic substrate GB/T 16534-2009 Test method for hardness of fine ceramics at room temperature GJB548B-2005 test methods and procedures for microelectronics GJB1201.1-1991 solid material high-temperature thermal diffusivity testing methods laser flash method

3 Terms and Definitions

Terms and definitions GB/T 14619-2013 defined apply to this document.

4 logo and designation

4.1 General Substrates of five groups underlined symbols (letters or numbers) identifies, among the set of numbers separated by hyphens, identified examples are as follows.
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